公开(公告)号：DE102004015597A1

公开(公告)日：2005-11-03

申请号：DE102004015597

申请日：2004-03-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  HEDLER HARRY ,  IRSIGLER ROLAND ,  WOLTER ANDREAS

IPC: H01L23/24 ,  H01L23/29 ,  H01L23/48 ,  H01L23/498

Abstract: Semiconductor system comprises a substrate (10) with a contact pad (11) which is connected by conductors (12) to connectors, e.g. solder beads (13). The system is encapsulated (14) on at least five sides and a mechanical decoupling system (15) is mounted between the encapsulation and the semiconductor. An independent claim is included for a method for making the semiconductor system.

公开(公告)号：DE10345395A1

公开(公告)日：2005-05-04

申请号：DE10345395

申请日：2003-09-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  IRSIGLER ROLAND

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/50 ,  H01L27/108

公开(公告)号：DE10319538A1

公开(公告)日：2004-11-25

申请号：DE10319538

申请日：2003-04-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： IRSIGLER ROLAND ,  HEDLER HARRY ,  MEYER THORSTEN

IPC: H01L23/48 ,  H01L25/065 ,  H01L23/50 ,  H01L21/60

Abstract: A semiconductor device has a semiconductor substrate, at least a first and second rewiring device on a first surface of the semiconductor substrate for the provision of an electrical contact-connection of the semiconductor substrate, and a tapering, continuous opening from a first surface to a second, opposite surface of the semiconductor substrate. At least a third and fourth rewiring device is disposed on the second surface of the semiconductor substrate and a patterned metallization on the side areas of the opening for the separate contact-connection of the first and at least the second rewiring device.

公开(公告)号：DE10156386A1

公开(公告)日：2003-06-05

申请号：DE10156386

申请日：2001-11-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： IRSIGLER ROLAND ,  HEDLER HARRY ,  VASQUEZ BARBARA

IPC: H01L23/04 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/485

Abstract: A process for producing a semiconductor chip having contact elements protruding on one chip side within the context of wafer level packaging, the chip side provided with the contact elements being coated with a covering compound forming a protective layer, from which the protruding contact element project.

公开(公告)号：DE102005056569A1

公开(公告)日：2007-06-06

申请号：DE102005056569

申请日：2005-11-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： IRSIGLER ROLAND ,  HEDLER HARRY ,  GOLLER BERND ,  OFNER GERALD

IPC: H01L23/50 ,  H01L23/498

Abstract: An electronic component includes a substrate having contacts and a chip having contacts and a passivation layer disposed on an active side of the chip. The active side of the chip is mounted on a first surface of the substrate by flip chip technology such that the contacts of the chip are electrically connected to the contacts of the substrate by means of connecting elements. Elastic elevations are disposed between the contacts of the chip and the contacts of the substrate and an underfiller is disposed in an intermediate space between the chip and the substrate and between the elastic elevations. The underfiller and the elastic elevations have substantially the same modulus of elasticity.

公开(公告)号：DE102005035393A1

公开(公告)日：2007-02-08

申请号：DE102005035393

申请日：2005-07-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： IRSIGLER ROLAND ,  HEDLER HARRY

IPC: H01L21/60 ,  H01L23/50 ,  H01L25/065

Abstract: The present invention relates to a method and apparatus for producing a chip arrangement. In one embodiment, the method includes providing a first chip having an electrically operable structure, of providing at least one through-via through the first chip, and of arranging at least one bond wire through the through-via in the first chip.

公开(公告)号：DE102004041889B4

公开(公告)日：2006-06-29

申请号：DE102004041889

申请日：2004-08-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： IRSIGLER ROLAND ,  HEDLER HARRY

IPC: H01L23/50 ,  H01L21/60

Abstract: A semiconductor device comprises at least one first semiconductor component being located in a first plane and comprising an active area which has a first contact region and at least one second semiconductor component being located in a second plane and comprising a second active area which has a second contact region. The second semiconductor component is located at a distance vertically to the first semiconductor component and is orientated relative to the first semiconductor component, so that the first active area faces away from the second semiconductor component and the second active area faces away from the first semiconductor component. An adhesive layer is arranged between the first and the second semiconductor components and a frame region adjoins laterally the first semiconductor component and the second semiconductor component on at least one side. The frame region comprises a first surface and a second surface which is located opposite to the second surface. A wiring device is introduced in the frame region and connects the first contact region to the second contact region.

公开(公告)号：DE102004041888A1

公开(公告)日：2006-03-02

申请号：DE102004041888

申请日：2004-08-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  IRSIGLER ROLAND

IPC: H01L21/60 ,  H01L23/50

Abstract: The present invention provides an apparatus having stacked semiconductor components. Two semiconductor components (21, 26) are arranged such that their contact regions (28, 22) are opposite one another. A contact-connection device (29) forms a short electrical connection between the two contact regions (28, 22). The contact regions (28, 22) are connected to external contact regions (36) of the apparatus via a rewiring (23).

公开(公告)号：DE10345377A1

公开(公告)日：2005-05-04

申请号：DE10345377

申请日：2003-09-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： IRSIGLER ROLAND ,  HEDLER HARRY ,  MEYER THORSTEN

IPC: G03F3/08 ,  H01L21/48 ,  H01L23/00 ,  H01L23/02 ,  H01L23/04 ,  H01L23/055 ,  H01L23/32 ,  H01L23/367 ,  H01L23/48 ,  H01L23/49 ,  H01L23/498 ,  H01L23/50

Abstract: The present invention provides a semiconductor module having: at least one semiconductor device (10); a rigid covering device (14) over the at least one semiconductor device (10) for protecting and dissipating heat from the at least one semiconductor device (10); and a carrier device (17), which has a connection device (19), for receiving the semiconductor device (10) and the covering device (14), the at least one semiconductor device (10) being electrically coupled to the connection device (19) by means of a flexible contact device (11) via the carrier device (17) and being mechanically coupled to the covering device (14) via a contact device (15, 16). The present invention likewise provides a method for producing a semiconductor module.

公开(公告)号：DE10345391B3

公开(公告)日：2005-02-17

申请号：DE10345391

申请日：2003-09-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  IRSIGLER ROLAND

IPC: H01L25/18 ,  H01L21/60 ,  H01L21/98 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L21/50

Abstract: Multi-chip module comprises a rewiring arrangement (12) formed as a contact device (13) on the substrate (10) and on at least one contact protrusion (11). The contact device touches a first surface (16') of an encapsulation unit (16). An independent claim is also included for a process for the production of a multi-chip module.