-
公开(公告)号：DE102008047028A1
公开(公告)日：2010-03-25
申请号：DE102008047028
申请日：2008-09-13
Applicant: INFINEON TECHNOLOGIES AG
Inventor： JANSEN UWE , SCHWARZER ULRICH , BAYERER REINHOLD
Abstract: An embodiment of the invention relates to a circuit assembly having the following components: a power transistor with a control terminal, a first load terminal and a second load terminal, the second load terminal having a floating potential; a driver circuit configured to generate control signals for the control terminal of the power transistor, the relevant reference potential for the driver circuit being the floating potential of the second load terminal; a planar metallization layer sited on or in a substrate and comprising a constant reference potential, a shielding plane isolated from the metallization layer, sited planar on or in the substrate such that it is capacitively coupled to the metallization layer; a power supply circuit for providing a supply voltage referenced to the floating potential of the second load terminal for the driver circuit, the power supply circuit comprising, circuited between the second load terminal and the shielding plane, a first series circuit including a first capacitor and a first diode.
-
Patent Agency Ranking
公开(公告)号：DE102012211446A1
公开(公告)日：2014-01-02
申请号：DE102012211446
申请日：2012-07-02
Applicant: INFINEON TECHNOLOGIES AG
Inventor： HOHLFELD OLAF , BOENIG GUIDO , JANSEN UWE
Abstract: Die Erfindung betrifft ein Halbleitermodul (100) mit einem elektrisch leitenden unteres Kontaktstück (31) und einem in einer vertikalen Richtung (v) von diesem beabstandeten, elektrisch leitenden oberen Kontaktstück (32). Weiterhin umfasst das Modul eine Anzahl von N ≥ 1 Halbleiterchips (1), von denen ein jeder einen ersten Lastanschluss (11) und einen zweiten Lastanschluss (12) aufweist und mit seinem zweiten Lastanschluss (12) elektrisch leitend mit dem unteren Kontaktstück (31) verbunden ist. Außerdem ist ein jeder der Halbleiterchips (1) mittels wenigstens eines an seinen ersten Lastanschluss (11) gebondeten Bonddrahtes (4) mit dem oberen Kontaktstück (32) elektrisch leitend verbunden. Zwischen dem ersten Lastanschluss (11) und dem oberen Kontaktstück (32) ist ein Explosionsschutzmittel (62) angeordnet, in das ein jeder der Bonddrähte (4) zumindest teilweise eingebettet ist.
-
13.发明专利
公开(公告)号：DE102008047028B4
公开(公告)日：2011-06-09
申请号：DE102008047028
申请日：2008-09-13
Applicant: INFINEON TECHNOLOGIES AG
Inventor： JANSEN UWE , SCHWARZER ULRICH , BAYERER REINHOLD
-
公开(公告)号：DE102008047395A1
公开(公告)日：2009-07-23
申请号：DE102008047395
申请日：2008-09-16
Applicant: INFINEON TECHNOLOGIES AG
Inventor： KNOTT BERNHARD , HOEGLAUER JOSEF , JANSEN UWE
IPC: H01L27/08 , H01L21/822
-
公开(公告)号：DE102008052029A1
公开(公告)日：2009-06-18
申请号：DE102008052029
申请日：2008-10-16
Applicant: INFINEON TECHNOLOGIES AG
Inventor： JANSEN UWE , SCHULZ MARTIN
Abstract: A semiconductor module comprises at least one semiconductor chip having at least one semiconductor switch. The at least one semiconductor chip is arranged on a carrier substrate. At least one driver component drives the at least one semiconductor switch. The at least one driver component is arranged on a circuit board. The at least one driver component has at least one input for receiving a control signal. The circuit board has a galvanic isolation in a signal path between the at least one driver component and the at least one semiconductor chip.
-
公开(公告)号：DE102006025453A1
公开(公告)日：2007-12-06
申请号：DE102006025453
申请日：2006-05-31
Applicant: INFINEON TECHNOLOGIES AG
Inventor： HIERHOLZER MARTIN , BAGINSKI PATRICK , HORNKAMP MICHAEL , JANSEN UWE
Abstract: A semiconductor circuit arrangement is disclosed. In one embodiment, a semiconductor module is attached to a board using a screw, with a mechanical and electrical contact being made between module contacts on the semiconductor module and associated board contacts on the board at the same time by attachment using the screw.
-
-
-
-
-
Search Results
16
records
(took 0.019 seconds)
