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    15.
    发明专利
    未知

    公开(公告)号：DE10329143B4

    公开(公告)日：2005-09-01

    申请号：DE10329143

    申请日：2003-06-27

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： KERLER RUDOLF ,  EURSKENS WOLFRAM ,  PAPE HEINZ ,  STROBEL PETER ,  STOECKL STEPHAN ,  BAUER MICHAEL

    IPC: H05K1/00 ,  H05K1/18 ,  H05K3/10 ,  H05K3/46 ,  H05K7/02 ,  B23K26/00

    Abstract: Electronic module (25) has a number of components (1-6) mounted on a wiring block (9). The wiring block has a number of outer sides (11-14) and contains internal connection leads (15) that connect external contact surfaces (10) on the outer sides of the block with each other. The contact surfaces connect to the contacts (7) of the components mounted on the block, : Independent claims are also included for the following:- (a) a device for manufacturing an electronic module and; (b) a method for manufacturing an electronic module in which a wiring block is produced by plastic injection molding and then contancts and components added to the raw plastic block.

    16.
    发明专利
    未知

    公开(公告)号：DE10209922A1

    公开(公告)日：2003-10-02

    申请号：DE10209922

    申请日：2002-03-07

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： BAUER MICHAEL ,  EURSKENS WOLFRAM ,  GRUENDLER GEROLD ,  KERLER RUDOLF ,  PAPE HEINZ ,  STROBEL PETER

    IPC: H01L25/065 ,  H01L25/16 ,  H01L25/07 ,  H01L21/283

    Abstract: The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.

    Electronic component used in electronic devices comprises a semiconductor chip arranged on a chip island and embedded in a plastic housing within which bond connections extend
    17.
    发明专利
    Electronic component used in electronic devices comprises a semiconductor chip arranged on a chip island and embedded in a plastic housing within which bond connections extend 未知

    公开(公告)号：DE10147375A1

    公开(公告)日：2003-04-24

    申请号：DE10147375

    申请日：2001-09-26

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： PAPE HEINZ

    IPC: H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L25/10 ,  H01L23/50 ,  H01L21/52 ,  H01L23/053

    Abstract: Electronic component comprises semiconductor chip arranged on a chip island and embedded in a plastic housing. Bond connections extend within housing from contact surfaces to active surface of chip. Bond finger is connected to outer contacts on lower and upper sides of the housing. A part of the outer contacts are arranged over each other on the upper side and the lower side of the housing. Electronic component (1) comprises a semiconductor chip (2) arranged on a chip island (3) and embedded in a plastic housing (4). Bond connections (6) extend within the housing from contact surfaces to the active surface (8) of the chip. The bond finger (9) is electrically connected to outer contacts (10) on the lower side (11) of the housing and to outer contacts (12) on the upper side of the housing. A part of the outer contacts (10, 12) are arranged over each other on the upper side and the lower side of the housing. An Independent claim is also included for a process for the production of an electronic component. Preferred Features: Partial regions of the outer contacts have bond projections (14) formed as bond fingers. The outer contacts form a common contact body with a bond projection. The component is formed on a system support (17) and the thickness of the component corresponds to the thickness of the system support.

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