公开(公告)号：DE10146854B4

公开(公告)日：2009-05-20

申请号：DE10146854

申请日：2001-09-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  AUBURGER ALBERT ,  THEUS HORST ,  STADLER BERND

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/04 ,  H01L23/31

Abstract: The electronic component (2) comprises the semiconductor chip (4) on a metal substrate (6), and a housing (12). There is also a screen (124) against HF electromagnetic radiation, as an integral part of the housing, forming at least one part of the housing wall (122).The screen may comprise a metal, or a non-conductor, or non-conductor with metal plating. The metal substrate may contain a wiring structure (8) round the semiconductor chip(s), whose contact faces (43) are conductively coupled by bonding wires (10) to contact pads (81) of wiring structure. Independent claims are included for mfg. method of the electronic component.

公开(公告)号：DE102006062279A1

公开(公告)日：2008-06-26

申请号：DE102006062279

申请日：2006-12-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GHAHREMANI CYRUS ,  PAULUS STEFAN ,  BETZ BERND ,  DANGELMAIER JOCHEN

IPC: G02B6/42

公开(公告)号：DE102006045271A1

公开(公告)日：2008-03-27

申请号：DE102006045271

申请日：2006-09-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ALTHAUS HANS LUDWIG ,  STAEBER TOBIAS ,  WEIGERT MARTIN ,  WITTL JOSEF ,  PAULUS STEFAN

IPC: H01L31/02 ,  G02B6/42 ,  G02B27/09 ,  H01L33/58 ,  H04B10/40

Abstract: The optical sending and receiving module (1) has an optoelectronic element (3), a prefabricated plastic housing (2), and electrical contacts that are integrated into a base part (25), which has partly flat surface and is open at the top side. A receiving device (7) with an optical fiber (10) is integrated into a cover element (6) for the plastic housing. The optical element is positioned in the plastic housing in such a manner that the light received from the optical element is sent or linked into the optical fiber inserted into the receiving device. An independent claim is also included for a method for the production an optical sending and receiving module.

公开(公告)号：DE502004000545D1

公开(公告)日：2006-06-14

申请号：DE502004000545

申请日：2004-02-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  PETZ MARTIN

IPC: H01L23/047 ,  H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L23/498 ,  H01L25/065

Abstract: An electronic device, including a radiofrequency power module, includes a cavity housing including a housing frame with plastic walls and with a metal frame including a top side and a rear side, a metallic housing bottom including at least one chip island, and at least one semiconductor chip. Each semiconductor chip is arranged on each chip island and includes a top side and a rear side. The plastic walls of the cavity housing are connected to the metal frame in a positively locking manner with anchoring elements, and the housing bottom is connected to the rear side of the metal frame in a thermostable manner with a solder joint.

公开(公告)号：DE10144464C2

公开(公告)日：2003-07-17

申请号：DE10144464

申请日：2001-09-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  AUBURGER ALBERT ,  PAULUS STEFAN ,  STADLER BERND

IPC: H01F17/00 ,  H01F27/29 ,  H01L27/08

公开(公告)号：DE10144467A1

公开(公告)日：2003-04-10

申请号：DE10144467

申请日：2001-09-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  AUBURGER ALBERT ,  PAULUS STEFAN ,  STADLER BERND

IPC: B81C99/00 ,  G01H1/00 ,  G01L9/00 ,  H01L23/50 ,  H01L21/60

公开(公告)号：DE10031204A1

公开(公告)日：2002-01-17

申请号：DE10031204

申请日：2000-06-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/485 ,  H01L23/50 ,  H01L21/60

Abstract: The invention relates to a system support (5) for semiconductor chips (1) and electronic components (2) which are produced on said system support (5). The system support (5) has a base substrate (11) on which outer contact elements (6) are located. These outer contact elements have a cross-section (7) in the form of a rivet with a rivet head area (8), a rivet shaft area (9) and a rivet foot area (10). This ensures that the outer contact elements (6) are securely anchored in the housing, which consists of a plastic mass (4).

公开(公告)号：DE10032415A1

公开(公告)日：2001-10-18

申请号：DE10032415

申请日：2000-07-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AUBURGER ALBERT ,  PAULUS STEFAN ,  WINTERER JUERGEN

IPC: B65B9/04 ,  B65B15/04 ,  H05K13/00 ,  H05K13/04 ,  B65B47/00 ,  H05K13/02

Abstract: The device has a belt-shaped bearer body (2) with through openings (5) between its top (3) and bottom (4) of thickness equal to that of the electronic components (1) and the opening dimensions the same as the length and breadth of the components. The components are loosely placed in the openings with their rotation angles limited to 45 degrees about the 3 spatial axes. The belt has covering foils (6,7) over the holes that can be applied and removed laterally for inserting and removing components. Independent claims are also included for the following: a method of manufacturing a device for packaging and transporting electrical parts.

公开(公告)号：DE102006035876A1

公开(公告)日：2008-02-07

申请号：DE102006035876

申请日：2006-08-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： DANGELMAIER JOCHEN ,  MUELLER THOMAS ,  SCHMITT JEAN ,  PAULUS STEFAN

IPC: H01L23/42 ,  H01L21/54

Abstract: The module has electrical conductors (2) with appropriate number of connection pins outside of housing, where the conductors have electrical contact surfaces (2.2) within the housing. A heat conductor (3) has a connection pin outside of the housing and a thermal contact surface (3.2) within the housing. A chip e.g. sensor chip, is connected with one of main surfaces with the surface (3.2) and has electrical connections that are connected with the surfaces (2.2). A layer system contains the layers deposited on the contact surfaces (2.2) and the thermal contact surface (3.2). An independent claim is also included for a method for the production of a chip module.

公开(公告)号：DE50211166D1

公开(公告)日：2007-12-20

申请号：DE50211166

申请日：2002-02-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PETZ MARTIN ,  STADLER BERND ,  PAULUS STEFAN ,  SCHROEDER MARTIN ,  LOSEHAND REINHARD ,  SCHAFFER JOSEF-PAUL

IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/0232 ,  H04N5/225

Abstract: A digital camera has a lens, a camera housing, and a semiconductor sensor. The camera housing is primarily formed of a transparent plastic block that encloses a semiconductor sensor only on its underside and has an adapted lens on its top side. Between the two there is provided an opaque layer with an aperture that improves the image quality. The invention also relates to a method for producing such a digital camera.