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公开(公告)号：US6433280B2
公开(公告)日：2002-08-13
申请号：US82024801
申请日：2001-03-28
Applicant: INFINEON TECHNOLOGIES AG
Inventor： WINTERER JUERGEN , STADLER BERND
CPC classification number: H05K13/0408
Abstract: A handling and mounting protection device is described that has a cap-shaped configuration with a covering layer which covers a contact-sensitive upper side of a component which is to be protected. Extending from the covering layer are locking arms with locking hooks which, in the state in which they are fitted onto the component, engage behind undercuts in the component in such a way that even after the component has been mounted they can still be released from it.
Abstract translation: 描述了一种处理和安装保护装置，其具有盖状构造，其具有覆盖要被保护的部件的接触敏感的上侧的覆盖层。 从覆盖层延伸的是具有锁定钩的锁定臂，其在它们被安装到部件上的状态下以部件中的底切部接合，使得即使在部件安装之后，它们仍然可以从其中释放 。
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公开(公告)号：WO02069618A3
公开(公告)日：2002-10-24
申请号：PCT/DE0200708
申请日：2002-02-28
Applicant: INFINEON TECHNOLOGIES AG , PETZ MARTIN , STADLER BERND , PAULUS STEFAN , SCHROEDER MARTIN , LOSEHAND REINHARD , SCHAFFER JOSEF-PAUL
Inventor： PETZ MARTIN , STADLER BERND , PAULUS STEFAN , SCHROEDER MARTIN , LOSEHAND REINHARD , SCHAFFER JOSEF-PAUL
IPC: H01L31/0203 , H01L31/0232 , H04N5/225 , H01L27/146
CPC classification number: H04N5/2257 , H01L24/97 , H01L27/14618 , H01L27/14623 , H01L27/14625 , H01L27/14683 , H01L31/0203 , H01L31/02325 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H04N5/2254 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
Abstract: The invention relates to a digital camera (1) comprising a lens (2), a camera housing (3) and a semiconductor sensor (9), whereby the camera housing (3) is essentially comprised of a transparent plastic block (44), which encloses, only on its underside, a semiconductor sensor (9) and comprises, on its upper side, an adapted lens (2). A layer, which is situated between the semiconductor sensor and the lens, which is impervious to light, and which has an aperture (14), improves the image quality. The invention also relates to a method for producing a digital camera of the aforementioned type.
Abstract translation: 本发明涉及一种数码相机（1）与透镜（2），一个摄像机壳体（3）和半导体传感器（9），其中所述摄像机壳（3）基本上由一个透明的塑料块（44），其中仅在其下侧 包括半导体传感器（9）和在其上侧的适配透镜（2），而具有孔（14）的不透明层之间改进了图像质量。 此外，本发明涉及一种用于制造这样的数字照相机的方法。
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公开(公告)号：DE102008007682B4
公开(公告)日：2014-05-28
申请号：DE102008007682
申请日：2008-02-06
Applicant: INFINEON TECHNOLOGIES AG
Inventor： THEUSS HORST , DANGELMAIER JOCHEN , KRAUSE JENS , AUBURGER ALBERT , STADLER BERND
Abstract: Modul, umfassend: ein Substrat mit einer wannenförmigen Vertiefung; und ein mikro-elektromechanisches Mikrofon, welches in der wannenförmigen Vertiefung des Substrats montiert ist, dadurch gekennzeichnet, dass das Substrat ein durch Vergießen hergestelltes Kunststoffteil umfasst und an seiner Oberfläche zumindest teilweise mit einer Metallschicht versehen ist, wobei die Metallschicht dazu dient, ein von dem mikro-elektromechanischem Mikrofon stammendes oder davon abgeleitetes elektrisches Signal entlang der Oberfläche des Substrats aus der wannenförmigen Vertiefung des Substrats herauszuführen.
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公开(公告)号：DE102009019029A1
公开(公告)日：2009-12-31
申请号：DE102009019029
申请日：2009-04-27
Applicant: INFINEON TECHNOLOGIES AG
Inventor： THEUSS HORST , STADLER BERND
Abstract: A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane.
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公开(公告)号：DE10144467B4
公开(公告)日：2006-07-27
申请号：DE10144467
申请日：2001-09-10
Applicant: INFINEON TECHNOLOGIES AG
Inventor： THEUS HORST , AUBURGER ALBERT , PAULUS STEFAN , STADLER BERND
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Patent Agency Ranking
公开(公告)号：DE10235332A1
公开(公告)日：2004-02-19
申请号：DE10235332
申请日：2002-08-01
Applicant: INFINEON TECHNOLOGIES AG
Inventor： PAULUS STEFAN , STADLER BERND , WEBER MICHAEL , THEUS HORST , DANGELMAIER JOCHEN , DAECHE FRANK
IPC: H01L21/48 , H01L23/055 , H01L23/31 , H01L23/498 , H01L23/538 , H01L27/146 , H01L31/0203 , H05K1/11 , H05K3/20 , H05K3/46 , H01L23/50 , H05K1/18
Abstract: Multiple layer switch support (1) comprises a semiconductor chip (2) and/or a discrete component (3), a rewiring layer (5) having a rewiring structure (4), an insulating layer (7) with through-structures (6), and outer contact surfaces (8) arranged on the lower side (9) of the switch support as outer contact layer. Multiple layer switch support (1) comprises a semiconductor chip (2) and/or a discrete component (3), a rewiring layer (5) having a rewiring structure (4), an insulating layer (7) with through-structures (6), and outer contact surfaces (8) arranged on the lower side (9) of the switch support as outer contact layer. An anchoring layer (12) is arranged between the rewiring layer and the insulating layer and contains metallic plates (13) for fixing the through-structures in the switch support. The outer contact surfaces and the metallic plates are electrically connected to the rewiring structure. Independent claims are also included for processes for the production of the switch support.
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公开(公告)号：DE102009019029B4
公开(公告)日：2012-09-27
申请号：DE102009019029
申请日：2009-04-27
Applicant: INFINEON TECHNOLOGIES AG
Inventor： THEUSS HORST , STADLER BERND
Abstract: Verfahren zur Herstellung eines Sensormoduls (600), mit den Schritten: – Bereitstellen einer Kappe, deren Peripherie einen Kragen (610) definiert, auf dessen Endfläche ein Lötmaterial aufgebracht ist; – Bereitstellen eines als Mikrophon-Chip ausgebildeten ersten Halbleiterchips (620), welcher eine erste Hauptoberfläche und eine gegenüberliegende zweite Hauptoberfläche aufweist, wobei der erste Halbleiterchip auf der ersten Hauptoberfläche erste Verbindungselemente (620.1) aufweist; und – Anbringen des ersten Halbleiterchips (620) mit der zweiten Hauptoberfläche auf den Boden der Kappe derart, dass die ersten Verbindungselemente (620.1) und die Endfläche des Kragens (610) eine gemeinsame Ebene definieren.
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公开(公告)号：DE19707503B4
公开(公告)日：2007-01-04
申请号：DE19707503
申请日：1997-02-25
Applicant: INFINEON TECHNOLOGIES AG
Inventor： WINTERER JUERGEN , BOOTZ ERIC , STADLER BERND , NEU ACHIM , JANCZEK THIES
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公开(公告)号：DE10201000A1
公开(公告)日：2003-07-31
申请号：DE10201000
申请日：2002-01-11
Applicant: INFINEON TECHNOLOGIES AG
Inventor： STADLER BERND
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公开(公告)号：DE10144464A1
公开(公告)日：2003-04-10
申请号：DE10144464
申请日：2001-09-10
Applicant: INFINEON TECHNOLOGIES AG
Inventor： THEUS HORST , AUBURGER ALBERT , PAULUS STEFAN , STADLER BERND
Abstract: Electronic component comprises an induction coil (2); and a flat plastic housing (3) having an upper side (4) and a lower side (5). The coil is arranged on the upper side. The lower side has external contact surfaces (6) for a flat assembly. Electronic component comprises an induction coil (2); and a flat plastic housing (3) having an upper side (4) and a lower side (5). The coil is arranged on the upper side. The lower side has external contact surfaces (6) for a flat assembly. Electrically connecting through-contacts (7) are arranged through the housing between electrodes (8, 9) of the coil on the upper side and the external contacts on the lower side. An Independent claim is also included for a process for the production of the electronic component. Preferred Features: The through-contacts have galvanically deposited metallic columns which are surrounded by a plastic housing composition (11) on the casing surfaces (12) of the columns. The through-contacts are made from nickel, gold, silver, aluminum or their alloys. The plastic housing is applied using an injection molding process.
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