公开(公告)号：DE102005027766A1

公开(公告)日：2006-12-28

申请号：DE102005027766

申请日：2005-06-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  DANGELMAIER JOCHEN

IPC: G01R33/02 ,  G01P3/488

Abstract: The sensor component (1) has a magnet (2), a sensor semiconductor chip (3) which measures the magnetic field. The sensor semiconductor chip has active contact surface (13) on its top side and it is arranged on the upper side of the magnet. It has external electrical connections which are accessible from the outside of the sensor component. Internal connection element (5) by external connection (6) is electrically connected with the contact surface of the sensor semiconductor chips. The internal connection element has a continuous conductor on the surface of the magnet. An independent claim is also included for the method for production of sensor component.

公开(公告)号：DE10256116A1

公开(公告)日：2004-07-08

申请号：DE10256116

申请日：2002-11-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  WEBER MICHAEL ,  MECKES ANDREAS

IPC: B81B3/00 ,  B81C1/00 ,  H01L23/50 ,  B81C5/00 ,  B81B1/00

Abstract: The method involves producing an active area (5) in the positions of semiconductor chips on an active top side (4) of the wafer, and applying contact surfaces (6) outside the active area. A sacrificial layer comprising insulating material is applied to the active area, leaving openings in the sacrificial layer at the edges of the active area. A conductive material is applied, the sacrificial layer removed, and a plastics layer applied before applying external contacts and separating the wafer into individual electronic devices. Independent claims are included for an electronic device; and a semiconductor wafer.

公开(公告)号：DE10144464A1

公开(公告)日：2003-04-10

申请号：DE10144464

申请日：2001-09-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  AUBURGER ALBERT ,  PAULUS STEFAN ,  STADLER BERND

IPC: H01F17/00 ,  H01F27/29 ,  H01L27/08

Abstract: Electronic component comprises an induction coil (2); and a flat plastic housing (3) having an upper side (4) and a lower side (5). The coil is arranged on the upper side. The lower side has external contact surfaces (6) for a flat assembly. Electronic component comprises an induction coil (2); and a flat plastic housing (3) having an upper side (4) and a lower side (5). The coil is arranged on the upper side. The lower side has external contact surfaces (6) for a flat assembly. Electrically connecting through-contacts (7) are arranged through the housing between electrodes (8, 9) of the coil on the upper side and the external contacts on the lower side. An Independent claim is also included for a process for the production of the electronic component. Preferred Features: The through-contacts have galvanically deposited metallic columns which are surrounded by a plastic housing composition (11) on the casing surfaces (12) of the columns. The through-contacts are made from nickel, gold, silver, aluminum or their alloys. The plastic housing is applied using an injection molding process.

公开(公告)号：DE102005027767A1

公开(公告)日：2006-12-28

申请号：DE102005027767

申请日：2005-06-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  DANGELMAIER JOCHEN ,  AUBURGER ALBERT ,  GOTTLIEB ALFRED ,  SCHINDLER UWE ,  PETZ MARTIN

IPC: G01R33/06 ,  G01P3/488

Abstract: The component has a sensor semiconductor chip (3) measuring magnetic field strength, and including contact surfaces (13) on its active upper side. The contact surfaces are electrically connected with flat conductors (6) by flip chip contacts. A magnet (2) is attached to the flat conductors and the chip is arranged on the upper side of the magnet. A mold compound surrounds the chip, the magnet and parts of the conductors and has a common border with the chip. A soft-magnetic homogenization disk (12) is attached between the chip and the magnet. An independent claim is also included for a method of manufacturing a sensor component for measuring a magnetic field intensity.

公开(公告)号：DE10144467B4

公开(公告)日：2006-07-27

申请号：DE10144467

申请日：2001-09-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  AUBURGER ALBERT ,  PAULUS STEFAN ,  STADLER BERND

IPC: H01L23/50 ,  B81B3/00 ,  B81C99/00 ,  G01H1/00 ,  G01L9/00 ,  H01L21/60

公开(公告)号：DE10235332A1

公开(公告)日：2004-02-19

申请号：DE10235332

申请日：2002-08-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  STADLER BERND ,  WEBER MICHAEL ,  THEUS HORST ,  DANGELMAIER JOCHEN ,  DAECHE FRANK

IPC: H01L21/48 ,  H01L23/055 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L27/146 ,  H01L31/0203 ,  H05K1/11 ,  H05K3/20 ,  H05K3/46 ,  H01L23/50 ,  H05K1/18

Abstract: Multiple layer switch support (1) comprises a semiconductor chip (2) and/or a discrete component (3), a rewiring layer (5) having a rewiring structure (4), an insulating layer (7) with through-structures (6), and outer contact surfaces (8) arranged on the lower side (9) of the switch support as outer contact layer. Multiple layer switch support (1) comprises a semiconductor chip (2) and/or a discrete component (3), a rewiring layer (5) having a rewiring structure (4), an insulating layer (7) with through-structures (6), and outer contact surfaces (8) arranged on the lower side (9) of the switch support as outer contact layer. An anchoring layer (12) is arranged between the rewiring layer and the insulating layer and contains metallic plates (13) for fixing the through-structures in the switch support. The outer contact surfaces and the metallic plates are electrically connected to the rewiring structure. Independent claims are also included for processes for the production of the switch support.

公开(公告)号：DE102007008518A1

公开(公告)日：2008-08-28

申请号：DE102007008518

申请日：2007-02-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  STADLER BERND

IPC: B81B7/02 ,  B81C3/00

Abstract: The module (100) has a carrier (13) and a semiconductor chip (10) attached to the carrier. The semiconductor chip has a movable unit (11) e.g. acceleration sensor, and an active main surface (14) of the chip is turned towards the carrier. Another semiconductor chip (12) is attached at the chip (10), where a cavity (15) is formed between the chips. Another cavity (16) is formed between the chip (10) and the carrier. A diaphragm is arranged in an area of the active main surface of the chip (10), and a microphone is integrated into the chip (10). An independent claim is also included for a method for manufacturing a semiconductor module.

公开(公告)号：DE10228593A1

公开(公告)日：2004-01-15

申请号：DE10228593

申请日：2002-06-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  STEINER RAINER

IPC: H01L21/56 ,  H01L23/055 ,  H01L23/31 ,  H01L23/485 ,  H01L25/065 ,  H01L25/16 ,  H05K1/18 ,  H01L23/50 ,  G01N27/403 ,  H04R23/00

公开(公告)号：DE10201781A1

公开(公告)日：2003-08-07

申请号：DE10201781

申请日：2002-01-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  AUBURGER ALBERT ,  KLOSE FRANK ,  LEHNER RUDOLF

IPC: H01L21/60 ,  H01L23/367 ,  H01L23/433 ,  H01L23/66 ,  H01L23/36 ,  H01L23/50 ,  H01L23/64 ,  H01L21/50

Abstract: A radio-frequency power component and a radio-frequency power module, as well as to methods for producing them are encompassed. The radio-frequency power component has a semiconductor chip that is suitable for flip chip mounting. The semiconductor chip has an active upper face that produces power losses. This active upper face is covered by an electrically isolating layer leaving free contact surfaces, with a heat-dissipating metal layer being applied to its upper face. The metal layer directly dissipates the heat losses from the active semiconductor structures.

公开(公告)号：DE10146854A1

公开(公告)日：2003-04-30

申请号：DE10146854

申请日：2001-09-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  AUBURGER ALBERT ,  THEUS HORST ,  STADLER BERND

IPC: H01L21/48 ,  H01L21/68 ,  H01L23/31 ,  H01L23/552 ,  H01L21/60 ,  H01L21/50

Abstract: The electronic component (2) comprises the semiconductor chip (4) on a metal substrate (6), and a housing (12). There is also a screen (124) against HF electromagnetic radiation, as an integral part of the housing, forming at least one part of the housing wall (122).The screen may comprise a metal, or a non-conductor, or non-conductor with metal plating. The metal substrate may contain a wiring structure (8) round the semiconductor chip(s), whose contact faces (43) are conductively coupled by bonding wires (10) to contact pads (81) of wiring structure. Independent claims are included for mfg. method of the electronic component.