-
公开(公告)号:DE50310011D1
公开(公告)日:2008-07-31
申请号:DE50310011
申请日:2003-09-13
Applicant: INFINEON TECHNOLOGIES AG
Inventor: HOFMANN FRANZ , LEHMANN VOLKER , RISCH LOTHAR , ROESNER WOLFGANG , SPECHT MICHAEL
IPC: H01L21/8242 , H01L21/02 , H01L21/334 , H01L21/84 , H01L27/108 , H01L27/12 , H01L29/94
Abstract: Semiconductor substrate comprises a carrier substrate (1), a semiconductor component layer (3), an insulating layer (2) arranged between the carrier substrate and the semiconductor component layer, recesses (P) formed in a surface facing the insulating layer in the carrier substrate, a dielectric layer (D) formed on the surface of the recesses and carrier substrate, and an electrically conducting layer (E2) formed in the recesses to produce capacitor electrodes. A further electrically conducting layer is formed in the carrier substrate to form capacitor counter electrodes in the region of the recesses. An Independent claim is also included for a process for the production of a semiconductor substrate.
-
公开(公告)号:DE102005012661A1
公开(公告)日:2006-10-05
申请号:DE102005012661
申请日:2005-03-18
Applicant: INFINEON TECHNOLOGIES AG
Inventor: HARTWICH JESSICA , DREESKORNFELD LARS , RISCH LOTHAR
IPC: H01L27/12 , H01L21/336 , H01L21/84 , H01L29/78
Abstract: The device has a mesa structure adjacent to a substrate boundary surface (14) on an electrical insulating layer. A mesa insulation area (22) that is adjacent to the surface is adjoined to the structure over a mesa boundary surface and includes a gate contact area. An electrically conductive gate is adjoined to a channel and stands in electrically conductive connection with the gate contact area in a contact position. The mesa structure and the mesa insulation area are completely enclosed in the direction parallel to the substrate boundary surface. The channel that is adjacent to the electrical insulating layer is formed in the mesa structure. The mesa insulation area is adjoined to an auxiliary structure (24) that is adjacent to the substrate boundary surface, over an auxiliary structure boundary surface. An independent claim is also included for a method of manufacturing a semiconductor device.
-
公开(公告)号:DE10320239B4
公开(公告)日:2006-06-01
申请号:DE10320239
申请日:2003-05-07
Applicant: INFINEON TECHNOLOGIES AG
Inventor: LUVKEN JOHANNES , HOFMANN FRANZ , RISCH LOTHAR , ROESNER WOLFGANG , SPECHT MICHAEL , SCHLOESSER TILL , MANGER DIRK
IPC: H01L27/108 , H01L21/8238 , H01L21/8242
Abstract: A DRAM memory cell comprises a select transistor (200) on a semiconductor substrate with source/ drain electrodes (201,202), a channel layer (203), an isolated gate electrode, a memory capacitor (100) with two electrodes, one connected to the source/drain and a rear substrate electrode. The gate electrode surrounds opposite sides of the channel. An independent claim is also included for a production process for the above DRAM.
-
公开(公告)号:DE59813243D1
公开(公告)日:2006-01-05
申请号:DE59813243
申请日:1998-09-04
Applicant: INFINEON TECHNOLOGIES AG
Inventor: RISCH LOTHAR , ROESNER WOLFGANG , RAMCKE TIES , JACOBS HERMANN
IPC: G11C17/10 , H01L21/822 , H01L21/8246 , H01L27/10 , H01L27/112
Abstract: Resistors are connected between word lines and bit lines running transversely with respect thereto. The resistors have a higher resistance than the word lines and the bit lines. The bit lines are each connected to a sense amplifier which regulates the potential on the respective bit line to a reference potential and at which an output signal can be picked off. If one of the word lines is selected and all the other word lines are put at reference potential, then the resistance of the resistor, which is assigned to an information item, can be read from the output signal.
-
公开(公告)号:DE50007390D1
公开(公告)日:2004-09-16
申请号:DE50007390
申请日:2000-05-26
Applicant: INFINEON TECHNOLOGIES AG
Inventor: ROESNER WOLFGANG , SCHULZ THOMAS , RISCH LOTHAR
IPC: H01L29/417 , H01L21/20 , H01L21/336 , H01L29/786
Abstract: A double gate MOSFET transistor and a method for fabricating it are described. In this case, a semiconductor layer structure of a transistor channel to be formed is embedded in a spacer material and contact-connected by source and drain regions which are filled into depressions that are etched on opposite sides of the semiconductor layer structure. Afterwards, the spacer material is etched out selectively and replaced by the electrically conductive gate electrode material.
-
公开(公告)号:DE59706533D1
公开(公告)日:2002-04-11
申请号:DE59706533
申请日:1997-05-02
Applicant: INFINEON TECHNOLOGIES AG
Inventor: RISCH LOTHAR , ROESNER WOLFGANG
Abstract: Each memory cell of an array has a single-electron transistor and a single-electron memory element. The single-electron transistor is driven by a charge stored in the memory element. When a read voltage is applied, a current flows through the single-electron transistor which is dependent on the stored charge, but the stored charge in not changed. When a write voltage is applied, the magnitude of which is greater than the read voltage, then the stored charge is changed. The memory cells of the array are each connected between first lines and transverse second lines of a memory cell configuration.
-
公开(公告)号:DE59706513D1
公开(公告)日:2002-04-04
申请号:DE59706513
申请日:1997-07-28
Applicant: INFINEON TECHNOLOGIES AG
Inventor: ROESNER WOLFGANG , RISCH LOTHAR , HOFMANN FRANZ , STENGL REINHARD
IPC: H01L21/8242 , H01L27/108
-
公开(公告)号:AT214194T
公开(公告)日:2002-03-15
申请号:AT97107314
申请日:1997-05-02
Applicant: INFINEON TECHNOLOGIES AG
Inventor: RISCH LOTHAR , ROESNER WOLFGANG
Abstract: Each memory cell of an array has a single-electron transistor and a single-electron memory element. The single-electron transistor is driven by a charge stored in the memory element. When a read voltage is applied, a current flows through the single-electron transistor which is dependent on the stored charge, but the stored charge in not changed. When a write voltage is applied, the magnitude of which is greater than the read voltage, then the stored charge is changed. The memory cells of the array are each connected between first lines and transverse second lines of a memory cell configuration.
-
公开(公告)号:DE19950362C1
公开(公告)日:2001-06-07
申请号:DE19950362
申请日:1999-10-19
Applicant: INFINEON TECHNOLOGIES AG
Inventor: ROESNER WOLFGANG , SCHULZ THOMAS , RISCH LOTHAR , HOFMANN FRANZ
IPC: H01L21/8242 , H01L27/108 , H01L27/12 , G11C11/401
Abstract: The DRAM arrangement has several memory cells, each with storage (S) and transfer (T) transistors. A transfer transistor gate electrode is connected to a word line (W). The storage transistor has a floating gate electrode separated from a channel region by a first dielectric and connected to a source/drain region of the transfer transistor. The storage transistor has a control gate electrode separated from the floating gate electrode by a second dielectric and connected to the word line. A first source/drain region of the storage transistor is connected to a bit line (B) running transversely wrt. the word line.
-
公开(公告)号:DE19935823A1
公开(公告)日:2001-03-01
申请号:DE19935823
申请日:1999-07-29
Applicant: INFINEON TECHNOLOGIES AG
Inventor: ROESNER WOLFGANG , RISCH LOTHAR
Abstract: Electro-optical microelectronic arrangement containing electronic components and light-emitting components connected together comprises a metallizing plane on an integrated semiconductor circuit system (20). Electrodes (22, 23) for light-emitting components based on semiconducting organic materials are formed in this plane. A layer of semiconducting organic material (21) is provided on the metallizing plane. An Independent claim is also included for a process for the production of the electro-optical microelectronic arrangement comprising applying a metallizing plane on an integrated semiconductor circuit system to form contacts in the plane, applying a semiconducting organic material on the plane and structuring. Preferred Features: The integrated semiconductor circuit system is a system based on polysilicon or amorphous silicon on a glass support. The semiconducting organic material is a conjugated polymer or oligomer.
-
-
-
-
-
-
-
-
-