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    11.
    发明专利
    未知

    公开(公告)号：NO20073803L

    公开(公告)日：2007-10-17

    申请号：NO20073803

    申请日：2007-07-20

    Applicant: KIONIX INC

    Inventor： ADAMS SCOTT G ,  MILLER SCOTT A ,  SHEN-EPSTEIN JUNE ,  EPSTEIN KEITH

    IPC: G01P15/125 ,  G01P15/18

    Abstract: In an embodiment of the present invention there is provided a micro-electromechanical (MEMS) accelerometer, including a substrate, a first sensor and a second sensor. The first sensor is configured to measure an acceleration along a first axis parallel to a plane of the substrate. The second sensor is configured to measure an acceleration along an axis perpendicular to the plane of the substrate. The second sensor comprises a first beam, a second beam and a single support structure. The single support structure supports the first and second beams relative to the substrate, wherein the first and second beams circumscribe the first sensor.

    SINGLE MOTOR DYNAMIC CALIBRATION UNIT
    12.
    发明申请
    SINGLE MOTOR DYNAMIC CALIBRATION UNIT 审中-公开
    单电机动态校准单元

    公开(公告)号：WO2014137367A3

    公开(公告)日：2015-06-25

    申请号：PCT/US2013042886

    申请日：2013-05-28

    Applicant: KIONIX INC

    Inventor： STIRLING NATHAN L ,  DEWALT LUKE E ,  STRAIT JAMES E ,  ADAMS SCOTT G

    IPC: G01C25/00

    CPC classification number: B81C99/005

    Abstract: A calibration unit, system, and method for calibrating a device under test are provided. The calibration unit, system, and method use a single axis rotational unit to calibrate devices under test on a test head. The single axis rotation unit is configured to extend at an angle from a known axis. The test head can be designed in the shape of a frustum with, multiple sides. The calibration unit, system, and method can use combinations of gravitational excitation, Helmholtz coil excitation, and rotational rate excitation for calibrating the device under test. The calibration unit, system, and method can calibrate a 3 degree for freedom or higher MEMS devices.

    Abstract translation: 提供了用于校准被测器件的校准单元，系统和方法。 校准单元，系统和方法使用单轴旋转单元在测试头上校准被测设备。 单轴旋转单元构造成从已知轴线以一定角度延伸。 测试头可以设计成具有多边形的截头锥体的形状。 校准单元，系统和方法可以使用重力激励，亥姆霍兹线圈激励和旋转速率激励的组合来校准被测器件。 校准单元，系统和方法可以自由地校准3度或更高的MEMS器件。

    ACCELEROMETER
    13.
    发明申请
    ACCELEROMETER 审中-公开

    公开(公告)号：WO03036305A3

    公开(公告)日：2003-10-16

    申请号：PCT/US0232993

    申请日：2002-10-16

    Applicant: KIONIX INC

    Inventor： ADAMS SCOTT G ,  MILLER SCOTT A ,  JOHNSON WENDY JO H

    IPC: G01P9/04 ,  G01P15/125 ,  G01P15/08 ,  H01L29/00

    CPC classification number: G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0828

    Abstract: An accelerometer (100) comprising a silicon wafer is etched to form a fixed portion (400), a movable portion (300), and a resilient coupling (120) between, the fixed and movable portions generally arranged in the plane of the wafer, the mass of the movable portion being concentrated on one side of the resilient coupling. One of the fixed and moveable portions of the silicon structure includes a first electrode. The other of the fixed and moveable portions includes a second electrode oriented parallel to the axis of acceleration, and an electrically-conductive layer electrically connected as a third electrode coplanar and mechanically coupled with the second electrode. The second and third electrodes are arranged in capacitive opposition to the first electrode, the capacitance between the first electrode and third electrode increasing as the movable portion moves in a direction along the axis of acceleration relative to the fixed portion and decreasing as the movable portion moves in an opposite direction. A resilient coupling retains the first and third electrodes in capacitive opposition to each other across a capacitance gap while allowing motion of the first electrode relative to the second and third electrodes in response to acceleration along an axis of acceleration perpendicular to the plane of the wafer, and resiliently restores the first electrode to an equilibrium position when the acceleration ceases. The second electrode is in opposition to a majority of the surface area of the first electrode when the electrodes are in the equilibrium position. Capacitance between the first and third electrodes is measured to obtain a measurement of acceleration along the axis.

    Abstract translation: 蚀刻包括硅晶片的加速度计（100），以形成固定部分（400），可移动部分（300）以及通常设置在晶片平面中的固定部分和可移动部分之间的弹性联接件（120） 活动部分的质量集中在弹性联轴器的一侧。 硅结构的固定和可移动部分之一包括第一电极。 固定和可移动部分中的另一个包括平行于加速轴定向的第二电极，和作为共面的第三电极电连接并与第二电极机械耦合的导电层。 第二电极和第三电极与第一电极电容地相对配置，第一电极和第三电极之间的电容随着可移动部分沿着加速轴相对于固定部分的方向移动而增加，并且随着可移动部分移动 在相反的方向。 弹性联接器保持第一和第三电极跨过电容间隙彼此电容地相对，同时响应于沿垂直于晶片平面的加速轴的加速度，允许第一电极相对于第二和第三电极的运动， 并且当加速停止时，将第一电极弹性恢复到平衡位置。 当电极处于平衡位置时，第二电极与第一电极的大部分表面区域相对。 测量第一和第三电极之间的电容以获得沿轴的加速度的测量。

    STRENGTHENED MICRO-ELECTROMECHANICAL SYSTEM DEVICES AND METHODS OF MAKING THEREOF
    14.
    发明申请
    STRENGTHENED MICRO-ELECTROMECHANICAL SYSTEM DEVICES AND METHODS OF MAKING THEREOF 审中-公开
    加强型微机电系统装置及其制造方法

    公开(公告)号：WO2012112452A2

    公开(公告)日：2012-08-23

    申请号：PCT/US2012024886

    申请日：2012-02-13

    Applicant: KIONIX INC ,  BLACKMER CHARLES W ,  ADAMS SCOTT G ,  HOCKING ANDREW S ,  LYNCH KRISTIN J ,  SHAH ASHISH A

    Inventor： BLACKMER CHARLES W ,  ADAMS SCOTT G ,  HOCKING ANDREW S ,  LYNCH KRISTIN J ,  SHAH ASHISH A

    IPC: B81B3/00

    CPC classification number: B81C1/00698 ,  B81B2203/0118 ,  B81B2203/033 ,  H01L21/76232

    Abstract: In an embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam, and can have a non-linear shape. In another embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam. The isolation joint can have a first portion, a second portion, and a bridge portion between the first portion and the second portion. The first and second portions of the isolation joint can each have a seam and a void, while the bridge portion can be solid.

    Abstract translation: 在一个实施例中，微机电装置可以包括衬底，梁和隔离接头。 梁可以相对于衬底的表面悬挂。 隔离接头可以在梁的第一部分和第二部分之间，并且可以具有非线性形状。 在另一个实施例中，微机电装置可以包括衬底，梁和隔离接头。 梁可以相对于衬底的表面悬挂。 隔离接头可以位于梁的第一部分和第二部分之间。 隔离接头可以具有第一部分，第二部分以及第一部分和第二部分之间的桥接部分。 隔离接头的第一和第二部分可以各自具有接缝和空隙，而桥接部分可以是实心的。

    MICRO-ELECTROMECHANICAL SYSTEM DEVICES AND METHODS OF MAKING MICRO-ELECTROMECHANICAL SYSTEM DEVICES
    15.
    发明申请
    MICRO-ELECTROMECHANICAL SYSTEM DEVICES AND METHODS OF MAKING MICRO-ELECTROMECHANICAL SYSTEM DEVICES 审中-公开
    微机电系统装置及制造微电子系统装置的方法

    公开(公告)号：WO2012112395A2

    公开(公告)日：2012-08-23

    申请号：PCT/US2012024672

    申请日：2012-02-10

    Applicant: KIONIX INC ,  ADAMS SCOTT G ,  MINNICK ANDREW J ,  BLACKMER CHARLES W ,  BRENNAN KENNETH D ,  DEVOE MOLLIE K

    Inventor： ADAMS SCOTT G ,  MINNICK ANDREW J ,  BLACKMER CHARLES W ,  BRENNAN KENNETH D ,  DEVOE MOLLIE K

    IPC: B81C1/00

    CPC classification number: B81B3/0008 ,  B81B2201/0235 ,  B81B2207/07 ,  G01P15/0802 ,  H01H59/0009 ,  H01L29/747 ,  H01L29/87

    Abstract: A micro-electromechanical system (MEMS) device includes a substrate, a first beam, a second beam, and a third beam. The first beam includes first and second portions separated by an isolation joint. The first and second portions each comprise a semiconductor and a first dielectric layer. An electrically conductive trace is mechanically coupled to the first beam and electrically coupled to the second portion's semiconductor but not the first portion's semiconductor. The second beam includes a second dielectric layer. The profile of each of the first, second, and third beams has been formed by a dry etch. A cavity separates a surface of the substrate from the first, second, and third beams. The cavity has been formed by a dry etch. A side wall of each of the first, second, and third beams has substantially no dielectric layer disposed thereon, and the dielectric layer has been removed by a vapor-phase etch.

    Abstract translation: 微机电系统（MEMS）装置包括基板，第一光束，第二光束和第三光束。 第一梁包括由隔离接头隔开的第一和第二部分。 第一和第二部分各自包括半导体和第一介电层。 导电迹线机械耦合到第一光束并且电耦合到第二部分的半导体，但不耦合到第一部分的半导体。 第二光束包括第二介质层。 通过干蚀刻形成第一，第二和第三光束中的每一个的轮廓。 空腔将衬底的表面与第一，第二和第三光束分离。 通过干蚀刻形成空腔。 第一，第二和第三光束中的每一个的侧壁基本上没有布置在其上的电介质层，并且通过气相蚀刻去除了介电层。

    A TRI-AXIS ACCELEROMETER
    16.
    发明申请
    A TRI-AXIS ACCELEROMETER 审中-公开
    三轴加速度计

    公开(公告)号：WO2007061756A2

    公开(公告)日：2007-05-31

    申请号：PCT/US2006044517

    申请日：2006-11-16

    Applicant: KIONIX INC ,  ADAMS SCOTT G ,  MILLER SCOTT A ,  SHEN-EPSTEIN JUNE ,  EPSTEIN KEITH

    Inventor： ADAMS SCOTT G ,  MILLER SCOTT A ,  SHEN-EPSTEIN JUNE ,  EPSTEIN KEITH

    IPC: G01P15/18 ,  G01P15/125 ,  H01L21/00

    CPC classification number: G01P15/125 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0828

    Abstract: In an embodiment of the present invention there is provided a micro-electromechanical (MEMS) accelerometer, including a substrate, a first sensor and a second sensor. The first sensor is configured to measure an acceleration along a first axis parallel to a plane of the substrate. The second sensor is configured to measure an acceleration along an axis perpendicular to the plane of the substrate. The second sensor comprises a first beam, a second beam and a single support structure. The single support structure supports the first and second beams relative to the substrate, wherein the first and second beams circumscribe the first sensor.

    Abstract translation: 在本发明的一个实施例中，提供了一种微机电（MEMS）加速计，其包括衬底，第一传感器和第二传感器。 第一传感器被配置为测量沿平行于衬底平面的第一轴的加速度。 第二传感器配置为测量沿垂直于基板平面的轴的加速度。 第二传感器包括第一梁，第二梁和单个支撑结构。 单个支撑结构相对于衬底支撑第一和第二梁，其中第一和第二梁包围第一传感器。

    ACCELEROMETER
    18.
    发明公开
    ACCELEROMETER 审中-公开
    BESCHLEUNIGUNGSMESSER

    公开(公告)号：EP1446671A4

    公开(公告)日：2009-02-18

    申请号：EP02789205

    申请日：2002-10-16

    Applicant: KIONIX INC

    Inventor： ADAMS SCOTT G ,  MILLER SCOTT A ,  JOHNSON WENDY JO H

    IPC: G01P9/04 ,  G01P15/125 ,  G01P15/08 ,  H01L29/00

    CPC classification number: G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0828

    Abstract: An accelerometer. A silicon wafer is etched to form a fixed portion, a movable portion, and a resilient coupling between, the fixed and movable portions generally arranged in the plane of the wafer, the mass of the movable portion being concentrated on one side of the resilient coupling. One of the fixed and moveable portions of the silicon structure includes a first electrode. The other of the fixed and moveable portions includes a second electrode oriented parallel to the axis of acceleration, and an electrically-conductive layer electrically connected as a third electrode coplanar and mechanically coupled with the second electrode. The second and third electrodes are arranged in capacitive opposition to the first electrode, the capacitance between the first electrode and third electrode increasing as the movable portion moves in a direction along the axis of acceleration relative to the fixed portion and decreasing as the movable portion moves in an opposite direction. A resilient coupling retains the first and third electrodes in capacitive opposition to each other across a capacitance gap while allowing motion of the first electrode relative to the second and third electrodes in response to acceleration along an axis of acceleration perpendicular to the plane of the wafer, and resiliently restores the first electrode to an equilibrium position when the acceleration ceases. The second electrode is in opposition to a majority of the surface area of the first electrode when the electrodes are in the equilibrium position. Capacitance between the first and third electrodes is measured to obtain a measurement of acceleration along the axis.

    Abstract translation: 加速度计。 蚀刻硅晶片以形成固定部分，可移动部分以及通常布置在晶片的平面内的固定部分和可移动部分之间的弹性耦合，可移动部分的质量集中在弹性耦合件的一侧上 。 硅结构的固定部分和可移动部分之一包括第一电极。 固定部分和可移动部分中的另一个包括平行于加速轴取向的第二电极和作为与第二电极机械耦合的共面的第三电极电连接的导电层。 第二电极和第三电极与第一电极电容性地相对设置，第一电极与第三电极之间的电容随着可移动部分相对于固定部分沿着加速度轴线的方向移动而增加并且随着可移动部分移动而减小 在相反的方向。 弹性联接器保持第一和第三电极跨越电容间隙彼此电容性地相反，同时响应于沿着垂直于晶片平面的加速轴的加速度允许第一电极相对于第二和第三电极的运动， 并且在加速停止时将第一电极弹性恢复到平衡位置。 当电极处于平衡位置时，第二电极与第一电极的大部分表面区域相对。 测量第一和第三电极之间的电容以获得沿轴的加速度的测量结果。

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