公开(公告)号：WO2006012174A2

公开(公告)日：2006-02-02

申请号：PCT/US2005022172

申请日：2005-06-23

Applicant: LAM RES CORP ,  KOROLIK MIKHAIL ,  BOYD JOHN M ,  MIKHAYLICH KATRINA ,  RAVKIN MICHAEL ,  REDEKER FRED C ,  DE LARIOS JOHN M

Inventor： KOROLIK MIKHAIL ,  BOYD JOHN M ,  MIKHAYLICH KATRINA ,  RAVKIN MICHAEL ,  REDEKER FRED C ,  DE LARIOS JOHN M

IPC: H01L21/3065

CPC classification number: H01L21/31133 ,  H01L21/6708

Abstract: One embodiment provides a method of processing a substrate. The method includes applying a solution to a surface of a substrate. At least one reacting species has been produced by dissociation of the solution by applying energy such as a light to the solution. A first material on the substrate is reacted and removing the reacted first material. A system for processing a substrate is also described.

Abstract translation: 一个实施例提供了一种处理衬底的方法。 该方法包括将溶液施加到基底的表面。 至少一种反应物质是通过将溶液中的光等能量进行解离来解离的。 将基板上的第一材料反应并除去反应的第一材料。 还描述了一种用于处理衬底的系统。

公开(公告)号：WO2004032160A3

公开(公告)日：2004-06-24

申请号：PCT/US0330718

申请日：2003-09-29

Applicant: LAM RES CORP

Inventor： WOODS CARL A ,  GARCIA JAMES P ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  REDEKER FRED C

IPC: H01L25/00 ,  B08B1/02 ,  B08B3/04 ,  H01L21/00

CPC classification number: B08B3/04 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  Y10S134/902

Abstract: A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.

Abstract translation: 将弯月面从第一表面移动到第二表面的系统和方法包括在头部和第一表面之间形成弯月面。 弯月面可以从第一表面移动到相邻的第二表面，相邻的第二表面平行于第一表面。 移动弯月面的系统和方法也可以用于沿着衬底的边缘移动弯月面。

公开(公告)号：JP2010236090A

公开(公告)日：2010-10-21

申请号：JP2010071654

申请日：2010-03-26

Applicant: Lam Res Corp ,  ラム リサーチ コーポレーションLam Research Corporation

Inventor： RAVKIN MIKE ,  BOYD JOHN ,  DORDI YEZDI N ,  REDEKER FRED C ,  DE LARIOS JOHN M

IPC: C25D5/04 ,  C25D5/02 ,  C25D5/22 ,  C25D7/12 ,  C25D17/12 ,  C25D21/00 ,  H01L21/00 ,  H01L21/28 ,  H01L21/288 ,  H01L21/3205

CPC classification number: C25D17/10 ,  C25D5/026 ,  C25D5/22 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and technique for more effectively depositing a thin film by using localized deposition and permitting localized planarization, in particular, relating to the deposition and planarization of a semiconductor wafer.
SOLUTION: An electroplating apparatus 100 for depositing a metal layer 108 on the surface of the wafer 104 is provided. In one embodiment, a proximity head 102 which can be charged as an anode is placed in close proximity to the surface of the wafer 104. A plating fluid 116 is provided between the wafer 104 and the proximity head 102 to form a localized metal plating part 108.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于通过使用局部沉积更有效地沉积薄膜并允许局部平坦化的装置和技术，特别是涉及半导体晶片的沉积和平坦化。 解决方案：提供一种用于在晶片104的表面上沉积金属层108的电镀设备100。 在一个实施例中，可以充电为阳极的接近头部102被放置成紧邻晶片104的表面。电镀液116设置在晶片104和接近头部102之间，以形成局部金属电镀部分 108.版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2007208246A

公开(公告)日：2007-08-16

申请号：JP2006353539

申请日：2006-12-28

Applicant: Lam Res Corp ,  ラム リサーチ コーポレーションLam Research Corporation

Inventor： FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C

IPC: H01L21/304 ,  C11D1/04 ,  C11D3/02 ,  C11D3/04

CPC classification number: H01L21/02052 ,  B08B3/04 ,  B08B7/00 ,  C11D11/0047 ,  C11D17/0013 ,  C11D17/0017 ,  G03F1/82 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/67051

Abstract: PROBLEM TO BE SOLVED: To provide a cleaning agent for cleaning the surface of a wafer which is more efficient and has weak polishing effect, and to provide a method thereof.
SOLUTION: A method of executing cleaning with a three-phase body 110 is disclosed. A substrate 112 on which particles 102 are deposited on its surface is prepared. The three-phase body provided with a solid portion 108, a liquid portion 106 and a gas portion 104 is generated. A force F is applied to the three-phase body and an interaction between the solid portion and the particles is promoted. The three-phase body is removed from the surface of the substrate together with the particles. The particles are removed together with the three-phase body by the interaction between the solid portion and the particles.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于清洁晶片表面的清洁剂，其更有效并且具有较弱的抛光效果，并提供其方法。 公开了一种用三相体110进行清洗的方法。 制备其表面上沉积有颗粒102的基板112。 产生具有固体部分108，液体部分106和气体部分104的三相体。 力F施加到三相体上，促进了固体部分和颗粒之间的相互作用。 三相体与颗粒一起从衬底的表面去除。 颗粒通过固体部分和颗粒之间的相互作用与三相体一起被去除。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：WO2007078975A3

公开(公告)日：2008-08-28

申请号：PCT/US2006048706

申请日：2006-12-19

Applicant: LAM RES CORP ,  KOROLIK MIKHAIL ,  FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MIKE ,  REDEKER FRED

Inventor： KOROLIK MIKHAIL ,  FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MIKE ,  REDEKER FRED

IPC: C09G1/00 ,  C09G1/02

CPC classification number: C11D11/0047 ,  B08B7/02 ,  C11D1/146 ,  C11D3/2079 ,  C11D9/02 ,  C11D17/0013 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/31133 ,  H01L21/6708 ,  H01L21/67086

Abstract: Cleaning compounds, apparatus, and methods to remove contaminants from a substrate surface are provided. An exemplary cleaning compound to remove particulate contaminants from a semiconductor substrate surface is provided. The cleaning compound includes a viscous liquid with a viscosity between about 1 cP to about 10,000 cP. The cleaning compound also includes a plurality of solid components dispersed in the viscous liquid, the plurality of. solid components interact with the particulate contaminants on the substrate surface to remove the particulate contaminants from the substrate surface.

Abstract translation: 提供了清除化合物，设备和从基材表面除去污染物的方法。 提供了从半导体衬底表面去除颗粒污染物的示例性清洁化合物。 清洁化合物包括粘度在约1cP至约10,000cP之间的粘性液体。 清洁化合物还包括分散在粘稠液体中的多个固体成分，多个。 固体组分与基底表面上的颗粒污染物相互作用以从基底表面去除颗粒污染物。

公开(公告)号：WO2007078642A3

公开(公告)日：2007-12-27

申请号：PCT/US2006047119

申请日：2006-12-08

Applicant: LAM RES CORP ,  FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C ,  THOMAS CLINT ,  PARKS JOHN

Inventor： FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C ,  THOMAS CLINT ,  PARKS JOHN

IPC: B08B7/00

CPC classification number: H01L21/02057 ,  B05D3/10 ,  B08B7/02 ,  C11D1/04 ,  C11D3/042 ,  C11D3/044 ,  C11D3/18 ,  C11D3/2079 ,  C11D3/222 ,  C11D3/225 ,  C11D3/3765 ,  C11D9/00 ,  C11D9/02 ,  C11D9/267 ,  C11D11/0047 ,  C11D17/0004 ,  C11D17/0013 ,  C11D17/0017 ,  C11D17/003 ,  C11D17/041 ,  C23G1/00 ,  C23G1/18 ,  G03F7/42 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/02096 ,  H01L21/31133 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708 ,  H01L21/67086

Abstract: A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate.

Abstract translation: 清洁材料设置在基板上。 清洁材料包括分散在液体介质内的固体组分。 对液体介质内的固体组分施加力以使固体组分接近衬底上存在的污染物。 施加到固体组分上的力可以由液体介质内的不混溶组分施加。 当固体组分充分接近污染物时，在固体组分和污染物之间建立相互作用。 然后，将固体组分移离基底，使得从基底去除与固体组分相互作用的污染物。

公开(公告)号：WO2007079036A2

公开(公告)日：2007-07-12

申请号：PCT/US2006049109

申请日：2006-12-21

Applicant: LAM RES CORP ,  FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C

Inventor： FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C

IPC: B08B3/00

CPC classification number: B08B7/00 ,  B08B3/00 ,  B08B7/02 ,  C11D9/02 ,  C11D11/0047 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/31133 ,  H01L21/67028 ,  H01L21/6708 ,  H01L21/67086

Abstract: A method for cleaning a substrate is provided. The method initiates with disposing a fluid layer having solid components therein to a surface of the substrate. A shear force directed substantially parallel to the surface of the substrate and toward an outer edge of the substrate is then created. The shear force may result from a normal or tangential component of a force applied to a solid body in contact with the fluid layer in one embodiment. The surface of the substrate is rinsed to remove the fluid layer. A cleaning system and apparatus are also provided.

Abstract translation: 提供一种清洗基板的方法。 该方法通过将其中具有固体组分的流体层设置在基底的表面来启动。 然后产生基本上平行于衬底的表面并朝向衬底的外边缘的剪切力。 在一个实施例中，剪切力可以由施加到与流体层接触的固体的力的正常或切向分量产生。 漂洗基材的表面以除去流体层。 还提供清洁系统和装置。

公开(公告)号：WO2005006424A8

公开(公告)日：2005-05-19

申请号：PCT/US2004018610

申请日：2004-06-10

Applicant: LAM RES CORP ,  DE LARIOS JOHN M

Inventor： DE LARIOS JOHN M

IPC: G03F7/42 ,  H01L21/00 ,  H01L21/306 ,  H01L21/311

CPC classification number: H01L21/31133 ,  G03F7/423 ,  H01L21/6708 ,  H01L21/67086

Abstract: A system and method for removing a layer from a substrate surface is provided. The method includes providing at least one encapsulating transport, where the encapsulating transport contains at least some reactive gas. At least one encapsulating transport is applied to the layer, and the layer is a chemically reactive layer. The encapsulating transport ruptures on the chemically reactive layer and releases the reactive gas in combination with a reaction inducing agent onto the chemically reactive layer to facilitate removal of the layer from the substrate surface. The at least one encapsulating transport is a bubble or a foam.

Abstract translation: 提供了用于从衬底表面去除层的系统和方法。 该方法包括提供至少一个封装输送装置，其中封装输送装置包含至少一些反应气体。 至少一个封装传输被施加到该层，并且该层是化学反应层。 封装传输在化学反应层上破裂并且将反应气体与反应诱导剂结合释放到化学反应层上以促进从基底表面去除层。 至少一个封装输送器是气泡或泡沫。

公开(公告)号：WO2004030052A2

公开(公告)日：2004-04-08

申请号：PCT/US0331136

申请日：2003-09-30

Applicant: LAM RES CORP

Inventor： DE LARIOS JOHN M ,  GARCIA JAMES P ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

IPC: H01L21/00

CPC classification number: H01L21/67051 ,  H01L21/67028 ,  H01L21/67034

Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.

Abstract translation: 提供了衬底制备系统的许多实施例之一，其包括具有头表面的头部，其中头部表面靠近衬底的表面。 该系统还包括用于通过头部将第一流体输送至基底表面的第一导管以及用于通过头部将第二流体输送至基底表面的第二导管，其中第二流体不同于第一流体 流体。 该系统还包括第三管道，用于从第一管道，第二管道和第三管道基本同时起作用的衬底表面去除第一流体和第二流体中的每一个。 在替代实施例中，提供了一种用于处理基板的方法，其包括在基板的表面上产生流体弯月面并且将声能施加到流体弯月面。 该方法还包括将流体弯月面移动到衬底的表面上以处理衬底的表面。

公开(公告)号：JP2010216015A

公开(公告)日：2010-09-30

申请号：JP2010066565

申请日：2010-03-23

Applicant: Lam Res Corp ,  ラム リサーチ コーポレーションLam Research Corporation

Inventor： RAVKIN MIKE ,  BOYD JOHN ,  DORDI YEZDI N ,  REDEKER FRED C ,  DE LARIOS JOHN M

IPC: C25D7/12 ,  C25D5/02 ,  C25D5/04 ,  C25D5/22 ,  C25D17/12 ,  C25D21/00 ,  H01L21/00 ,  H01L21/288 ,  H01L21/3205

CPC classification number: C25D17/10 ,  C25D5/026 ,  C25D5/22 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and a method relating to deposition and planarization of a semiconductor wafer, more particularly, for more effectively depositing a thin film using a localized deposition and for enabling localized planarization. SOLUTION: A proximity head 102 that can be charged as an anode is placed in close proximity to the surface of a wafer 104. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating. While the proximity head proceeds in a direction 120 across the wafer, a deposited layer 108 is formed over a seed layer 106. The deposited layer is formed by way of an electrochemical reaction facilitated by an electrolyte 110 contained in a meniscus 116 that is defined between the proximity head and the seed layer. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种与半导体晶片的沉积和平坦化相关的装置和方法，更具体地说，是为了更有效地使用局部沉积沉积薄膜并实现局部平坦化。 解决方案：可以作为阳极充电的接近头部102被放置在紧邻晶片104的表面。电镀液体设置在晶片和邻近头部之间以产生局部金属电镀。 当接近头沿晶片方向120进行时，沉积层108形成在晶种层106上方。沉积层通过包含在弯液面116中的电解质110促进的电化学反应形成，该电解质110定义在 邻近头和种子层。 版权所有（C）2010，JPO＆INPIT