METHOD FOR PROTECTING ELECTRONIC CIRCUIT COMPONENTS AND ASSEMBLIES USING A METALLIZED FLEXIBLE ENCLOSURE

    公开(公告)号:CA2200136C

    公开(公告)日:2001-06-05

    申请号:CA2200136

    申请日:1997-03-17

    Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

    Method for protecting electronic circuit components and assemblies using a metallized flexible enclosure

    公开(公告)号:SG52954A1

    公开(公告)日:1998-09-28

    申请号:SG1997001175

    申请日:1997-04-11

    Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

    SUPERHYDROPHOBIC SURFACES AND FABRICATION PROCESS
    14.
    发明申请
    SUPERHYDROPHOBIC SURFACES AND FABRICATION PROCESS 审中-公开
    超级表面和制造工艺

    公开(公告)号:WO2007130294A2

    公开(公告)日:2007-11-15

    申请号:PCT/US2007009984

    申请日:2007-04-25

    Abstract: Apparatus including conduit body (102) having lining (104) that bounds channel (106) having longitudinal axis (108); the lining including lining base (110); the lining including raised micro-scale features (112) monolithic with the lining base. Apparatus including cavity body (302) at least partially enclosing cavity (300); the cavity having lining (304) that bounds channel (306) having longitudinal axis (308); the lining including lining base (310); the lining including raised micro-scale features (312) monolithic with the lining base. Process including: providing (604) three-dimensional graphics design for device having superhydrophobic pattern of raised micro-scale features on base, the base and the raised micro-scale features being monolithic; inputting (608) the three- dimensional graphics design as positive or negative image to three-dimensional rapid prototype fabrication apparatus; and laying down (612) build material and monolithically fabricating the base and the raised micro-scale features.

    Abstract translation: 包括具有限定具有纵向轴线(108)的通道(106)的衬里(104)的导管本体(102)的装置; 衬里包括衬里(110); 衬里包括凸起的微尺度特征(112)与衬底基体整体。 包括至少部分地包围空腔(300)的空腔体(302)的装置; 所述空腔具有限定具有纵向轴线(308)的通道(306)的衬里(304); 衬里包括衬里(310); 衬里包括凸起的微尺度特征(312)与衬底基体整体。 方法包括:提供(604)具有在基底上具有凸起的微尺度特征的超疏水图案的装置的三维图形设计,基底和凸起的微尺度特征是整体的; 将三维图形设计(608)作为正或负图像输入到三维快速原型制作装置; 并放置(612)建造材料,并整体地制造基座和凸起的微尺度特征。

    Conductive adhesive bonding means
    16.
    发明公开
    Conductive adhesive bonding means 失效
    导电熔

    公开(公告)号:EP0803558A3

    公开(公告)日:1998-10-21

    申请号:EP97302560

    申请日:1997-04-15

    Abstract: A method of electrically and mechanically bonding conductive surfaces with conductive adhesives, wherein at least one of the conductive surfaces is of the type upon which unstable oxides readily form. The conductive adhesives having a predetermined amount of conductive particles. The conductive particles having a rigidity at least as hard as the materials composing the conductive surfaces and any oxide formed thereon. The bonding method including the step of preparing the conductive surfaces so that a microscopically roughened oxide surface is formed thereon. The method further including the step of simultaneously applying a predetermined amount of heat and pressure to cure the conductive surface-conductive adhesive-conductive surface joint such that the conductive particles in the conductive adhesive pierce through the oxide to make direct contact with the conductive surfaces thereunder. The method controls the mechanical strength ofthe bond and the electrical characteristics of the bond joint. The electrical characteristics include joint resistivity and joint sensitivity to elevated temperature and/or humidity conditions.

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