Abstract:
An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.
Abstract:
An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.
Abstract:
Method, apparatus and system for self-aligning components, sub-assemblies and/or assemblies wherein actuators are used to physically move the components, sub-assemblies and/or assemblies such that an appropriate alignment is provided. The efficiency of the alignment may be determined with respect to a qualitative measurement (e.g., bit error rate, optical intensity and the like) of an output signal.
Abstract:
Apparatus including conduit body (102) having lining (104) that bounds channel (106) having longitudinal axis (108); the lining including lining base (110); the lining including raised micro-scale features (112) monolithic with the lining base. Apparatus including cavity body (302) at least partially enclosing cavity (300); the cavity having lining (304) that bounds channel (306) having longitudinal axis (308); the lining including lining base (310); the lining including raised micro-scale features (312) monolithic with the lining base. Process including: providing (604) three-dimensional graphics design for device having superhydrophobic pattern of raised micro-scale features on base, the base and the raised micro-scale features being monolithic; inputting (608) the three- dimensional graphics design as positive or negative image to three-dimensional rapid prototype fabrication apparatus; and laying down (612) build material and monolithically fabricating the base and the raised micro-scale features.
Abstract:
A fan includes a plurality of blades 9 carried by a hub housing 10 mounted on a rotatable motor shaft 6. The shaft 6 includes a heat pipe 11 to transfer heat from the motor bearings 7 and 8 to a heat dissipative plate 15. The fan is particularly useful for cooling electrical and electronic equipment housed within a cabinet, such as, for example, in a telecommunications arrangement.
Abstract:
A method of electrically and mechanically bonding conductive surfaces with conductive adhesives, wherein at least one of the conductive surfaces is of the type upon which unstable oxides readily form. The conductive adhesives having a predetermined amount of conductive particles. The conductive particles having a rigidity at least as hard as the materials composing the conductive surfaces and any oxide formed thereon. The bonding method including the step of preparing the conductive surfaces so that a microscopically roughened oxide surface is formed thereon. The method further including the step of simultaneously applying a predetermined amount of heat and pressure to cure the conductive surface-conductive adhesive-conductive surface joint such that the conductive particles in the conductive adhesive pierce through the oxide to make direct contact with the conductive surfaces thereunder. The method controls the mechanical strength ofthe bond and the electrical characteristics of the bond joint. The electrical characteristics include joint resistivity and joint sensitivity to elevated temperature and/or humidity conditions.