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    14.
    发明专利
    未知

    公开(公告)号：PT678124E

    公开(公告)日：2000-11-30

    申请号：PT94902244

    申请日：1993-11-15

    Applicant: PPG INDUSTRIES INC ,  MACDERMID INC

    Inventor： JOHNSON JAMES A ,  LARSON GARY B ,  JOBSON BRIAN ,  STURNI LANCE C

    IPC: C23C22/07 ,  C23C22/08 ,  C23C22/42 ,  G03F7/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  G03F7/09 ,  C23F1/18

    Abstract: Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate conversion coatings so produced are thicker, more durable and more uniform than those produced by known phosphating compositions. The compositions and processes are especially useful for providing a passivating/uniformizing coating layer on copper surfaces to which organic resin is thereafter deposited to serve as a resist in printed circuit fabrication sequences, particularly when the organic resin is an electrophoretically deposited organic resin. Also described is the microetching of copper surfaces with a phosphoric acid/peroxide microetchant preparatory to deposit thereon (or after a further provision of a phosphate conversion coating) of a photoresist which is then imagewise exposed and developed to provide a patterned resist.

    16.
    发明专利
    未知

    公开(公告)号：BR9307811A

    公开(公告)日：1995-11-14

    申请号：BR9307811

    申请日：1993-11-15

    Applicant: MACDERMID INC ,  PPG INDUSTRIES INC

    Inventor： LARSON GARY B ,  JOBSON BRIAN ,  JOHNSON JAMES A ,  STURNI LANCE C

    IPC: G03F7/09 ,  C23C22/07 ,  C23C22/08 ,  C23C22/42 ,  G03F7/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  C23F1/18

    Abstract: Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate conversion coatings so produced are thicker, more durable and more uniform than those produced by known phosphating compositions. The compositions and processes are especially useful for providing a passivating/uniformizing coating layer on copper surfaces to which organic resin is thereafter deposited to serve as a resist in printed circuit fabrication sequences, particularly when the organic resin is an electrophoretically deposited organic resin. Also described is the microetching of copper surfaces with a phosphoric acid/peroxide microetchant preparatory to deposit thereon (or after a further provision of a phosphate conversion coating) of a photoresist which is then imagewise exposed and developed to provide a patterned resist.

    PHOSPHATING COMPOSITIONS AND PROCESSES, PARTICULARLY FOR USE IN FABRICATION OF PRINTED CIRCUITS UTILIZING ORGANIC RESISTS
    17.
    发明专利
    PHOSPHATING COMPOSITIONS AND PROCESSES, PARTICULARLY FOR USE IN FABRICATION OF PRINTED CIRCUITS UTILIZING ORGANIC RESISTS 未知

    公开(公告)号：CA2152948A1

    公开(公告)日：1994-07-21

    申请号：CA2152948

    申请日：1993-11-15

    Applicant: MACDERMID INC ,  PPG INDUSTRIES INC

    Inventor： LARSON GARY B ,  JOBSON BRIAN ,  JOHNSON JAMES A ,  STURNI LANCE C

    IPC: G03F7/09 ,  C23C22/07 ,  C23C22/08 ,  C23C22/42 ,  G03F7/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38

    Abstract: Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate conversion coatings so produced are thicker, more durable and more uniform than those produced by known phosphating compositions. The compositions and processes are especially useful for providing a passivating/uniformizing coating layer on copper surfaces to which organic resin is thereafter deposited to serve as a resist in printed circuit fabrication sequences, particularly when the organic resin is an electrophoretically deposited organic resin. Also described is the microetching of copper surfaces with a phosphoric acid/peroxide microetchant preparatory to deposit thereon (or after a further provision of a phosphate conversion coating) of a photoresist which is then imagewise exposed and developed to provide a patterned resist.

    METHOD FOR FABRICATING PRINTED CIRCUITS
    19.
    发明专利
    METHOD FOR FABRICATING PRINTED CIRCUITS 未知

    公开(公告)号：CA2046202A1

    公开(公告)日：1992-03-13

    申请号：CA2046202

    申请日：1991-07-04

    Applicant: MACDERMID INC

    Inventor： BENGSTON JON E ,  LARSON GARY B

    IPC: H05K1/09 ,  H05K3/24 ,  H05K3/34

    Abstract: Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel-or cobalt-boron and nickel-or cobalt-phosphorous plating baths, or entirely or partly electrolytically, followed by a coating of a protective material which protects the nickel or cobalt coating from oxidation prior to the subsequent solder connection operation, is wettable by solder in the subsequent solder connection operation, and substantially dissolves in the solder in the subsequent solder connection operation without adverse effect on the solder joint between the electronic component and the through-hole, pad or land. A particular preferred protective material is gold, such as applied by deposition from immersion or electroless gold plating baths. The invention renders the so-treated areas readily susceptible to the soldering of components thereat, thereby avoiding the need for hot air solder levelling.

    PROCESS FOR PREPARING MULTILAYER PRINTED CIRCUIT BOARDS
    20.
    发明专利
    PROCESS FOR PREPARING MULTILAYER PRINTED CIRCUIT BOARDS 未知

    公开(公告)号：CA1262577A

    公开(公告)日：1989-10-31

    申请号：CA547294

    申请日：1987-09-18

    Applicant: MACDERMID INC

    Inventor： RUSZCZYK STANLEY J ,  LARSON GARY B ,  FERRIER DONALD R ,  GALLEGOS DANIEL ,  CASTALDI STEVEN A

    IPC: B05D3/04 ,  B05D3/10 ,  B05D5/12 ,  H05K1/00 ,  H05K3/18 ,  H05K3/46

    Abstract: PROCESS FOR PREPARING MULTILAYER PRINTED CIRCUIT BOARDS Multilayer printed circuit boards are fabricated by preparing a first layer in conventional manner by forming a resist image on a copper clad substrate, etching away unwanted copper, removing the resist from the circuit pattern and optionally applying a dielectric mask such as conventional solder mask to selected portions of the circuit pattern. A second layer, and optionally one or more subsequent layers, are fabricated by providing an image of a second circuit pattern in a predetermined location on said first layer, the image being formed using a suspension of cuprous oxide in a curable resin material. The image is cured at least partially and subjected to chemical reduction to convert at least a portion of the cuprous oxide to metallic copper. The image is then electrolessly plated with copper to build up the circuit pattern and the latter is selectively coated with a dielectric mask before repeating the cycle to build up one or more additional layers. Solder can be applied to selected areas of any of said printed circuit layers at any appropriate time during fabrication. The above method of fabrication has advantages of economy of time, materials and labor as compared with methods hitherto employed to prepare multilayer boards in which a plurality of single boards are fabricated individually and then assembled as a sandwich or laminate by application of heat and pressure.

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