公开(公告)号：EP2130208A4

公开(公告)日：2010-05-05

申请号：EP08730662

申请日：2008-02-25

Applicant: KEMET ELECTRONICS CORP ,  MOTOROLA INC

Inventor： PRYMAK JOHN D ,  STOLARSKI CHRIS ,  JACOBS DAVID ,  WAYNE CHRIS ,  LESSNER PHILIP ,  KINARD JOHN T ,  MELODY ALETHIA ,  DUNN GREGORY ,  CROSWELL ROBERT T ,  CHELINI REMY J

IPC: H01G9/012 ,  H01G9/15

CPC classification number: H01G9/0029 ,  H01G9/012 ,  H01G9/0425 ,  H01G9/055 ,  H01G9/15 ,  H05K1/185 ,  Y10T29/417

公开(公告)号：EP1695360A4

公开(公告)日：2009-06-03

申请号：EP04813997

申请日：2004-12-14

Applicant: MOTOROLA INC

Inventor： CROSWELL ROBERT T ,  DUNN GREGORY J ,  LEMPKOWSKI ROBERT B ,  TUNGARE AROON V ,  SAVIC JOVICA

IPC: H05K1/16 ,  H01G20060101 ,  H01G4/12 ,  H01G4/33 ,  H05K3/00 ,  H05K3/02 ,  H05K3/42 ,  H05K3/46 ,  H05K7/06

CPC classification number: H05K1/162 ,  H05K3/0029 ,  H05K3/025 ,  H05K3/384 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09718

Abstract: One of a plurality of capacitors embedded in a printed circuit structure includes a first electrode (415) overlaying a first substrate layer (505) of the printed circuit structure, a crystallized dielectric oxide core (405) overlaying the first electrode, a second electrode (615) overlying the crystallized dielectric oxide core, and a high temperature anti-oxidant layer (220) disposed between and contacting the crystallized dielectric oxide core and at least one of the first and second electrodes. The crystallized dielectric oxide core has a thickness that is less than 1 micron and has a capacitance density greater than 1000 pF/mm2. The material and thickness are the same for each of the plurality of capacitors. The crystallized dielectric oxide core may be isolated from crystallized dielectric oxide cores of all other capacitors of the plurality of capacitors.