-
公开(公告)号：AU2003251297A1
公开(公告)日：2003-12-12
申请号：AU2003251297
申请日：2003-05-13
Applicant: MOTOROLA INC
Inventor： ELIACIN MANES , LIAN KE KERYN , CROSWELL ROBERT T , TUNGARE AROON
IPC: H01L21/316 , H01L25/04 , H01L27/28 , H01L51/05 , H05K1/18
Abstract: An organic semiconductor device ( 11 ) can be embedded within a printed wiring board ( 10 ). In various embodiments, the embedded device ( 11 ) can be accompanied by other organic semiconductor devices ( 31 ) and/or passive electrical components ( 26 ). When so embedded, conductive vias ( 41, 42, 43 ) can be used to facilitate electrical connection to the embedded device. In various embodiments, specific categories of materials and/or processing steps are used to facilitate the making of organic semiconductors and/or passive electrical components, embedded or otherwise.
-
公开(公告)号：AU2003251297A8
公开(公告)日：2003-12-12
申请号：AU2003251297
申请日：2003-05-13
Applicant: MOTOROLA INC
Inventor： TUNGARE AROON , LIAN KE KERYN , ELIACIN MANES , CROSWELL ROBERT T
IPC: H01L21/316 , H01L25/04 , H01L27/28 , H01L51/05 , H05K1/18 , H01L29/76 , H01L31/062 , H01L29/94
Abstract: An organic semiconductor device ( 11 ) can be embedded within a printed wiring board ( 10 ). In various embodiments, the embedded device ( 11 ) can be accompanied by other organic semiconductor devices ( 31 ) and/or passive electrical components ( 26 ). When so embedded, conductive vias ( 41, 42, 43 ) can be used to facilitate electrical connection to the embedded device. In various embodiments, specific categories of materials and/or processing steps are used to facilitate the making of organic semiconductors and/or passive electrical components, embedded or otherwise.
-
公开(公告)号：WO2005062803A3
公开(公告)日：2006-02-16
申请号：PCT/US2004042529
申请日：2004-12-17
Applicant: MOTOROLA INC , DUNN GREGORY J , CHELINI REMY J , CROSWELL ROBERT T , DEAN TIMOTHY B , GAMBOA CLAUDIA V , SAVIC JOVICA
Inventor： DUNN GREGORY J , CHELINI REMY J , CROSWELL ROBERT T , DEAN TIMOTHY B , GAMBOA CLAUDIA V , SAVIC JOVICA
CPC classification number: H05K1/162 , H05K3/025 , H05K3/429 , H05K2201/0175 , H05K2201/0355 , H05K2201/09309 , H05K2201/09509 , H05K2201/09718
Abstract: A dielectric circuit board foil (400, 600) includes a conductive metal foil layer (210, 660), a crystallized dielectric oxide layer (405, 655) disposed adjacent a first surface of the conductive metal foil layer, a lanthanum nickelate layer (414, 664) disposed on the crystallized dielectric oxide layer, and an electrode layer (415, 665) that is substantially made of one or more base metals disposed on the lanthanum nickelate layer. The foil (400, 600) may be adhered to a printed circuit board sub-structure (700) and used to economically fabricate a plurality of embedded capacitors, including isolated capacitors of large capacitive density (> 1000 pf/mm²).
Abstract translation: 电介质电路板箔（400,600）包括导电金属箔层（210,660），邻近导电金属箔层的第一表面设置的结晶介电氧化物层（405,655），镍酸镧层（414） ，664）和基本上由设置在镍酸镧层上的一种或多种贱金属制成的电极层（415,665）。 箔（400,600）可以粘附到印刷电路板子结构（700）上，并用于经济地制造多个嵌入式电容器，包括具有大电容密度（> 1000pf / mm 2）的隔离电容器。
-
公开(公告)号：WO03100827A2
公开(公告)日：2003-12-04
申请号：PCT/US0315089
申请日：2003-05-13
Applicant: MOTOROLA INC
Inventor： LIAN KE KERYN , CROSWELL ROBERT T , TUNGARE AROON , ELIACIN MANES
CPC classification number: H05K1/185 , H01L21/31691 , H01L25/046 , H01L27/28 , H01L51/0512 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
Abstract: An organic semiconductor device (11) can be embedded within a printed wiring board (10). In various embodiments, the embedded device (11) can be accompanied by other organic semiconductor devices (31) and/or passive electrical components (26). When so embedded, conductive vias (41, 42, 43) can be used to facilitate electrical connection to the embedded device. In various embodiments, specific categories of materials and/or processing steps are used to facilitate the making of organic semiconductors and/or passive electrical components, embedded or otherwise.
Abstract translation: 有机半导体器件（11）可以嵌入印刷线路板（10）内。 在各种实施例中，嵌入式设备（11）可以伴随有其他有机半导体器件（31）和/或无源电子部件（26）。 当嵌入时，可以使用导电通孔（41,42,43）来促进与嵌入式装置的电连接。 在各种实施例中，使用特定类别的材料和/或处理步骤来促进嵌入式或其它方式制造有机半导体和/或无源电气部件。
-
公开(公告)号：WO2007075714A3
公开(公告)日：2007-12-21
申请号：PCT/US2006048472
申请日：2006-12-19
Applicant: MOTOROLA INC , KEMET ELECTRONICS CORP , DUNN GREGORY J , CHELINI REMY J , CROSWELL ROBERT T , LESSNER PHILIP M , PREVALLET MICHAEL D , PRYMAK JOHN D
Inventor： DUNN GREGORY J , CHELINI REMY J , CROSWELL ROBERT T , LESSNER PHILIP M , PREVALLET MICHAEL D , PRYMAK JOHN D
IPC: H01G9/00
CPC classification number: H01G9/045 , H01G9/0032 , H01G9/055 , H01G9/15 , H05K1/162 , H05K3/383 , H05K3/429 , H05K2201/0355 , H05K2201/09309 , H05K2201/09509 , H05K2201/09718 , H05K2203/0315
Abstract: Embedded capacitors comprise a bimetal foil (500) that includes a first copper layer (205) and an aluminum layer (210) on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side (215) opposite the first copper layer. The bimetal foil further includes an aluminum oxide layer (305) on the high surface area textured side of the aluminum layer, a conductive polymer layer (420) on the aluminum oxide layer, and a second copper layer (535) overlying the aluminum oxide layer. The bimetal foil may be embedded in a circuit board (700) to form high value embedded capacitors.
Abstract translation: 嵌入式电容器包括在第一铜层上包括第一铜层（205）和铝层（210）的双金属箔（500）。 铝层具有邻近第一铜层的平滑侧面和与第一铜层相对的高表面积纹理化侧面（215）。 双金属箔还包括在铝层的高表面积纹理化侧的氧化铝层（305），氧化铝层上的导电聚合物层（420）和覆盖氧化铝层的第二铜层（535） 。 双金属箔可以嵌入在电路板（700）中以形成高价值的嵌入式电容器。
-
Patent Agency Ranking
公开(公告)号：WO2006101638A2
公开(公告)日：2006-09-28
申请号：PCT/US2006005839
申请日：2006-02-17
Applicant: MOTOROLA INC , DUNN GREGORY J , CROSWELL ROBERT T , MAGERA JAROSLAW A , SAVIC JOVICA , TUNGARE AROON V
Inventor： DUNN GREGORY J , CROSWELL ROBERT T , MAGERA JAROSLAW A , SAVIC JOVICA , TUNGARE AROON V
CPC classification number: C23F1/40 , C23F1/02 , C23F1/32 , C23F1/34 , H05K1/162 , H05K3/0044 , H05K3/025 , H05K3/06 , H05K3/429 , H05K2201/0175 , H05K2201/0179 , H05K2201/09309 , H05K2201/09509 , H05K2203/025 , H05K2203/0746
Abstract: A method is disclosed for fabricating a patterned embedded capacitance layer. The method includes fabricating (1305, 1310) a ceramic oxide layer (510) overlying a conductive metal layer (515) overlying a printed circuit substrate (505), perforating (1320) the ceramic oxide layer within a region (705), and removing (1325) the ceramic oxide layer and the conductive metal layer in the region by chemical etching of the conductive metal layer. The ceramic oxide layer may be less than 1 micron thick.
Abstract translation: 公开了一种用于制造图案化的嵌入式电容层的方法。 该方法包括制造覆盖在印刷电路衬底（505）上的导电金属层（515）上的陶瓷氧化物层（510），在区域（705）内穿孔（1320）陶瓷氧化物层，以及去除 （1325）通过化学蚀刻导电金属层的区域中的陶瓷氧化物层和导电金属层。 陶瓷氧化物层可以小于1微米厚。
-
公开(公告)号：WO2006101638B1
公开(公告)日：2007-02-15
申请号：PCT/US2006005839
申请日：2006-02-17
Applicant: MOTOROLA INC , DUNN GREGORY J , CROSWELL ROBERT T , MAGERA JAROSLAW A , SAVIC JOVICA , TUNGARE AROON V
Inventor： DUNN GREGORY J , CROSWELL ROBERT T , MAGERA JAROSLAW A , SAVIC JOVICA , TUNGARE AROON V
IPC: H01L21/302
CPC classification number: C23F1/40 , C23F1/02 , C23F1/32 , C23F1/34 , H05K1/162 , H05K3/0044 , H05K3/025 , H05K3/06 , H05K3/429 , H05K2201/0175 , H05K2201/0179 , H05K2201/09309 , H05K2201/09509 , H05K2203/025 , H05K2203/0746
Abstract: A method is disclosed for fabricating a patterned embedded capacitance layer. The method includes fabricating (1305, 1310) a ceramic oxide layer (510) overlying a conductive metal layer (515) overlying a printed circuit substrate (505), perforating (1320) the ceramic oxide layer within a region (705), and removing (1325) the ceramic oxide layer and the conductive metal layer in the region by chemical etching of the conductive metal layer. The ceramic oxide layer may be less than 1 micron thick.
Abstract translation: 公开了一种制造图案化的嵌入式电容层的方法。 该方法包括制造（1305,1310）覆盖覆盖在印刷电路基板（505）上的导电金属层（515）的陶瓷氧化物层（510），在区域（705）内对陶瓷氧化物层进行穿孔（1320） （1325）通过导电金属层的化学蚀刻在该区域中的陶瓷氧化物层和导电金属层。 陶瓷氧化物层可以小于1微米厚。
-
公开(公告)号：WO2005059930A3
公开(公告)日：2006-03-09
申请号：PCT/US2004041758
申请日：2004-12-14
Applicant: MOTOROLA INC , CROSWELL ROBERT T , DUNN GREGORY J , LEMPKOWSKI ROBERT B , TUNGARE AROON V , SAVIC JOVICA
Inventor： CROSWELL ROBERT T , DUNN GREGORY J , LEMPKOWSKI ROBERT B , TUNGARE AROON V , SAVIC JOVICA
CPC classification number: H05K1/162 , H05K3/0029 , H05K3/025 , H05K3/384 , H05K3/429 , H05K3/4652 , H05K2201/0175 , H05K2201/0179 , H05K2201/0355 , H05K2201/09309 , H05K2201/09509 , H05K2201/09718
Abstract: One of a plurality of capacitors embedded in a printed circuit structure includes a first electrode (415) overlaying a first substrate layer (505) of the printed circuit structure, a crystallized dielectric oxide core (405) overlaying the first electrode, a second electrode (615) overlying the crystallized dielectric oxide core, and a high temperature anti-oxidant layer (220) disposed between and contacting the crystallized dielectric oxide core and at least one of the first and second electrodes. The crystallized dielectric oxide core has a thickness that is less than 1 micron and has a capacitance density greater than 1000 pF/mm
Abstract translation: 嵌入印刷电路结构中的多个电容器之一包括覆盖印刷电路结构的第一衬底层（505）的第一电极（415），覆盖第一电极的结晶化电介质氧化物芯（405），第二电极 615），以及设置在结晶的电介质氧化物芯和第一和第二电极中的至少一个之间并与其接触的高温抗氧化剂层（220）。 结晶的电介质氧化物芯的厚度小于1微米，电容密度大于1000pF / mm
-
公开(公告)号：WO2010117583A2
公开(公告)日：2010-10-14
申请号：PCT/US2010027745
申请日：2010-03-18
Applicant: MOTOROLA INC , TAYLOR BRENT A , CROSWELL ROBERT T , DUNN GREGORY J
Inventor： TAYLOR BRENT A , CROSWELL ROBERT T , DUNN GREGORY J
IPC: G06Q50/00
CPC classification number: H04N7/163 , H04N21/44012 , H04N21/458
Abstract: A method of presenting content from a remote device is provided. Limited bandwidth content, transmitted from a remote device, is received at a local device. The limited bandwidth content is superimposed on enhanced content retrieved by the local device. The limited bandwidth content overlaps with the enhanced content such that the limited bandwidth content is a subset of what is represented by the enhanced content. The limited bandwidth or enhanced content may either be still images or video that is stitched together and displayed at the local device.
Abstract translation: 提供了一种从远程设备呈现内容的方法。 在本地设备接收到从远程设备发送的有限带宽内容。 有限带宽内容叠加在由本地设备检索的增强内容上。 有限带宽内容与增强内容重叠，使得有限带宽内容是由增强内容表示的内容的子集。 有限带宽或增强内容可以是拼接在一起并显示在本地设备上的静止图像或视频。
-
公开(公告)号：WO2007075713A3
公开(公告)日：2008-10-02
申请号：PCT/US2006048471
申请日：2006-12-19
Applicant: MOTOROLA INC , DUNN GREGORY J , CROSWELL ROBERT T , KUMPF GEORGE H , SVIGELJ JOHN A
Inventor： DUNN GREGORY J , CROSWELL ROBERT T , KUMPF GEORGE H , SVIGELJ JOHN A
CPC classification number: H01Q15/006 , H05K1/116 , H05K1/162 , H05K1/165 , H05K3/429 , H05K3/4602 , H05K3/4688 , H05K2201/0187 , H05K2201/0715 , H05K2201/09509 , H05K2201/09609
Abstract: A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive plates (318) is disposed on the first surface (314) of the printed circuit board (302), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor (330, 331) electrically coupled between at least two of the electrically conductive plates (318) and embedded within the printed circuit board (302), and (2) at least one capacitor (320) electrically coupled between two of the electrically conductive plates (318). The capacitor (320) comprises at least one of (a) a dielectric material (328) disposed between adjacent electrically conductive plates, and (b) a mezzanine capacitor embedded within the printed circuit board (302).
Abstract translation: 高阻抗表面（300）具有带有第一表面（314）和第二表面（316）的印刷电路板（302）和设置在印刷的第二表面（316）上的连续导电板（319） 电路板（302）。 多个导电板（318）设置在印刷电路板（302）的第一表面（314）上，同时还提供多个元件。 每个元件包括（1）至少一个电耦合在至少两个导电板（318）之间并嵌入印刷电路板（302）内的多层电感器（330,331）中的至少一个，和（2 ）电耦合在两个导电板（318）之间的至少一个电容器（320）。 电容器（320）包括设置在相邻导电板之间的（a）介电材料（328）和（b）嵌入印刷电路板（302）内的夹层电容器中的至少一个。
-
-
-
-
-
-
-
-
-
Search Results
12
records
(took 0.04 seconds)
