公开(公告)号：WO2005059930A3

公开(公告)日：2006-03-09

申请号：PCT/US2004041758

申请日：2004-12-14

Applicant: MOTOROLA INC ,  CROSWELL ROBERT T ,  DUNN GREGORY J ,  LEMPKOWSKI ROBERT B ,  TUNGARE AROON V ,  SAVIC JOVICA

Inventor： CROSWELL ROBERT T ,  DUNN GREGORY J ,  LEMPKOWSKI ROBERT B ,  TUNGARE AROON V ,  SAVIC JOVICA

IPC: H01G20060101 ,  H05K1/16 ,  H05K3/00 ,  H05K3/02 ,  H05K3/42 ,  H05K3/46 ,  H05K7/06 ,  H01G4/20

CPC classification number: H05K1/162 ,  H05K3/0029 ,  H05K3/025 ,  H05K3/384 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09718

Abstract: One of a plurality of capacitors embedded in a printed circuit structure includes a first electrode (415) overlaying a first substrate layer (505) of the printed circuit structure, a crystallized dielectric oxide core (405) overlaying the first electrode, a second electrode (615) overlying the crystallized dielectric oxide core, and a high temperature anti-oxidant layer (220) disposed between and contacting the crystallized dielectric oxide core and at least one of the first and second electrodes. The crystallized dielectric oxide core has a thickness that is less than 1 micron and has a capacitance density greater than 1000 pF/mm

Abstract translation: 嵌入印刷电路结构中的多个电容器之一包括覆盖印刷电路结构的第一衬底层（505）的第一电极（415），覆盖第一电极的结晶化电介质氧化物芯（405），第二电极 615），以及设置在结晶的电介质氧化物芯和第一和第二电极中的至少一个之间并与其接触的高温抗氧化剂层（220）。 结晶的电介质氧化物芯的厚度小于1微米，电容密度大于1000pF / mm

公开(公告)号：WO03092048A2

公开(公告)日：2003-11-06

申请号：PCT/US0308255

申请日：2003-03-17

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  LIAN KERYN ,  LIU JUNHUA ,  LEMPKOWSKI ROBERT B

IPC: B81C1/00 ,  B81B3/00 ,  H01H59/00 ,  H01L

CPC classification number: H01H59/0009 ,  H01G5/16 ,  H01H2001/0073 ,  H01H2059/0054

Abstract: A meso-scale MEMS device having a cantilevered beam is formed using standard printed wiring board and high density interconnect technologies and practices. The beam includes at least some polymer material to constitute its length, and in some embodiments also comprises a conductive material as a load-bearing component thereof. In varying embodiments, the beam is attached at a location proximal to an end thereof, or distal to an end thereof.

Abstract translation: 使用标准印刷线路板和高密度互连技术和实践形成具有悬臂梁的中尺度MEMS器件。 梁包括构成其长度的至少一些聚合物材料，并且在一些实施例中还包括作为其承载部件的导电材料。 在不同的实施例中，梁被附接在靠近其端部的位置处，或者远离其端部。