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公开(公告)号：ES2269213T3
公开(公告)日：2007-04-01
申请号：ES00986483
申请日：2000-12-14
Applicant: QUALCOMM INC
Inventor： JHA SANJAY , SIMMONDS STEPHEN , ELHUSSEINI JALAL , YU NICHOLAS K , KHAN SAFI
Abstract: Sistema de memoria flash (112) que comprende: unas celdas de memoria flash dispuestas como un conjunto de macros flash (130), y unos medios de lectura durante escritura (144, 146) para escribir en una de dichas macros flash, mientras se lee simultáneamente en otra de dichas macros flash; en el que el sistema está conectado a un microprocesador (102) y en el que dichos medios de lectura durante escritura (144, 146) incluyen: unos medios de escritura (146) para escribir las señales recibidas desde el microprocesador a una macro seleccionada de dichas macros flash (130); y caracterizado porque dichos medios de lectura durante escritura incluyen además unos medios de suspensión, sensibles a la recepción de un mandato de lectura del microprocesador dirigido a dicha macro seleccionada de dichas macros flash, para suspender la operación del microprocesador hasta que los medios de escritura (146) hayan finalizado su operación, y para ejecutar el mandato de lectura.
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公开(公告)号：HK1062958A1
公开(公告)日：2004-12-03
申请号：HK04105812
申请日：2004-08-05
Applicant: QUALCOMM INC
Inventor： BAZARJANI SEYFOLLAH , ZHANG HAITO , ZOU QUIZHEN , JHA SANJAY
IPC: H01L20060101 , H01L25/18 , G01R20060101 , H01L23/31 , H01L25/065 , H01L25/07
Abstract: Techniques for fabricating analog and digital circuits on separate dies and stacking and integrating the dies within a single package to form a mixed-signal IC that provides many benefits. In one aspect, the analog and digital circuits are implemented on two separate dies using possibly different IC processes suitable for these different types of circuits. The analog and digital dies are thereafter integrated (stacked) and encapsulated within the single package. Bonding pads are provided to interconnect the dies and to connect the dies to external pins. The bonding pads may be located and arranged in a manner to provide the required connectivity while minimizing the amount of die area required to implement the pads. In another aspect, the die-to-die connectivity may be tested in conjunction with a serial bus interface.
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公开(公告)号：ES2616746T3
公开(公告)日：2017-06-14
申请号：ES03759641
申请日：2003-10-01
Applicant: QUALCOMM INC
Inventor： GLAZKO SERGUEI , JHA SANJAY , JACOBS PAUL
Abstract: Un procedimiento para la localización de una estación móvil, comprendiendo dicho procedimiento: registrar (232, 242) uno o más canales inalámbricos que pertenecen a uno o más proveedores de red distintos del proveedor de red doméstica de la estación móvil y que sustancialmente actualmente proporcionan comunicación con una o más estaciones base discernibles; y establecer (213, 214) una posición geográfica de la estación móvil mediante el uso de uno o más canales inalámbricos que pertenecen a uno o más proveedores de red distintos del proveedor de red doméstica de la estación móvil; en el que dicho registro de uno o más canales inalámbricos que pertenecen a uno o más proveedores de red distintos de la red doméstica de la estación móvil comprende: seleccionar (230) uno de un modo inalámbrico previamente no seleccionado o una banda de frecuencia previamente no seleccionada (240) de la estación móvil; y registrar (232, 242) uno o más canales que proporcionan comunicación con una o más estaciones base discernibles usando dicho modo inalámbrico previamente no seleccionado o dicha banda de frecuencias previamente no seleccionada, realizándose dicho registro mediante la supervisión de forma pasiva y con independencia del uno o más proveedores de red a los que pertenecen los canales.
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公开(公告)号：AT497681T
公开(公告)日：2011-02-15
申请号：AT06815514
申请日：2006-09-26
Applicant: QUALCOMM INC
Inventor： ROMINE CHRISTOPHER , FEENAGHTY DENNIS , BURKE JOSEPH , JHA SANJAY , SOLIMAN SAMIR
Abstract: A method for facilitating wireless testing and programming of wireless devices in a manufacturing environment; comprising: establishing communication between at least one control unit and at least one wireless device of a plurality of wireless devices; retrieving a before event last known location of the at least one wireless device, when an event disrupting a device process flow is over; comparing the before event last known location of the at least one wireless device with an after event location of the at least one wireless device; returning the at least one wireless device to the before event last known location if there is a difference between the before event last known location and the after event location as a result of the comparing; determining whether the at least one wireless device has successfully completed testing and programming at the before event last know location; and facilitating testing and programming of the at least one wireless device, if the at least one wireless device has not successfully completed the testing and programming as well as a corresponding manufacturing system.
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公开(公告)号：HK1063237A1
公开(公告)日：2004-12-17
申请号：HK04105934
申请日：2004-08-09
Applicant: QUALCOMM INC
Inventor： FRANKLIN ANTONIO P , JHA SANJAY
IPC: G11B20060101 , G11B19/26 , G11B20/10
Abstract: A method and apparatus for a variable mode multi-media data object storage device. Large digital objects can be quickly downloaded in approximately a minute. The digital objects can be utilized or played back at real-time speeds. Utilization or playback consumes minimal power, allowing the disk to support portable devices operating on battery power. The storage device uses multiple disk rotation speeds to support multiple modes of operation. The storage device operates in at least two modes of disk drive operation, supporting a fast platter rotation speed for writing and a slower platter rotation speed for reading. The multiple rotation speeds operate in conjunction with a head assembly configured with at least one head for reading and multiple heads for writing. When writing, the disk spins at the faster rotation speed. When in utilization or playback mode, the disk spins at the slower, power conserving rotation speed.
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Patent Agency Ranking
公开(公告)号：CA2704892A1
公开(公告)日：2001-06-21
申请号：CA2704892
申请日：2000-12-14
Applicant: QUALCOMM INC
Inventor： JHA SANJAY , SIMMONDS STEPHEN , ELHUSSEINI JALAL , YU NICHOLAS K , KHAN SAFI
Abstract: The flash and SRAM memory (112, 113) are embedded within an application specific integrated circuit (ASIC) to provide improved access times and also reduce over all power consumption of a mobile telephone employing the ASIC. The flash memory system (112) includes a flash memory array (130) configured to provide a set of individual flash macros and a flash memory controller (132) for accessing the flash macros. The flash memory controller includes a read while writing unit (144, 146) for writing to one of the flash macros while simultaneously reading from another of the flash macros. The flash memory controller also includes programmable wait state registers (138) and a password register (140) providing a separate password for different portions of the flash memory array. A memory swap unit (149) is provided for swapping high and low memory subsequent to completion of operations performed by the boot loader. Method and apparatus implementations are disclosed.
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公开(公告)号：DE60231376D1
公开(公告)日：2009-04-16
申请号：DE60231376
申请日：2002-01-18
Applicant: QUALCOMM INC
Inventor： ANTONIO FRANKLIN P , JHA SANJAY
Abstract: A method and apparatus for a variable mode multi-media data object storage device. Large digital objects can be quickly downloaded in approximately a minute. The digital objects can be utilized or played back at real-time speeds. Utilization or playback consumes minimal power, allowing the disk to support portable devices operating on battery power. The storage device uses multiple disk rotation speeds to support multiple modes of operation. The storage device operates in at least two modes of disk drive operation, supporting a fast platter rotation speed for writing and a slower platter rotation speed for reading. The multiple rotation speeds operate in conjunction with a head assembly configured with at least one head for reading and multiple heads for writing. When writing, the disk spins at the faster rotation speed. When in utilization or playback mode, the disk spins at the slower, power conserving rotation speed.
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公开(公告)号：DE60030765D1
公开(公告)日：2006-10-26
申请号：DE60030765
申请日：2000-12-14
Applicant: QUALCOMM INC
Inventor： JHA SANJAY , SIMMONDS STEPHEN , ELHUSSEINI JALAL , YU K , KHAN SAFI
Abstract: The flash and SRAM memory (112, 113) are embedded within an application specific integrated circuit (ASIC) to provide improved access times and also reduce over all power consumption of a mobile telephone employing the ASIC. The flash memory system (112) includes a flash memory array (130) configured to provide a set of individual flash macros and a flash memory controller (132) for accessing the flash macros. The flash memory controller includes a read while writing unit (144, 146) for writing to one of the flash macros while simultaneously reading from another of the flash macros. The flash memory controller also includes programmable wait state registers (138) and a password register (140) providing a separate password for different portions of the flash memory array. A memory swap unit (149) is provided for swapping high and low memory subsequent to completion of operations performed by the boot loader. Method and apparatus implementations are disclosed.
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公开(公告)号：MY122792A
公开(公告)日：2006-05-31
申请号：MYPI20020686
申请日：2002-02-27
Applicant: QUALCOMM INC
Inventor： ZHANG HAITAO , BAZARJANI SEYFOLLAH , ZOU QIUZHEN , JHA SANJAY
IPC: H01L23/24 , H01L25/18 , H01L23/31 , H01L25/065 , H01L25/07
Abstract: TECHNIQUES FOR FABRICATING ANALOG AND DIGITAL CIRCUITS ON SEPARATE DIES AND STACKING AND INTEGRATING THE DIES WITHIN A SINGLE PACKAGE TO FORM A MIXED-SIGNAL IC THAT PROVIDESMANY BENEFITS. IN ONE ASPECT, THE ANALOG AND DIGITAL CIRCUITS ARE IMPLEMENTED ON TWO SEPARATE DIES 120, 130) USING POSSIBLY DIFFERENT IC PROCESSES SUITABLE FOR THESE DIFFERENT TYPES OF CIRCUITS. THE ANALOG AND DIGITAL DIES (120, 130) ARE THEREAFTER INTEGRATED (STACKED) AND ENCAPSULATED WITHIN THE SINGLE PACKAGE. BONDING PADS (120, 130) ARE PROVIDED TO INTERCONNECT THE DIES AND ENCAPSULATED WITHIN THE SINGLE PACKAGE . BONDING PADS (122, 132) ARE PROVIDED TO INTERCONNECT THE DIES AND TO CONNECT THE DIES TO EXTERNAL PINS .THE BONDING PADS MAY BE LOCATED AND ARRANGED IN A MANNER TO PROVIDETHE REQUIRED CONNECTIVITY WHILE MINIMIZING THE AMOUNT OF DIE AREA REQUIRED TO IMPLEMENT THE PADS. IN ANOTHER ASPECT, THE DIE-TO-DIE CONNECTIVITY MAY BE TESTED IN CONJUNCTION WITH A SERIAL BUS INTERFACE . FIGURE 3B, 3C, 4B
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公开(公告)号：BR0206603A
公开(公告)日：2004-10-05
申请号：BR0206603
申请日：2002-01-18
Applicant: QUALCOMM INC
Inventor： ANTONIO FRANKLIN P , JHA SANJAY
Abstract: A method and apparatus for a variable mode multi-media data object storage device. Large digital objects can be quickly downloaded in approximately a minute. The digital objects can be utilized or played back at real-time speeds. Utilization or playback consumes minimal power, allowing the disk to support portable devices operating on battery power. The storage device uses multiple disk rotation speeds to support multiple modes of operation. The storage device operates in at least two modes of disk drive operation, supporting a fast platter rotation speed for writing and a slower platter rotation speed for reading. The multiple rotation speeds operate in conjunction with a head assembly configured with at least one head for reading and multiple heads for writing. When writing, the disk spins at the faster rotation speed. When in utilization or playback mode, the disk spins at the slower, power conserving rotation speed.
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