Abstract:
A multibeam semiconductor laser wherein a group III-V nitride compound semiconductor layer having a laser structure is formed on a major surface of a sapphire substrate or the like, and anodes and cathodes are formed on the group III-V nitride compound semiconductor layer. An anode is formed across a cathode, with an insulating film between them. Another anode is formed across another cathode, with an insulating film between them.
Abstract:
In a multi-beam semiconductor laser including nitride III-V compound semiconductor layers stacked on one surface of a substrate of sapphire or other material to form laser structures, and including a plurality of anode electrodes and a plurality of cathode electrodes formed on the nitride III-V compound semiconductor layers, one of the anode electrodes is formed to bridge over one of the cathode electrodes via an insulating film, and another anode electrode is formed to bridge over another of the cathode electrodes via an insulating film.
Abstract:
A method for fabricating a semiconductor light emitting element or a semiconductor element by growing a nitride based III-V compound semiconducto r layer for forming a light emitting element structure or an element structure on a nitride based III-V compound semiconductor substrate where a plurality of second regions having a second mean dislocation density higher than a first mean dislocation density are arranged regularly in a first region of crystal having a first mean dislocation density, wherein an element region is define d on the nitride based III-V compound semiconductor substrate such that the second region is not included substantially or not included in a light emitting region or an active region.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of forming an organic thin film capable of forming a single crystal organic thin film quickly and easily while controlling the thickness and size.SOLUTION: After supplying organic solution 20 to one surface of a film deposition substrate 10 (a wide solution storage region 11 and a narrow solution constriction region 12 connected thereto) supported by a temperature controllable support 1, a temperature controllable moving body 4 is moved along the surface of the support 1 while touching the organic solution 20 independently from the support 1. Temperature TS of the support 1 is set between the solubility curve and supersolubility curve for the organic solution 20, and the temperature TM of the moving body 4 is set on the higher temperature side than the solubility curve.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of forming an organic thin film capable of forming a single crystal organic thin film by controlling the position where the crystal nucleus is formed and the direction of crystal growth.SOLUTION: Organic solution 20 is supplied to a wide solution storage region 11 and a narrow solution localization region 12 connected thereto in such a state as the temperature TS of the organic solution 20 becomes T1 which is on the higher temperature side than a solubility curve, and the vapor pressure P in the ambient environment of the organic solution 20 becomes saturation vapor pressure at T1. Subsequently, the temperature TS of the organic solution 20 is lowered from T1 down to T2 which is between the solubility curve and a supersolubility curve.
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method for easily manufacturing a semiconductor LED using nitride-based group III-V compound semiconductor with a long lifetime due to a low initial impairment rate, while its aged deterioration and luminescence nonuniformity are very low. SOLUTION: When a semiconductor LED, with a structure in which an InGaN active layer 7, undoped InGaN deterioration preventing layer 8, undoped GaN optical waveguide layer 17, p-type AlGaN cap layer 9 and p-type AlGaN/GaN superlattice clad layer 18 are laminated, in this order, the active layer 7, undoped InGaN deterioration preventing layer 8, undoped GaN optical waveguide layer 17, and p-type AlGaN cap layer 9 must be grown at a growth temperature lower than that of the p-type AlGaN/GaN superlattice clad layer 18. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a nitride semiconductor having a large low-defect region on a surface, and to provide a manufacturing method of a semiconductor element. SOLUTION: On a substrate 100, a seed crystal section 105 is formed into a stripe geometry via a buffer layer 100a, and next, a crystal is grown from the seed crystal section 105 in two-stage growing conditions, to form a nitride semiconductor layer 107. In the first stage, a low-temperature growth section 107a, whose cross-sectional shape in the thickness direction is trapezoidal, is formed at a growing temperature of 1,030°C; and in the second stage, a lateral growth is made to progress dominantly at a growing temperature of 1,070°C, to form a high-temperature growth section 107b between the low-temperature growth sections 107a. On the surface of the nitride semiconductor layer 107, hillocks and normal lattice defects are reduced, at sections above the low-temperature growth sections 107a. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device which has superior luminous properties, is very reliable, and has a long service life. SOLUTION: A method of manufacturing the semiconductor light emitting device includes a step of enabling a nitride III-V compound semiconductor layer forming a light emitting device structure to grow on a nitride III-V compound semiconductor substrate where a plurality of second regions having a second average dislocation density higher than a first average dislocation density possessed by a first crystal region and extending rectilinearly are regularly arranged in parallel with each other in the first crystal region. In the above manufacturing method, the second regions are arranged at an interval of 50 μm or above, one or more rows of the second regions are included, and a device region is demarcated on the nitride III-V compound semiconductor substrate so as not to enable the second regions to be included in the light emitting region of the semiconductor light emitting device. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor laser and method of manufacturing the same, which can enlarge an ohmic contact area between a nitride-based III-V compound semiconductor layer and an electrode to reduce contact resistance. SOLUTION: Between a p-type clad layer 18 and a p-side contact layer 19, an insulating layer 21, having an opening 21a at a place which corresponds to current injection region of an active layer 16 is formed. The p-type clad layer 18 has a projecting part 18a, which is salient on the p-side contact layer 19 side in correspondence with the opening 21a of the insulating layer 21. The p-side contact layer 19 consists of a basic growth region 19a formed so as to correspond to the projecting part 18a of the p-type clad layer 18, and a regrowth region 19b, which is grown with the basic growth region 19a and projecting part 18a as a base. The width of the p-side contact layer 19 is enlarged by the regrowth region 19b, which increases the ohmic contact area between the p-side contact layer and the p-side electrode 23, and thereby decreases the contact resistance.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor laser for obtaining a crystal growth layer with less fluctuation in a crystal axis and for improving the characteristics of a device, a semiconductor device and a nitride-family III-V group compound substrate, and their manufacturing method. SOLUTION: A plurality of seed crystal layers 12 provided separately on one surface side of a substrate 11 for growth, and an n-side contact layer 13 that is grown based on the plurality of seed crystal layers and has a growth region in a crosswise direction, are provided. In the seed crystal layer 12, the product of width w1 (unit: μm) of a boundary surface 12a with the n-side contact layer 13 in its arranged direction A and thickness t1 (unit: μm) in a direction where the n-side contact layer 13 is laminated is set to 15 or less, thus reducing the fluctuation of the crystal axis on the n-side contact layer 13, and hence improving the crystallinity of a semiconductor layer from an n-type clad layer 14 to a p-side contact layer 19 being laminated on the n-side contact layer 13.