公开(公告)号：EP2579616B1

公开(公告)日：2019-11-20

申请号：EP11786440.5

申请日：2011-04-20

Applicant: Omron Corporation ,  STMicroelectronics S.r.l.

Inventor： ISHIMOTO, Koichi ,  TATARA, Yoshitaka ,  INUZUKA, Shin ,  CONTI, Sebastiano

IPC: H04R19/04 ,  H04R31/00

公开(公告)号：EP3263516A9

公开(公告)日：2018-04-11

申请号：EP16206894.4

申请日：2016-12-23

Applicant: STMicroelectronics S.r.l.

Inventor： CARMINATI, Roberto ,  DUQI, Enri ,  CONTI, Sebastiano

IPC: B81B3/00 ,  G02B26/08 ,  G02B26/10

CPC classification number: G02B26/0833 ,  B81B3/0045 ,  B81B7/008 ,  B81B2201/042 ,  B81B2203/0315 ,  B81B2203/056 ,  G02B26/0841 ,  G02B26/101 ,  G05F3/26 ,  H02M1/12 ,  H02M1/15 ,  H02M1/42 ,  H02M1/4225 ,  H02M1/4258 ,  H02M3/33507 ,  H02M2001/0025 ,  H02M2001/0032 ,  H04N9/3155 ,  H04N9/3173 ,  Y02B70/16

Abstract: A micro-electro-mechanical device (50), wherein a platform (52) is formed in a top substrate and is configured to turn through a rotation angle (θ). The platform has a slit (70) and faces a cavity (53). A plurality of integrated photodetectors (70) is formed in a bottom substrate so as to detect the light through the slit and generate signals correlated to the light through the slit. The area of the slit varies with the rotation angle of the platform and causes diffraction, more or less marked as a function of the angle. The difference between the signals of two photodetectors arranged at different positions with respect to the slit yields the angle.

Abstract translation: 一种微电子机械装置（50），其中平台（52）形成在顶部基板中并且构造成转过旋转角度（θ）。 该平台具有狭缝（70）并且面向空腔（53）。 多个集成光电检测器（70）形成在底部基板中以便检测通过狭缝的光并且通过狭缝产生与光相关的信号。 狭缝的面积随着平台的旋转角度而变化并引起衍射，或多或少地作为角度的函数来标记。 相对于狭缝布置在不同位置的两个光电检测器的信号之间的差异产生角度。

公开(公告)号：EP3263516A1

公开(公告)日：2018-01-03

申请号：EP16206894.4

申请日：2016-12-23

Applicant: STMicroelectronics S.r.l.

Inventor： CARMINATI, Roberto ,  DUQI, Enri ,  CONTI, Sebastiano

IPC: B81B3/00 ,  G02B26/08 ,  G02B26/10

CPC classification number: G02B26/0833 ,  B81B3/0045 ,  B81B7/008 ,  B81B2201/042 ,  B81B2203/0315 ,  B81B2203/056 ,  G02B26/0841 ,  G02B26/101 ,  G05F3/26 ,  H02M1/12 ,  H02M1/15 ,  H02M1/42 ,  H02M1/4225 ,  H02M1/4258 ,  H02M3/33507 ,  H02M2001/0025 ,  H02M2001/0032 ,  H04N9/3155 ,  H04N9/3173 ,  Y02B70/16

Abstract: A micro-electro-mechanical device (50), wherein a platform (52) is formed in a top substrate and is configured to turn through a rotation angle (θ). The platform has a slit (70) and faces a cavity (53). A plurality of integrated photodetectors (70) is formed in a bottom substrate so as to detect the light through the slit and generate signals correlated to the light through the slit. The area of the slit varies with the rotation angle of the platform and causes diffraction, more or less marked as a function of the angle. The difference between the signals of two photodetectors arranged at different positions with respect to the slit yields the angle.

公开(公告)号：EP3205997A1

公开(公告)日：2017-08-16

申请号：EP17156382.8

申请日：2017-02-15

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  MURARI, Bruno ,  CONTI, Sebastiano

IPC: G01L19/06 ,  G01L9/00 ,  G01L15/00

CPC classification number: B81B7/0041 ,  B81B2201/0264 ,  G01L9/0054 ,  G01L9/0072 ,  G01L15/00 ,  G01L19/0645

Abstract: A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.

Abstract translation: 封装的压力传感器，包括：MEMS压力传感器芯片; 以及弹性体材料的封装层，特别是PDMS，其在MEMS压力传感器芯片上方延伸并且形成用于将施加在其表面上的力传递到MEMS压力传感器芯片的装置。

公开(公告)号：EP3141521A1

公开(公告)日：2017-03-15

申请号：EP16161870.7

申请日：2016-03-23

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  CONTI, Sebastiano

IPC: B81B7/00

Abstract: A MEMS device (20) is provided with: a supporting base (22), having a bottom surface (22b) in contact with an external environment; a sensor die (24), which is of semiconductor material and integrates a micromechanical detection structure (25); a sensor frame (30), which is arranged around the sensor die (24) and is mechanically coupled to a top surface (22a) of the supporting base (22); and a cap (36), which is arranged above the sensor die (24) and is mechanically coupled to a top surface (30a) of the sensor frame (30), a top surface (36a) of the cap (36) being in contact with an external environment. The sensor die (24) is mechanically decoupled from the sensor frame (30).

Abstract translation: MEMS器件（20）具有：支撑基座（22），具有与外部环境接触的底面（22b）; 传感器芯片（24），其是半导体材料并且集成了微机械检测结构（25）; 传感器框架（30），其布置在所述传感器模具（24）周围并机械地联接到所述支撑基座（22）的顶表面（22a）; 以及盖（36），其设置在所述传感器模具（24）的上方并且机械地联接到所述传感器框架（30）的顶表面（30a），所述盖子（36）的顶表面（36a）处于 与外部环境接触。 传感器模具（24）与传感器框架（30）机械地分离。

公开(公告)号：EP3098195A1

公开(公告)日：2016-11-30

申请号：EP15200289.5

申请日：2015-12-15

Applicant: STMicroelectronics S.r.l.

Inventor： BRUNO, Giuseppe ,  CONTI, Sebastiano ,  CHIRICOSTA, Mario ,  VAIANA, Michele ,  IPPOLITO, Calogero Marco ,  MAIORE, Mario ,  CASELLA, Daniele

IPC: B81B7/00 ,  G01L19/00

CPC classification number: B81B7/007 ,  B81B7/02 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2207/094 ,  G01L19/0092 ,  G01N27/223 ,  H01L23/3121 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A packaged sensor assembly includes: a packaging structure (2), having at least one opening (18); a humidity sensor (5) and a pressure sensor (10), which are housed inside the packaging structure (2) and communicate fluidically with the outside through the opening (18), and a control circuit (7), operatively coupled to the humidity sensor (5) and to the pressure sensor (10);
wherein the humidity sensor (5) and the control circuit (7) are integrated in a first chip (3), and the pressure sensor (10) is integrated in a second chip (8) distinct from the first chip (3) and bonded to the first chip (3).

Abstract translation: 包装传感器组件包括：具有至少一个开口（18）的包装结构（2）; 湿度传感器（5）和压力传感器（10），其容纳在所述包装结构（2）内并通过所述开口（18）与所述外部流体连通;以及控制电路（7），其可操作地耦合到所述湿度 传感器（5）和压力传感器（10）; 其中所述湿度传感器（5）和所述控制电路（7）集成在第一芯片（3）中，并且所述压力传感器（10）集成在与所述第一芯片（3）不同的第二芯片（8）中并且 到第一芯片（3）。

公开(公告)号：EP2663093A1

公开(公告)日：2013-11-13

申请号：EP11854547.4

申请日：2011-12-22

Applicant: Omron Corporation ,  STMicroelectronics S.r.l.

Inventor： KASAI, Takashi ,  SATO, Shobu ,  UCHIDA, Yuki ,  PADOVANI, Igino ,  DAVID, Filippo ,  CONTI, Sebastiano

IPC: H04R19/04

CPC classification number: H04R19/04 ,  B81B3/0021 ,  H04R1/023 ,  H04R1/086 ,  H04R3/00 ,  H04R3/005 ,  H04R19/005 ,  H04R19/016 ,  H04R31/00 ,  H04R2201/003 ,  H04R2499/11

Abstract: Provided is an acoustic transducer (11) including: a semiconductor substrate (21); a vibrating membrane (23), provided above the semiconductor substrate (21), including a vibrating electrode (220); and a fixed membrane (23), provided above the semiconductor substrate (21), including a fixed electrode (230), the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode (220) and the fixed electrode (230), converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode (220) and the fixed electrode (230) is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.

Abstract translation: 提供一种声换能器（11），包括：半导体衬底（21）; 设置在半导体衬底（21）上方的振动膜（23），包括振动电极（220）; 以及设置在所述半导体衬底（21）上方的固定膜（23），所述固定膜（23）包括固定电极（230），所述声换能器根据所述振动电极（220）和所述固定电极（230）之间的电容的变化来检测声波 ），将声波转换为电信号，并输出电信号。 振动电极（220）和固定电极（230）中的至少一个被分成多个分割电极，并且多个分割电极输出电信号。