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    PACKAGED PRESSURE SENSOR DEVICE AND CORRESPONDING METHOD FOR DETECTING THE PRESENCE OF FOREIGN MATERIAL
    11.
    发明公开
    PACKAGED PRESSURE SENSOR DEVICE AND CORRESPONDING METHOD FOR DETECTING THE PRESENCE OF FOREIGN MATERIAL 审中-公开

    公开(公告)号：EP4242619A1

    公开(公告)日：2023-09-13

    申请号：EP23154620.1

    申请日：2023-02-02

    Applicant: STMicroelectronics S.r.l.

    Inventor： GIUSTI, Domenico ,  DUQI, Enri

    IPC: G01L19/06 ,  G01L19/14 ,  G01L27/00 ,  G01N9/24

    Abstract: A pressure sensor device (1) has: a pressure detection structure (2) provided in a first die (4) of semiconductor material; a package (20), configured to internally accommodate the pressure detection structure in an impermeable manner, the package having a base structure (21) and a body structure (22), arranged on the base structure, with an access opening (30) in contact with an external environment and internally defining a housing cavity (23), in which the first die (4) is arranged covered with a coating material (32). A piezoelectric transduction structure (35), of a ultrasonic type, is accommodated in the housing cavity, in order to allow detection of foreign material (42) above the coating material and within the package. In particular, the piezoelectric transduction structure (35) is integrated in the first die (4), which comprises a first portion (4'), wherein the pressure detection structure (2) is integrated, and a second portion (4"), separate and distinct from the first portion (4'), wherein the piezoelectric transduction structure (35) is integrated.

    RADIATION SENSOR WITH AN INTEGRATED MECHANICAL OPTICAL MODULATOR AND RELATED MANUFACTURING PROCESS
    12.
    发明公开
    RADIATION SENSOR WITH AN INTEGRATED MECHANICAL OPTICAL MODULATOR AND RELATED MANUFACTURING PROCESS 审中-公开

    公开(公告)号：EP4001866A1

    公开(公告)日：2022-05-25

    申请号：EP21209147.4

    申请日：2021-11-18

    Applicant: STMicroelectronics S.r.l.

    Inventor： VAIANA, Michele ,  DUQI, Enri ,  CASTAGNA, Maria Eloisa

    IPC: G01J3/02 ,  G01J3/28 ,  G01J3/18 ,  G02B26/02

    Abstract: Radiation sensor including a detection assembly (102; 202) and a chopper assembly (101), which are mechanically coupled to delimit a main cavity (61; 216); and wherein the chopper assembly (101) includes: a suspended movable structure (55), which extends in the main cavity (61; 261); and an actuation structure (63, 65), which is electrically controllable to cause a change of position of the suspended movable structure (55). The detection unit (102; 202) includes a detection structure (80; 180; 280; 380), which faces the main cavity (61; 261) and includes a number of detection devices (94; 194). The suspended movable structure (55) includes a first shield (34) of conductive material, which shields the detection devices (94) from the radiation, the shielding of the detection devices (94) being a function of the position of the suspended movable structure (55).

    MICROPUMP MEMS DEVICE FOR MOVING OR EJECTING A FLUID, IN PARTICULAR MICROBLOWER OR FLOWMETER
    13.
    发明公开
    MICROPUMP MEMS DEVICE FOR MOVING OR EJECTING A FLUID, IN PARTICULAR MICROBLOWER OR FLOWMETER 审中-公开

    公开(公告)号：EP3726056A1

    公开(公告)日：2020-10-21

    申请号：EP20169715.8

    申请日：2020-04-15

    Applicant: STMicroelectronics S.r.l.

    Inventor： GIUSTI, Domenico ,  BALDO, Lorenzo ,  DUQI, Enri

    IPC: F04B43/04 ,  F04B45/047 ,  F04B43/02

    Abstract: The micropump device (1) is formed in a monolithic body (3) of semiconductor material integrating a plurality of actuator elements (5) arranged side-by-side. Each actuator element (5) has a first chamber (15) extending at a distance from a first face (3A) of the monolithic body; a membrane (18) arranged between the first face (3A) and the first chamber (15); a piezoelectric element (19) extending on the first face (3A) over the membrane (18); a second chamber (20), arranged between the first chamber (15) and a second face (3B) of the monolithic body; a fluidic inlet path (10) fluidically connecting the second chamber (20) with the outside of the monolithic body (3); and a fluid outlet opening (11) extending in a transverse direction in the monolithic body (3) from the second face (3B) as far as the second chamber (20), through the first chamber (15). The monolithic formation of a plurality of actuator elements and the possibility of driving the actuator elements at different voltages enable precise adjustment of flows, from very low values to high values.

    MICROELECTROMECHANICAL ELECTROACOUSTIC TRANSDUCER WITH PIEZOELECTRIC ACTUATION AND CORRESPONDING MANUFACTURING PROCESS
    14.
    发明公开
    MICROELECTROMECHANICAL ELECTROACOUSTIC TRANSDUCER WITH PIEZOELECTRIC ACTUATION AND CORRESPONDING MANUFACTURING PROCESS 审中-公开

    公开(公告)号：EP3687192A1

    公开(公告)日：2020-07-29

    申请号：EP20153473.2

    申请日：2020-01-23

    Applicant: STMicroelectronics S.r.l.

    Inventor： CERINI, Fabrizio ,  DUQI, Enri ,  ADORNO, Silvia ,  BALDO, Lorenzo

    IPC: H04R19/00

    Abstract: An actuation structure (10) of a MEMS electroacoustic transducer (11) is formed in a die (12) of semiconductor material having a monolithic body (13) with a front surface (13a) and a rear surface (13b) extending in a horizontal plane (xy) and defined in which are: a frame (14); an actuator element (15) arranged in a central opening (16) defined by the frame (14); cantilever elements (18), coupled at the front surface (13a) between the actuator element (15) and the frame (14); and piezoelectric regions (19) arranged on the cantilever elements (18) and configured to be biased to cause a deformation of the cantilever elements (18) by the piezoelectric effect. A first stopper arrangement (30) is integrated in the die (12) and configured to interact with the cantilever elements (18) to limit a movement thereof in a first direction of a vertical axis (z) orthogonal to the horizontal plane (xy), towards the underlying central opening (16).

    INTEGRATED THERMAL SENSOR AND MANUFACTURING PROCESS THEREOF
    18.
    发明公开
    INTEGRATED THERMAL SENSOR AND MANUFACTURING PROCESS THEREOF 审中-公开

    公开(公告)号：EP4155696A1

    公开(公告)日：2023-03-29

    申请号：EP22195319.3

    申请日：2022-09-13

    Applicant: STMicroelectronics S.r.l.

    Inventor： DUQI, Enri ,  CASTAGNA, Maria Eloisa

    IPC: G01J5/12 ,  H10N10/17 ,  H10N19/00

    Abstract: Integrated thermal sensor having a housing (21) delimiting an internal space (26). A support region (30) extends through the internal space; a plurality of thermocouple elements (31) are carried by the support region (30) and are electrically coupled to each other. Each thermocouple element (31) is formed by a first and a second thermoelectrically active region (34, 35) of a first and, respectively, a second thermoelectrically active material, the first thermoelectrically active material having a first Seeback coefficient, the second thermoelectrically active material having a second Seeback coefficient, other than the first Seeback coefficient. At least one of the first and second thermoelectrically active regions (34, 35) is a silicon-based material. The first and second thermoelectrically active regions (34, 35) of each thermocouple element (31) are formed by respective elongated regions extending at a mutual distance into the internal space (26) of the housing (21), from and transversely to the support region (300).

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