公开(公告)号：CA2522239C

公开(公告)日：2011-01-04

申请号：CA2522239

申请日：2004-03-12

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： MASUDA YASUHITO ,  OKUDA YASUHIRO ,  HAYASHI FUMIHIRO ,  HAGA TSUYOSHI

IPC: H01R11/01 ,  G01R1/04 ,  G01R31/28 ,  H01L21/48 ,  H01L23/482 ,  H01L23/498 ,  H01R43/00 ,  H05K3/40

Abstract: The present invention is directed to an anisotropic conductive film and manufacturing methods thereof, in which an electrically insulative porous film made of synthetic resin is used as a base film and in which conductive parts capable of being provided with conductiveness in the film thickness direction are formed independently at plural positions of the base film by adhering conductive metal to resinous parts of porous structure in such a manner as piercing through from a first surface to a second surface.

公开(公告)号：DE60133791T2

公开(公告)日：2009-06-25

申请号：DE60133791

申请日：2001-05-31

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： HAGA TSUYOSHI ,  OKUMURA KATSUYA ,  HAYASAKA NOBUO ,  SHIBATA HIDEKI ,  MATSUNAGA NORIAKI

IPC: G01R1/067 ,  G01R31/26 ,  G01R3/00 ,  H01L21/66

Abstract: A contact probe is fabricated by a method including a lithography step and a plating step. The contact probe includes a plunger unit (1) to form contact with a circuit to be tested, a spring unit (2), and a lead wire connection unit (3), all formed integrally so as to have a three dimensional configuration with uniform thickness with respect to a predetermined plane configuration in a thickness direction perpendicular to the predetermined plane configuration. Preferably, a guide unit (6) parallel to the spring unit (2) is also formed integrally. Further preferably, the contact probe is formed integrally also including a stopper (7) for each unitary configuration of the spring unit (2) constituted by a leaf spring.

公开(公告)号：DE60218985D1

公开(公告)日：2007-05-03

申请号：DE60218985

申请日：2002-01-22

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： HIRATA YOSHIHIRO ,  HAGA TSUYOSHI ,  NUMAZAWA TOSHIYUKI ,  NAKAMAE KAZUO ,  OKADA KAZUNORI ,  YORITA JUN

IPC: G01R1/067 ,  G01R3/00 ,  G01R15/24 ,  H01L21/66

Abstract: A contact is formed of a tip end portion (11) approximately cylindrical as a whole in shape, having at one end a contact end to come into contact with a circuit under test, and a base portion (12) provided to be opposed to and kept apart from the other end that is opposite to the contact end of the tip end portion. By pressing the tip end portion into contact with a circuit under test (20), the tip end portion and the base portion are brought into contact with each other, and further pushing causes dislocation at the contact surfaces (14,15) so that the tip end portion is moved in a direction parallel to a surface of the circuit under test. Therefore, when the contact probe is pressed into contact with the circuit under test, the contact end of the contact probe is moved such that it scrapes off the surface of the circuit under test to break the insulating film on the surface, resulting in reliable contact with the circuit under test.

公开(公告)号：FI117915B

公开(公告)日：2007-04-13

申请号：FI20041464

申请日：2004-11-15

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： HAGA TSUYOSHI

IPC: H01R13/115 ,  H01R13/03 ,  H01R13/05

Abstract: An object of the present invention is to provide an electrode for high-density connection capable of attachment/detachment of a package or an FPC. In order to attain this object, a snap electrode according to the present invention has a tubular ring presenting a circular or polygonal section and at least one spring electrode provided in the ring and coupled to the ring, to be connected to a substrate or an FPC by holding a pin electrode of an insertion-mount type package or the FPC with the spring electrode. The snap electrode preferably consists of nickel or a nickel alloy or consists of copper or a copper alloy, and is preferably coated with a noble metal or conductive diamondlike carbon.

公开(公告)号：EP1612891A4

公开(公告)日：2007-11-21

申请号：EP04720240

申请日：2004-03-12

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： MASUDA YASUHITO ,  OKUDA YASUHIRO ,  HAYASHI FUMIHIRO ,  HAGA TSUYOSHI

IPC: H01R11/01 ,  G01R1/04 ,  G01R31/28 ,  H01L21/48 ,  H01L23/482 ,  H01L23/498 ,  H01R43/00 ,  H05K3/40

CPC classification number: H01L23/4828 ,  G01R1/0408 ,  G01R31/2863 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01R43/007 ,  H05K3/4069 ,  Y10T428/24917 ,  H01L2924/00

Abstract: An anisotropic electrically conductive film comprising a base film in the form of a porous film made of synthetic resin and having an electric insulation property, and an electrically conductive metal adhered to a resin section of porous construction in such a manner as to penetrate from a first surface to a second surface at a plurality of places on the base film, wherein electrically conductive sections which can be made electrically conductivity in the direction of the film thickness are independently provided; and a method of producing the same.

公开(公告)号：EP1637261A4

公开(公告)日：2009-03-11

申请号：EP04736126

申请日：2004-06-04

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： OKUDA YASUHIRO ,  HAYASHI FUMIHIRO ,  HAGA TSUYOSHI ,  FUJITA TARO ,  UENOYAMA MAYO ,  MASUDA YASUHITO ,  IDOMOTO YUICHI

IPC: H05K3/00 ,  B23B35/00 ,  B29C67/20 ,  H05K3/42

CPC classification number: B29C44/5618 ,  B29C67/202 ,  H05K3/0011 ,  H05K3/0055 ,  H05K3/422 ,  H05K3/426 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2203/0565 ,  H05K2203/0769 ,  H05K2203/1147 ,  Y10T29/49167

Abstract: A method of manufacturing a drilled porous resin base material with conductive drilled inner wall surfaces, comprising a step 1 for penetrating liquid or solution into the porous structure of the porous resin base material, a step 2 for forming solid matter from the penetrated liquid or solution, a step 3 for forming a plurality of drilled holes passed from the first surface to the second surface of the porous resin base material having the solid matter in the porous structure, and a step 4 for melting or dissolving the solid matter and removing it from the porous structure. The method also comprises the step for selectively adhering catalysts to only the inner wall surfaces of the drilled holes and adhering a conductive metal to the inner wall surfaces.

公开(公告)号：EP1460434A4

公开(公告)日：2008-12-03

申请号：EP02805880

申请日：2002-10-10

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： HAGA TSUYOSHI ,  SHIMADA SHIGEKI ,  KIMURA ATSUSHI

IPC: G01R1/067 ,  H01L21/66

CPC classification number: G01R1/06738

Abstract: A contact probe comprises a tip part to be brought into contact with a surface to be measured, a support part for support and electrical connection, and a spring part for connecting the tip part to the support part. The radius of curvature of the corner on the backside of the tip part in scrubbing while being in press contact is smaller than the corner on the front side. In scrubbing, the insulating film of the surface to be measured can be sufficiently removed while ensuring the electrical connection. Further, the adhering shavings can be reduced when the probe is moved off the surface, and the scratches on the surface can be also reduced. A contact probe of the invention has a predetermined projection and a bottom portion in a recess of the tip part. The projection breaks the insulating film of the curved surface to be measured to ensure the electrical contact. The bottom portion of the recess is brought into contact with the object to be measured, thereby preventing excessive bite of the projection.

公开(公告)号：EP1387174A4

公开(公告)日：2005-09-28

申请号：EP02718523

申请日：2002-04-10

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： HAGA TSUYOSHI ,  OKADA KAZUNORI

IPC: C22C19/00 ,  C22C19/03 ,  C22C19/07 ,  C25D1/10 ,  G01R1/067 ,  G01R1/073 ,  H05K3/20

CPC classification number: G01R1/07314 ,  C22C19/03 ,  C22C19/07 ,  C25D1/10 ,  G01R1/06716

Abstract: A contact probe produced by forming a resin mold having a hole portion on a conductive substrate and burying the hole portion with a metal by electrocasting, the metal containing a cobalt-tungsten alloy. Or, a cobalt-molybdenum alloy may be used in place of a cobalt-tungsten alloy. Or, a contact probe is formed from nickel and cobalt or copper and a coating of a cobalt-tungsten alloy or a cobalt-molybdenum alloy is formed thereon to increase a wear resistance. A nickel-molybdenum alloy may be used in place of a cobalt-tungsten alloy and a cobalt-molybdenum alloy.

Abstract translation: 通过在具有导电性的基板上形成具有空腔的树脂模具并通过电铸将金属填充到空腔中来制造接触探针。 金属包括钴 - 钨合金。 或者，可以使用钴 - 钼合金代替钴 - 钨合金。 或者，接触探针可以由镍，钴或铜制成，并且在其上形成钴 - 钨合金或钴 - 钼合金的涂膜以增加耐磨性。 可以使用镍 - 钼合金代替钴 - 钨合金或钴 - 钼合金。

公开(公告)号：EP1919034A4

公开(公告)日：2009-12-02

申请号：EP06745939

申请日：2006-05-01

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： FUJITA TARO ,  OKUDA YASUHIRO ,  HAGA TSUYOSHI

IPC: G01R1/06 ,  G01M99/00 ,  G01R31/26 ,  H01B5/16 ,  H01R13/00 ,  H01R43/00

CPC classification number: H01R12/7076 ,  G01R1/0466 ,  H01R12/714 ,  H01R13/035 ,  Y10T29/49117 ,  Y10T408/03 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249987 ,  Y10T428/249988 ,  Y10T428/249989

公开(公告)号：EP1440931A4

公开(公告)日：2008-03-26

申请号：EP02777967

申请日：2002-10-25

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： YORITA JUN ,  HIRATA YOSHIHIRO ,  HAGA TSUYOSHI

IPC: B81C1/00 ,  C25D1/00 ,  H01L21/48 ,  H05K3/20

CPC classification number: B81C99/0085 ,  B81C2201/032 ,  C25D1/003 ,  H01L21/4821 ,  H05K3/202 ,  H05K3/205

Abstract: A method for manufacturing a metal microstructure 1 comprising a resin mold 13. For setting a mild manufacturing condition with little damage of the resin mold 13, and for mass-producing a high- precision metal microstructure 1 by uniform casting, this method is characterized by having the step of forming a resin mold laminate by fixing on a conductive substrate 11 a resin mold 13 having a vacancy penetrating in the thickness direction via a photosensitive polymer 12 the chemical composition of which is varied by an electron ray, ultraviolet ray, or a visible ray, the step of exposing the resin type laminate 2 to the electron ray, ultraviolet ray, or visible ray, the step of removing a photosensitized polymer 12c present in the vacancy of the resin mold 13, and the step of filling the vacant section of the resin type laminate 2 with a metal 14 by casting.

Abstract translation: 用于制造包括树脂模具13的金属微结构1的方法。为了设定温和的制造条件而对树脂模具13损坏很小，并且为了通过均匀铸造来批量生产高精度金属微结构1，该方法的特征在于： 具有通过在导电性基体11上固定经由感光性聚合物12而具有在厚度方向上贯通的空隙的树脂模具13来形成树脂模制层叠体的工序，该感光性聚合物12的化学组成根据电子射线，紫外线或 可见光，将树脂型层压体2暴露于电子射线，紫外线或可见光线的步骤，去除存在于树脂模具13的空隙中的光敏聚合物12c的步骤，以及填充空白部分 通过铸造将树脂型层叠体2与金属14接合。