公开(公告)号：JP2002162576A

公开(公告)日：2002-06-07

申请号：JP2001284223

申请日：2001-09-19

Applicant: XEROX CORP

Inventor： SUN DECAI ,  MICHAEL A ROSA ,  PEETERS ERIC ,  LEMMI FRANCESCO ,  MAEDA PATRICK Y ,  CHUA CHRISTOPHER L

IPC: G02B26/08 ,  B81B1/00 ,  B81B3/00 ,  B81C1/00

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a three-dimensional MEMS structure. SOLUTION: The method of manufacturing the molded optical MEMS component, having stress thin films has a step of providing the component with a substrate having a surface, a step of adhering a sacrificial layer onto this surface, a step of arranging a lift-off mask on the sacrificial layer in order to delineate the optical MEMS component, a step of adhering a stress gradient layer on the sacrificial layer, a step of removing the lift-off mask and portions of the stress gradient layer existing on the lift-off mask and a step of making the optical MEMS component, by releasing the stress gradient layer from the sacrificial layer.

公开(公告)号：JP2001250935A

公开(公告)日：2001-09-14

申请号：JP2000400871

申请日：2000-12-28

Applicant: XEROX CORP

Inventor： MEI PING ,  LU JENG PING ,  LEMMI FRANCESCO ,  STREET ROBERT A ,  BOYCE JAMES B

IPC: H01L27/146 ,  H04N5/335

Abstract: PROBLEM TO BE SOLVED: To provide a high fill factor image array which reduces the contact injection current to reduce the vertical leak current. SOLUTION: The sensor comprises an intrinsic amorphous silicon layer 50, p-doped silicon layer 52 coupled with a first surface of the intrinsic amorphous silicon layer 50, first transparent electrode 54 coupled with the p-doped silicon layer, and at least one nonmetal back contact 48 coupled with a second surface of the intrinsic amorphous silicon layer 50. The back contact 48 is intended to collect charges from one region of the intrinsic amorphous silicon layer 50, and to give the collected charges to a detecting electronic unit 108.

公开(公告)号：JP2001225502A

公开(公告)日：2001-08-21

申请号：JP2000385096

申请日：2000-12-19

Applicant: XEROX CORP

Inventor： LEMMI FRANCESCO ,  CHUA CHRISTOPHER L ,  MEI PING ,  LU JENG PING ,  DAVID K FALK ,  MCINTYRE HARRY J

IPC: B41J2/44 ,  B41J2/45 ,  B41J2/455 ,  B81B3/00 ,  H01L25/075 ,  H01L31/101 ,  H01L31/105 ,  H01S5/02 ,  H01S5/026 ,  H01S5/40

Abstract: PROBLEM TO BE SOLVED: To form a sensor executing periodic calibration of print bars without complicating the process for forming the device. SOLUTION: Metal patterns 54a-n are formed on a substrate 40. The metal pattern 54a-n has a secured part and a free part 60a-n bent outward formed on the surface of the substrate 40 by removing a part of a passivation/release layer 48. A sensor 53 is formed on the same substrate 40 while including an active layer 33. An active layer 44 may be substantially transparent to light of infrared wavelength. The metal patterns 54a-n becoming micro spring inner wiring and the sensor 53 are integrated on the substrate using a compatible fabrication process.