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公开(公告)号：US11764686B1
公开(公告)日：2023-09-19
申请号：US17580206
申请日：2022-01-20
Applicant: Vicor Corporation
Inventor： Patrizio Vinciarelli
IPC: H01H47/00 , H02M3/335 , H05K1/18 , H05K1/02 , H05K1/16 , H05K3/02 , H01F27/28 , H01F41/04 , H02M3/337 , H02M1/44 , H01F1/44 , H01F3/10 , H05K3/00 , H02M1/00
CPC classification number: H02M3/33523 , H01F1/44 , H01F3/10 , H01F27/2804 , H01F41/041 , H02M1/44 , H02M3/3376 , H02M3/33561 , H02M3/33592 , H05K1/0298 , H05K1/165 , H05K1/181 , H05K3/0011 , H05K3/02 , H01F1/447 , H01F2003/106 , H01F2027/2809 , H01F2027/2819 , H02M1/008 , H02M1/0058 , H05K1/0204 , H05K1/0265 , H05K2201/08 , H05K2201/086
Abstract: A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.
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12.发明申请公开(公告)号：US20170188455A1
公开(公告)日：2017-06-29
申请号：US14998263
申请日：2015-12-26
Applicant: Intel Corporation
Inventor： Yoshihiro Tomita , Joshua D. Heppner , Shawna M. Liff , Pramod Malatkar
CPC classification number: H05K1/0393 , A41D1/002 , A41D13/0015 , A43B1/0054 , A43B3/0005 , H05K1/03 , H05K1/118 , H05K1/189 , H05K3/0011 , H05K3/007 , H05K3/32 , H05K2201/0129 , H05K2201/0203 , H05K2201/0215 , H05K2201/08 , H05K2201/083 , H05K2203/0152 , H05K2203/104
Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.
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公开(公告)号：US09544989B2
公开(公告)日：2017-01-10
申请号：US14945073
申请日：2015-11-18
Applicant: CYNTEC CO., LTD.
Inventor： Chih-Tse Chen , Joseph D. S. Deng , Shih-Hsien Tseng
IPC: H01H9/28 , H05K5/00 , H05K1/02 , H05K9/00 , H05K1/00 , H05K7/00 , H05K1/11 , H05K1/18 , H02B5/00
CPC classification number: H05K1/0216 , H05K1/00 , H05K1/0233 , H05K1/0243 , H05K1/025 , H05K1/111 , H05K1/181 , H05K5/00 , H05K5/0026 , H05K7/00 , H05K9/0022 , H05K2201/08 , H05K2201/1003
Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. Any two adjacent Ethernet transformers are separately arranged with a gap having a second specific length.
Abstract translation: 公开了一种网络通信设备。 网络通信设备包括电路板，网络连接器，网络芯片和多个网络磁性组件。 网络连接器，网络芯片和网络磁性组件设置在电路板上。 网络磁性组件分别与网络连接器和网络芯片电连接。 每个网络磁性组件包括以太网变压器和至少一个电感器。 以太网变压器通过电路板的导电迹线与电感器串联电连接。 任何两个相邻的以太网变压器分别布置有具有第二特定长度的间隙。
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公开(公告)号：US20160007475A1
公开(公告)日：2016-01-07
申请号：US14771590
申请日：2014-03-04
Applicant: D.R.E.T. TECHNOLOGY SAGL
Inventor： Davide ZANESI
CPC classification number: H05K3/0064 , B41F15/00 , B41J2/01 , H05K1/0271 , H05K1/0283 , H05K1/0326 , H05K1/038 , H05K1/09 , H05K1/189 , H05K3/1208 , H05K3/1216 , H05K2201/0145 , H05K2201/029 , H05K2201/0323 , H05K2201/08 , H05K2203/1366
Abstract: The present invention relates to the very innovative field of smart textiles. More particularly the present invention discloses an innovative process for screen printing of textile substrates, by means of primers, for depositing on said substrates dielectric, conductive, resistive, magnetic, electroluminescent materials and many others.
Abstract translation: 本发明涉及智能纺织品非常创新的领域。 更具体地，本发明公开了一种用于通过底漆丝网印刷纺织品基底的创新方法，用于沉积在所述基底电介质，导电，电阻，磁性，电致发光材料等上。
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15.发明申请ELECTRICAL COMPONENT FOR ATTACHMENT TO PAPER AND OTHER SUBSTRATES AND MAGNETIC ATTACHMENT MECHANISM 有权用于连接纸和其他基材的电气部件和磁性附着机构公开(公告)号：US20150302964A1
公开(公告)日：2015-10-22
申请号：US14687040
申请日：2015-04-15
Applicant: Electroninks Writeables, Inc.
Inventor： Michael A. Bell , Analisa Russo
CPC classification number: H01F7/0252 , H05K1/0386 , H05K1/11 , H05K1/181 , H05K3/325 , H05K2201/0311 , H05K2201/08 , H05K2201/10234 , H05K2201/10265 , H05K2203/104
Abstract: An electrical component for attachment to paper and other substrates comprises, according to one embodiment, a functional electronic part including one or more support pillars on an underside thereof. Each of the support pillars comprises: a channel extending therethrough from a top opening to a bottom opening, where the top opening of the channel is adjacent to the functional electronic part; and a magnet moveably positioned in the channel in electrical contact with the functional electronic part, where the bottom opening of the channel has a width smaller than a maximum lateral dimension of the magnet.
Abstract translation: 根据一个实施例，用于附接到纸和其它基底的电气部件包括在其下侧上包括一个或多个支撑柱的功能电子部件。 每个支撑柱包括：从顶部开口延伸到底部开口的通道，其中通道的顶部开口与功能电子部件相邻; 以及可移动地定位在所述通道中的与所述功能电子部件电接触的磁体，其中所述通道的底部开口具有小于所述磁体的最大横向尺寸的宽度。
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Patent Agency Ranking
公开(公告)号：US12016115B2
公开(公告)日：2024-06-18
申请号：US17956999
申请日：2022-09-30
Applicant: SHENNAN CIRCUITS CO., LTD.
Inventor： Beilei Wang , Weijing Guo , Zhanhao Xie
CPC classification number: H05K1/0263 , H05K1/113 , H05K3/103 , H05K2201/0355 , H05K2201/07 , H05K2201/08
Abstract: Disclosed are an embedded circuit board and a fabrication method therefor. The embedded circuit board comprises: a circuit board body; signal transmission layers (1200), wherein the signal transmission layers are arranged on two opposite sides of the circuit board body; bonding layers, wherein the bonding layers are arranged between at least one signal transmission layer and the circuit board body and used for bonding the signal transmission layer to the circuit board body; metal bases which are embedded in the circuit board body and are electrically connected to the signal transmission layers on two opposite sides of the circuit board body; conductive parts which are arranged at the positions in the bonding layers corresponding to the metal bases, and are electrically connected to the signal transmission layer and the metal bases; and magnetic cores embedded in the circuit board body.
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公开(公告)号：US11813546B1
公开(公告)日：2023-11-14
申请号：US18054130
申请日：2022-11-09
Applicant: SPIN MASTER LTD.
Inventor： Amir Haddadi , Benjamin Elias Dermer , Paul Andrew Reynolds , Amrit Dhoot , Martin Labrecque
IPC: A63H13/00 , A63H33/26 , A63H33/22 , A63H5/00 , H05B47/155 , H05K1/16 , H05K1/02 , G06F3/16 , G06F3/044 , G06F3/041
CPC classification number: A63H33/26 , A63H5/00 , A63H33/22 , H05B47/155 , H05K1/028 , H05K1/16 , A63H2200/00 , G06F3/044 , G06F3/0416 , G06F3/165 , H05K2201/08 , H05K2201/10106
Abstract: A toy includes a magnetically responsive member, a fulcrum member, a printed circuit board (PCB), a lid covering the PCB, an activation switch, a touch sensor, a motion sensor, an audio transducer, a signal generator and a controller. The flexible PCB includes an electromagnetic coil, and a plurality of light emitting diodes (LEDs). Opening of the lid actuates the activation switch, and in response, the controller controls the signal generator to generate a coil control signal for the electromagnetic coil to produce a magnetic field that interacts with the magnetically responsive member, to induce oscillatory flapping of the PCB. In response to detecting a touch signal from the controller, or a motion signal from the motion sensor, the controller also generates a LED control signal to control illumination of the LEDs while the PCB is flapping, and an audio control signal to control the audio transducer to output sound.
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18.发明公开公开(公告)号：US20230343506A1
公开(公告)日：2023-10-26
申请号：US18216277
申请日：2023-06-29
Applicant: Rockwell Automation Technologies, Inc.
Inventor： Gennadi Sizov , Zoran Vrankovic , Gary L. Skibinski
CPC classification number: H01F27/2804 , H01F27/346 , H01F27/2885 , H02M1/12 , H05K1/181 , H01F2027/2809 , H05K2201/08 , H05K2201/0792
Abstract: A system and method for integrating a magnetic component within a power converter includes a coil integrated on a PCB. The PCB includes multiple layers and traces on each layer to form a single coil or to form multiple coils on the magnetic component. The PCB further includes at least one opening in the PCB through which a core component may pass, such that the magnetic component is defined by the coils and the core material. To reduce eddy currents built up within the traces, the dimensions of traces on a layer are varied and the position of traces between layers of the PCB are varied. The widths and locations of individual traces are selected to reduce coupling of the trace to leakage fluxes within the magnetic component. A floating conductive layer may also be provided to still further reduce the magnitude of eddy currents induced within the coil.
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公开(公告)号：US20230199962A1
公开(公告)日：2023-06-22
申请号：US18078238
申请日：2022-12-09
CPC classification number: H05K1/14 , H05K1/115 , H05K1/181 , H05K3/0014 , H05K2201/08 , H05K2201/047
Abstract: A three dimensional circuit module can include: a plurality of PCBs located on different faces, where surfaces of the PCBs include circuit modules; a plurality of circuit assemblies connected through components; where the plurality of circuit assemblies comprises at least one first circuit assembly having a first main board and at least one first side board that are located on different faces, where the first main board and at least one first side board of the first circuit assembly are obtained by integrated curing molding process; and where the first main board of the first circuit assembly is located on one PCB board, and the first side board is located on an adjacent PCB board, in order to realize connection of adjacent PCBs.
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公开(公告)号：US11682980B1
公开(公告)日：2023-06-20
申请号：US17572691
申请日：2022-01-11
Applicant: Vicor Corporation
Inventor： Patrizio Vinciarelli
CPC classification number: H02M7/003 , H01F27/2804 , H01F27/40 , H05K1/165 , H01F2027/2809 , H05K1/18 , H05K2201/08 , H05K2201/10015 , H05K2201/10053
Abstract: An improved distributed-output multi-cell-element power converter utilizes a multiplicity of magnetic core elements, switching elements, capacitor elements and terminal connections in a step and repeat pattern. Stepped secondary-winding elements reduce converter output resistance and improve converter efficiency and scalability to support the high current requirements of very large scale integrated (“VLSI”) circuits.
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