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    CIRCUIT PROTECTION DEVICE
    15.
    发明申请
    CIRCUIT PROTECTION DEVICE 审中-公开
    电路保护装置

    公开(公告)号：WO2004100186A1

    公开(公告)日：2004-11-18

    申请号：PCT/US2004/013226

    申请日：2004-04-30

    Applicant: TYCO ELECTRONICS CORPORATION

    Inventor： BLECKER, Paul, N. ,  MANIRAJ, Sirikhit ,  PINEDA, Martin, ,  VRANICAR, Anthony ,  YANKELLO, Francis, M. ,  WASILEWSKI, Frank

    IPC: H01C1/144

    CPC classification number: H01C1/016 ,  H01C1/1406 ,  H01C1/144 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10643 ,  Y02P70/613

    Abstract: A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5, 7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion, The first attachment portion may contain a slot (49) and a solid hinge portion (51). When the device is mounted on a substrate by means of a mounting component (41) extending from the first terminal, the first flexible portion allows contraction and expansion of the conductive polymer despite the rigid attachment of the mounting component onto the substrate.

    Abstract translation: 一种适于表面安装在基板（19）上的电路保护装置（31）。 该装置具有由导电聚合物组合物构成并位于第一和第二电极（5,7）之间的层状PTC电阻元件（3）。 连接到第一电极的是包含导电材料的第一电端子（33），其具有借助于第一连接部分（47）连接到第一柔性部分（39）的第一附接部分（35）。 第一柔性部分的至少一部分不与第一电极连接。 第一附接部分与第一连接部分和第一柔性部分中的至少一个共面。第一附接部分可以包含狭槽（49）和固定铰链部分（51）。 当通过从第一端子延伸的安装部件（41）将装置安装在基板上时，尽管将安装部件刚性地附接到基板上，但是第一柔性部分允许导电聚合物的收缩和膨胀。

    コンデンサ回路及びコンデンサ回路の実装方法
    17.
    发明申请
    コンデンサ回路及びコンデンサ回路の実装方法 审中-公开
    电容器电路和安装电容器电路的方法

    公开(公告)号：WO2004017342A1

    公开(公告)日：2004-02-26

    申请号：PCT/JP2002/008333

    申请日：2002-08-16

    Applicant: 富士通株式会社 ,  小寺 栄一 ,  廣瀬 達哉

    Inventor： 小寺 栄一 ,  廣瀬 達哉

    IPC: H01G2/06

    CPC classification number: H01G4/38 ,  H01G2/065 ,  H01G4/228 ,  H05K1/0231 ,  H05K1/181 ,  H05K3/328 ,  H05K3/3442 ,  H05K3/4015 ,  H05K2201/10469 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10643 ,  H05K2203/049 ,  Y02P70/611

    Abstract: Degradation and variation of wideband characteristics of a capacitor circuit where capacitors are parallel connected are suppressed. A capacitor (15) having electrodes (15a, 15b) on its top and bottom faces and a metal block (16) having the same height as the capacitor (15) are mounted on an input/output pattern (13). A capacitor (17) having electrodes on its side faces is disposed on the electrode (15a) of the top of the capacitor (15) and on the metal block (16). Therefore, the electrode (15b) of the capacitor (15) and the bottom face of the metal block (16) are in surface contact with the input/output pattern (13). The electrodes (17a, 17b) of the capacitor (17) are in surface contact with the electrode (15a) of the capacitor (15) and the top surface of the metal block (16). Thus, the soldering can be effected with a small amount of solder, and degradation and variation of the wideband characteristics of the capacitor circuit are suppressed.

    Abstract translation: 抑制电容器并联连接的电容器电路的宽带特性的劣化和变化。 在其上表面上具有电极（15a，15b）的电容器（15）和与电容器（15）具有相同高度的金属块（16）安装在输入/输出图案（13）上。 在电容器（15）的顶部的电极（15a）和金属块（16）上设置在其侧面上具有电极的电容器（17）。 因此，电容器（15）的电极（15b）和金属块（16）的底面与输入/输出图案（13）表面接触。 电容器（17）的电极（17a，17b）与电容器（15）的电极（15a）和金属块（16）的上表面表面接触。 因此，可以用少量的焊料进行焊接，并且抑制了电容器电路的宽带特性的劣化和变化。

    IMPROVEMENTS IN OR RELATING TO THERMAL TRIP ARRANGEMENTS
    19.
    发明申请
    IMPROVEMENTS IN OR RELATING TO THERMAL TRIP ARRANGEMENTS 审中-公开
    改善或相关于热牵连安排

    公开(公告)号：WO98031203A1

    公开(公告)日：1998-07-16

    申请号：PCT/GB1998/000025

    申请日：1998-01-06

    IPC: H01C7/10 ,  H01H37/76 ,  H02H9/04 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H02H5/04

    CPC classification number: H01H37/761 ,  H01C7/10 ,  H01H2037/046 ,  H01H2037/763 ,  H02H9/042 ,  H05K1/0201 ,  H05K1/184 ,  H05K3/3442 ,  H05K2201/10181 ,  H05K2201/10643 ,  H05K2203/159 ,  H05K2203/176

    Abstract: A varistor with no connecting legs extending from it, is mounted in a slot formed in a printed circuit board (20). The printed circuit board carries the normal circuit tracks (22, 24, 26). The physical and electrical connection between the printed circuit board (20) and the varistor is achieved by the use of solder (28). When the varistor overheats to a temperature beyond a predetermined temperature, the solder melts and the varistor is separated from the printed circuit board (20). A leaf spring (30) which is biased when the varistor is inserted into the slot pushes the varistor out of the slot when the solder (28) melts. Alternatively, when the solder (28) melts gravity causes the varistor to fall out of the printed circuit board (20).

    Abstract translation: 具有从其延伸的没有连接支脚的变阻器安装在形成在印刷电路板（20）中的槽中。 印刷电路板承载正常电路轨道（22,24,26）。 印刷电路板（20）和压敏电阻之间的物理和电气连接通过使用焊料（28）实现。 当压敏电阻过热到超过预定温度的温度时，焊料熔化，并且变阻器与印刷电路板（20）分离。 当压敏电阻插入插槽时被偏置的板簧（30）当焊料（28）熔化时将压敏电阻推出槽。 或者，当焊料（28）重力熔化时，压敏电阻从印刷电路板（20）脱落。

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