Abstract:
A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5, 7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion, The first attachment portion may contain a slot (49) and a solid hinge portion (51). When the device is mounted on a substrate by means of a mounting component (41) extending from the first terminal, the first flexible portion allows contraction and expansion of the conductive polymer despite the rigid attachment of the mounting component onto the substrate.
Abstract:
A semiconductor package includes contact bumps configured as passive circuit components. One or more contact bumps of the semiconductor package may be formed o configured as pull-up resistors, pull-down resistors, capacitors or inductors.
Abstract:
Degradation and variation of wideband characteristics of a capacitor circuit where capacitors are parallel connected are suppressed. A capacitor (15) having electrodes (15a, 15b) on its top and bottom faces and a metal block (16) having the same height as the capacitor (15) are mounted on an input/output pattern (13). A capacitor (17) having electrodes on its side faces is disposed on the electrode (15a) of the top of the capacitor (15) and on the metal block (16). Therefore, the electrode (15b) of the capacitor (15) and the bottom face of the metal block (16) are in surface contact with the input/output pattern (13). The electrodes (17a, 17b) of the capacitor (17) are in surface contact with the electrode (15a) of the capacitor (15) and the top surface of the metal block (16). Thus, the soldering can be effected with a small amount of solder, and degradation and variation of the wideband characteristics of the capacitor circuit are suppressed.
Abstract:
A sensing device includes a printed circuit board (PCB) having a conductive trace. A micro-controller is attached to the conductive trace and data transmission means is connected to the micro-controller. A sensor is embedded within the PCB and is connected to the micro-controller via the conductive trace. The sensor is configured to sense at least one physiological parameter in a patient.
Abstract:
A varistor with no connecting legs extending from it, is mounted in a slot formed in a printed circuit board (20). The printed circuit board carries the normal circuit tracks (22, 24, 26). The physical and electrical connection between the printed circuit board (20) and the varistor is achieved by the use of solder (28). When the varistor overheats to a temperature beyond a predetermined temperature, the solder melts and the varistor is separated from the printed circuit board (20). A leaf spring (30) which is biased when the varistor is inserted into the slot pushes the varistor out of the slot when the solder (28) melts. Alternatively, when the solder (28) melts gravity causes the varistor to fall out of the printed circuit board (20).
Abstract:
The present invention relates to a method for the series production of a plurality of contacted electronic components (7), and particularly of modules and/or power modules and/or light emitting diodes and/or general electronic power components. The task of the invention is to provide an inexpensive and simple method for the series production of contacted electronic components (7) in large quantity. The present invention is characterized in that a first tape provided with components (7) and a second tape comprising an exposed metal conductor (15) are superimposed such that in the claimed continuous method mechanical and/or electrical contacting of the respective metal conductors (15) to the respective contact surface (9) of the respective electronic component (7) can be performed. Both tapes can be produced in the form of reels. The electronic components (7) can be produced individually or as individual reels after contacting. Thus, a particularly effective production method can be provided. The method is particularly suited for electronic power components that can additionally comprise heat-dissipating layers 19 in a simple way.