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    BIOMIMETIC COMPOUNDS AND SYNTHETIC METHODS THEREFOR
    191.
    发明申请
    BIOMIMETIC COMPOUNDS AND SYNTHETIC METHODS THEREFOR 审中-公开
    生物化合物及其合成方法

    公开(公告)号：WO2008019352A1

    公开(公告)日：2008-02-14

    申请号：PCT/US2007/075299

    申请日：2007-08-06

    Applicant: NERITES CORPORATION ,  LEE, Bruce, P.

    Inventor： LEE, Bruce, P.

    IPC: C08F8/00 ,  C08G61/02

    CPC classification number: C08G69/40 ,  C08F8/00 ,  C08G65/33389 ,  C08G71/04 ,  C09D5/1637 ,  C09J171/02 ,  C09J175/04 ,  C09J201/06

    Abstract: Synthesis methods for creating polymeric compounds comprising dihydroxyphenyl derivatives (DHPD), or DHPp i.e. polymers modified with DHPD, with desired surface active effects are described. The polymer backbone of DHPp has structural or performance features that can be tailored to control physical properties of DHPp, allowing it to be useful for different applications i.e. tissue adhesives or sealants, adhesion promoting coatings, and antifouling coatings.

    Abstract translation: 描述了用于产生包含二羟基苯基衍生物（DHPD）或DHPp，即用DHPD改性的聚合物的聚合化合物的合成方法，其具有所需的表面活性效果。 DHPp的聚合物骨架具有结构或性能特征，其可以被调整以控制DHPp的物理性能，使其可用于不同的应用，即组织粘合剂或密封剂，粘附促进涂层和防污涂料。

    ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITIONS
    193.
    发明申请
    ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITIONS 审中-公开
    各向异性导电粘合剂组合物

    公开(公告)号：WO1998027178A1

    公开(公告)日：1998-06-25

    申请号：PCT/EP1997007158

    申请日：1997-12-15

    Applicant: SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V.

    Inventor： SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V. ,  IYER, Shridhar, Ratnaswamy ,  WONG, Pui, Kwan

    IPC: C09J09/02

    CPC classification number: C09J9/02 ,  C09J201/06 ,  H05K3/323 ,  H05K2203/124 ,  Y10T156/10

    Abstract: A novel thermally reworkable anisotropic conductive adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises (a) a thermally reworkable cross-linked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and (b) at least one electrically conductive material present in an effective amount to provide a conducting medium in only one direction.

    Abstract translation: 提供了一种用于将半导体器件附接到衬底的新颖的可热再加工的各向异性导电粘合剂组合物。 所述组合物包含（a）通过使至少一种官能度大于1的亲二烯体和至少一种2,5-二烷基取代的含呋喃的聚合物反应制备的热可再加工的交联树脂，和（b）至少一种导电 存在有效量的材料以仅在一个方向上提供导电介质。

    AQUEOUS DISPERSION AND AQUEOUS DISPERSION COMPOSITION
    194.
    发明申请
    AQUEOUS DISPERSION AND AQUEOUS DISPERSION COMPOSITION 审中-公开
    水分散和水分散体组成

    公开(公告)号：WO1998026006A1

    公开(公告)日：1998-06-18

    申请号：PCT/JP1997004472

    申请日：1997-12-05

    Applicant: KYOWA YUKA CO., LTD. ,  JIMBO, Shinichiro ,  MATSUSHITA, Shoshiro ,  SHIMIZU, Ikuo ,  HOTTA, Iwao ,  IKUTA, Masanori ,  ITANI, Izumi

    Inventor： KYOWA YUKA CO., LTD.

    IPC: C08L101/06

    CPC classification number: C09J201/06 ,  C07D327/04 ,  C08G75/28 ,  C08K5/38 ,  C08L81/00 ,  C09D201/06 ,  C08L2666/04

    Abstract: An aqueous dispersion comprising the following copolymers (A) and (B) and water, and an aqueous dispersion composition comprising the dispersion and an amine compound. Copolymer (A): a copolymer prepared by copolymerizing (a) a vinyl monomer having a 5-membered cyclic dithiocarbonate group of general formula (I) with (b1) a vinyl monomer copolymerizable with the monomer (a): (wherein R , R and R are each independently hydrogen or lower alkyl). Copolymer (B): a copolymer prepared by copolymerizing (c) a vinyl monomer having a polar group with (b2) a vinyl monomer copolymerizable with the monomer (c).

    Abstract translation: 包含以下共聚物（A）和（B）和水的水分散体，和包含该分散体和胺化合物的水分散体组合物。 共聚物（A）：通过（a）具有通式（I）的5元环状二硫代碳酸酯基的乙烯基单体与（b1）可与单体（a）共聚的乙烯基单体共聚而制备的共聚物：（其中R 1 >，R 2和R 3各自独立地为氢或低级烷基）。 共聚物（B）：通过（c）具有极性基团的乙烯基单体与（b2）可与单体（c）共聚的乙烯基单体共聚制备的共聚物。

    점착제층, 점착제층 부착 편광판 및 적층체
    197.
    发明公开
    점착제층, 점착제층 부착 편광판 및 적층체 审中-实审
    压敏粘合剂层，带有压敏粘合剂层的偏振片，

    公开(公告)号：KR1020170069192A

    公开(公告)日：2017-06-20

    申请号：KR1020177000621

    申请日：2015-10-02

    Applicant: 소켄 케미칼 앤드 엔지니어링 캄파니, 리미티드

    Inventor： 요네카와유야

    IPC: C09J133/08 ,  C09J201/08 ,  C09J11/06 ,  G02B5/30 ,  G02F1/1335

    CPC classification number: C09J11/06 ,  C09J133/08 ,  C09J201/06 ,  C09J201/08 ,  G02B5/30 ,  G02F1/1335

    Abstract: 고온및 다습조건하에서우수한내구성을발휘하고, 광누설을저감할수 있고, 또한폴리사이클로올레핀계필름과의밀착성이우수한편광판용점착제층의제공이과제이며, 이점착제층은점착제층표면과물의접촉각이 90° 이하이고, 또한 (A) 하기단량체 (a1)∼(a5)를포함하는단량체혼합물의공중합체와, (B) 아이소사이아네이트계가교제를상기공중합체(A) 100부에대하여 0.1∼5질량부를포함하는점착제조성물로부터얻어지는것을특징으로하는점착제층: (a1) 폴리옥시알킬렌기또는알콕시알킬기함유단량체 30∼98.8질량%; (a2) 수산기함유단량체 0.1∼10질량%; (a3) 카복실기함유단량체 0.1∼10질량%; (a4) (메타)아크릴산알킬에스터단량체 1∼69.8질량%; (a5) 상기 (a1)∼(a4) 이외의공중합성단량체 0∼30질량%; 단, 상기단량체 (a1)∼(a5)의합계가 100질량%이다.

    Abstract translation: 具有高温和高湿度条件下具有优异的耐久性，并能减少光泄漏，并且在用于与基于烯烃的膜优异的偏振板粘附的压敏粘合剂层提供的聚周期解决这个问题，一个压敏粘合剂层为压敏粘合剂层表面与水的接触角 90°或更小，和（a）与单体（A1）〜并包括共聚物（A5）的单体混合物，（B）碳酸喔界限关系的（a）之间的iso的共聚物100份的0.1〜 感光性粘接剂组合物，其含有：（a1）聚氧化烯基或含烷氧基烷基的单体30〜98.8质量％ （a2）含羟基单体0.1〜10质量％ （a3）0.1〜10质量％的含羧基单体; （a4）1〜69.8质量％的（甲基）丙烯酸烷基酯单体; （a5）上述（a1）〜（a4）以外的可共聚单体0〜30质量％。 但是，单体（a1）〜（a5）的合计为100质量％。

    반도체 조립용 접착 필름용 조성물, 이에 의한 접착 필름및 이를 포함하는 다이싱 다이 본드 필름
    198.
    发明公开
    반도체 조립용 접착 필름용 조성물, 이에 의한 접착 필름및 이를 포함하는 다이싱 다이 본드 필름 无效
    用于半导体组件的粘合膜组合物，使用其的粘合膜和包含该粘合剂的粘合膜

    公开(公告)号：KR1020090103434A

    公开(公告)日：2009-10-01

    申请号：KR1020080029048

    申请日：2008-03-28

    Applicant: 제일모직주식회사

    Inventor： 정철 ,  김완중 ,  정기성 ,  홍용우 ,  정창범 ,  편아람 ,  임수미 ,  김상진

    IPC: C09J7/00

    CPC classification number: C09J201/06 ,  C08L63/00 ,  C09J9/00 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J161/06 ,  C09J201/08 ,  C09J2203/326

    Abstract: PURPOSE: An adhesive film composition for a semiconductor assembly is provided to suppress the generation of burr in dicing by controlling storage modulus before hardening and to prevent damage of products caused by chip crack generated by chipping. CONSTITUTION: An adhesive film composition for a semiconductor assembly includes an elastomeric resin, a film-forming resin, an epoxy-based resin, a phenol hardener, a curing catalyst, a silane coupling agent and inorganic filler. The elastomeric resin contains a hydroxyl group or carboxy group, and an epoxy group. The adhesive film is formed by the composition. A Dicing Die Bonding Film is such that a tackifier layer(2) and an adhesive layer(3) on a base film.

    Abstract translation: 目的：提供一种用于半导体组件的粘合膜组合物，用于通过控制硬化前的储能模量来抑制切割中的毛刺产生，并且防止由于碎裂而产生的切屑产生的产品损坏。 构成：用于半导体组件的粘合膜组合物包括弹性体树脂，成膜树脂，环氧基树脂，酚固化剂，固化催化剂，硅烷偶联剂和无机填料。 弹性体树脂含有羟基或羧基，和环氧基。 粘合膜由该组合物形成。 切割片接合膜是使基底膜上的增粘剂层（2）和粘合剂层（3）。

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