公开(公告)号：EP1889683A1

公开(公告)日：2008-02-20

申请号：EP06756513.5

申请日：2006-05-24

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： UESHIMA, Minoru

IPC: B23K35/22

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/262 ,  B23K35/362 ,  H05K2201/0215 ,  H05K2201/0257

Abstract: In a conventional Sn-Zn based lead-free solder, Zn crystallized to a large size of several tens of micrometers, and it was difficult to suppress the formation of coarse crystallizates and to increase the bonding strength without changing the soldering temperature. There were alloys which improved strength by the addition of a minute amount of a Group 1B metal, but the alloys had an increased melting temperature so that reflow could not be performed with the same temperature profile as for Sn-Pb, so the alloys had advantages and disadvantages.
By using a solder paste formed by mixing an ethanol solution containing nanoparticles having a particle diameter of 5 - 300 nm and containing at least one of Ag, Au, and Cu with a flux and solder powder for an Sn-Zn based lead-free solder paste, the formation of an alloy of Au, Au, or Cu with Zn occurs during soldering, thereby forming fine clusters in the resulting liquid phase of molten solder, and a fine solder structure is obtained following melting.

Abstract translation: 在常规的Sn-Zn基无铅焊料中，Zn结晶成几十微米的大尺寸，难以抑制粗结晶的形成，并且在不改变焊接温度的情况下提高接合强度。 有一些合金通过添加少量的1B族金属来提高强度，但合金的熔融温度升高，使得不能以与Sn-Pb相同的温度分布进行回流，因此合金具有优点 和缺点。 通过使用通过将含有粒径为5〜300nm的纳米粒子的乙醇溶液与Ag，Au，Cu中的至少一种混合并形成的锡膏，所述焊膏和Sn-Zn系无铅焊料用焊剂粉末 在焊接中发生Au，Au或Cu与Zn的合金的形成，从而在熔融焊料的液相中形成微细的簇，熔融后得到细小的焊料结构。

公开(公告)号：EP1842099A2

公开(公告)日：2007-10-10

申请号：EP06733878.0

申请日：2006-01-24

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： CARTEGENA DE JESUS, Julio Juan

IPC: G03F7/00

CPC classification number: B82Y30/00 ,  B41M3/006 ,  G03F7/0042 ,  G03F7/0047 ,  H05K3/105 ,  H05K3/125 ,  H05K3/182 ,  H05K2201/0257 ,  H05K2203/013 ,  H05K2203/1157

Abstract: A method for forming nanoparticles (520) in-situ includes depositing a first nanoparticle reactant (160, 300, 304, 308) from a printhead onto a desired substrate (170), and depositing a second nanoparticle reactant (160, 300, 304, 308) from the printhead substantially onto the first reactant (160, 300, 304, 308), wherein the first nanoparticle reactant (160, 300, 304, 308) is configured to react with the second nanoparticle reactant (160, 300, 304, 308) to form a nanoparticle (520).

公开(公告)号：EP1777997A1

公开(公告)日：2007-04-25

申请号：EP05077397.7

申请日：2005-10-18

Applicant: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO

Inventor： Hackert, Jürgen

IPC: H05K1/09

CPC classification number: H05K3/24 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/182 ,  H05K3/246 ,  H05K2201/0257 ,  H05K2201/0347 ,  H05K2203/013 ,  H05K2203/0709 ,  H05K2203/0723

Abstract: The invention provides method for preparing a conductive device comprising the steps of:
(a) providing a non-conductive substrate layer;
(b) applying a pattern of an ink on a surface of the substrate layer, which ink comprises a first metal;
(c) depositing a second metal on the ink pattern obtained in step (b); and
(d) applying a third metal on the second metal by means of electrodeposition.
The invention further provides a conductive device obtainable by said method.

Abstract translation: 本发明提供一种制备导电器件的方法，包括（a）提供非导电衬底层; （b）在基材层的表面上施加油墨图案，该油墨包含（c）在步骤（b）中获得的油墨图案上沉积第二金属; 和（d）通过电沉积在第二金属上施加第三金属。 本发明还提供可通过所述方法获得的导电装置。

公开(公告)号：EP1769658A1

公开(公告)日：2007-04-04

申请号：EP05773458.4

申请日：2005-06-17

Applicant: EASTMAN KODAK COMPANY

Inventor： YANG, Zhihao ,  KAY, David, Blair ,  TUTT, Lee, W.

IPC: H05K3/02

CPC classification number: H05K3/02 ,  H05K3/102 ,  H05K2201/0112 ,  H05K2201/0257 ,  H05K2203/107

Abstract: A method of forming a pattern of electrical conductors on a substrate (18) consists of forming metal nanoparticles on a conductive material. A light absorbing dye is mixed with the metal nanoparticles. The mixture is then coated on the substrate. The pattern is formed on the coated substrate with laser light (14). Unannealed material is removed from the substrate.

公开(公告)号：EP1387367B1

公开(公告)日：2007-01-10

申请号：EP02710342.3

申请日：2002-01-24

Applicant: JSR Corporation

Inventor： ITO, Nobuyuki, c/o JSR CORPORATION ,  MASUKO, Hideaki, c/o JSR CORPORATION ,  HASEGAWA, Satomi, c/o JSR CORPORATION ,  YOSHIMURA, Nakaatsu, c/o JSR CORPORATION

IPC: H01B3/00 ,  H01B3/12 ,  C08K3/22 ,  C08K9/00 ,  H05K1/03 ,  H01G4/20 ,  C08K9/02 ,  C08K9/04

CPC classification number: H01L24/49 ,  C08K9/02 ,  H01L23/145 ,  H01L23/49527 ,  H01L23/49589 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/135 ,  H01L2924/00 ,  H01L2224/45099

Abstract: The dielectric-forming composition according to the invention is characterized by consisting of: composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are coated with a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material; and (B) a resin component constituted of at least one of a polymerizable compound and a polymer. In addition, another dielectric-forming composition according to the invention is characterized by containing: ultrafine particle-resin composite particles composed of (J) inorganic ultrafine particles with the average particle size of 0.1 mu m or smaller, and (B) a resin component constituted of at least one of a polymerizable compound and a polymer, wherein part or all of the surfaces of the inorganic ultrafine particles (J) are coated with the resin component (B), and the ultrafine particle-resin composite particles contain 20% by weight or more of the inorganic ultrafine particles (J); and inorganic particles with the average particle size of 0.1 to 2 mu m and permittivity of 30 or greater, or inorganic composite particles in which a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material is deposited on the part or all of the surfaces of the inorganic particles.

Abstract translation: 形成电介质组合物雅定到本发明通过由......组成为特征：在其中部分或电介质都具有30或更大的介电常数的无机颗粒的表面的复合颗粒被涂覆有导电金属或它们的化合物，或导电 有机化合物或传导性无机材料; 和（B）的树脂成分构成的聚合性化合物和聚合物中的至少一种制成。 另外，另一种电介质形成用组合物雅鼎的发明是通过含有为特征：（J）具有0.1微米或更小，并且平均粒径的无机超微粒子构成超细颗粒 - 树脂复合粒子（B ）的树脂成分构成的聚合性化合物和聚合物中的至少一种的，worin部分或全部涂有树脂成分（B）的无机超微粒子（J）的表面的，和超细颗粒的树脂复合粒子 含有20％（重量）或更多的无机超微粒子（J）的; 并用0.1〜2微米的平均粒径和30或更大的介电常数，或无机复合颗粒的无机颗粒，其中导电金属或它们的化合物，或导电性有机化合物或导电无机材料沉积在所述部分 或全部的无机颗粒的表面。

公开(公告)号：EP1596435A2

公开(公告)日：2005-11-16

申请号：EP05252795.9

申请日：2005-05-06

Applicant: Ricoh Company

Inventor： Sano, Takeshi ,  Ohkura, Hideaki ,  Kobayashi, Hirofumi

IPC: H01L23/495

CPC classification number: H01L21/565 ,  H01L21/4867 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/498 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12044 ,  H05K1/0284 ,  H05K3/207 ,  H05K2201/0257 ,  H05K2201/09118 ,  H05K2203/1131 ,  H05K2203/1173 ,  H01L2924/00

Abstract: A pattern form object and its manufacturing method are disclosed. The pattern form object includes a pattern constituted by an aggregate of grains, a supporting member for supporting the pattern, and a mixed layer formed at a boundary of the pattern and the supporting member. The mixed layer is constituted by a mixture of the grains and the supporting member. Dimensions of the grains in a region other than the mixed layer are greater than dimensions of the grains in the mixed layer.

Abstract translation: 公开了一种图案形式对象及其制造方法。 图案形成体包括由颗粒聚集体构成的图案，用于支撑图案的支撑构件，以及形成在图案和支撑构件的边界处的混合层。 混合层由颗粒和支撑构件的混合物构成。 混合层以外的区域的晶粒尺寸大于混合层中的晶粒尺寸。

公开(公告)号：EP1198532A1

公开(公告)日：2002-04-24

申请号：EP00928757.4

申请日：2000-05-03

Applicant: TPL, Inc.

Inventor： HARTMAN, William, F. ,  SLENES, Kirk, M. ,  LAW, Kristen, J.

IPC: C09J5/02

CPC classification number: B32B27/08 ,  B32B27/00 ,  B32B27/18 ,  B32B2311/18 ,  B32B2457/16 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0317 ,  H05K2201/09309

Abstract: A dielectric substrate (15) useful in the manufacture of printed wiring boards is disclosed wherein the dielectric substrate comprises at least one organic polymer having a Tg greater than 140 °C and at least one filler material. The dielectric substrate of this invention has a dielectric constant that varies less than 15 % over a temperature range of from -55 to 125 °C. Additionally, a method for producing integral capacitance components for inclusion within printed circuit boards. Hydrothermally prepared nanopowders (13) permit the fabrication of very thin dielectric layers that offer increased dielectric constants and are readily penetrated by microvias. Disclosed is a method of preparing a slurry or suspension of a hydrothermally prepared nanopowder and solvent. A suitable bonding material (14), such as a polymer is mixed with the nanopowder slurry, to generate a composite mixture that is formed into a dielectric layer (11). The dielectric layer (11) may be placed upon a conductive layer (10, 12) prior to curing, or conductive layers (10, 12) may be applied upon a cured dielectric layer, either by lamination or by metallization processes, such as vapor deposition or sputtering.

公开(公告)号：EP0512401A2

公开(公告)日：1992-11-11

申请号：EP92107329.2

申请日：1992-04-29

Applicant: International Business Machines Corporation

Inventor： Mukherjee, Shyama P. ,  Wang, David W.

IPC: H01B3/30 ,  H01B3/40 ,  H01B3/44 ,  C08K7/26 ,  H05K1/03

CPC classification number: H05K1/0373 ,  H01B3/30 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/0257

Abstract: A low dielectric constant, controlled coefficient of thermal expansion, low cost material which includes uniformly distributed aerogel microspheres having voids in molecular dimension (at nanoscale) is prepared by extrusion and standard impregnation and lamination techniques. The aerogel microspheres are prepared by sol-gel technique and supercritical drying of the sol-gel particulates. Laminates including this material can be drilled cleanly for through holes and can be used as a substrate for surface mounted devices. Also, these low dielectric aerogel microsphere containing composite resins, when the resin is a photosensitive polymer, can be applied to substrate surfaces such as ceramic or multilayer ceramic substrates and photolithographically processed.

Abstract translation: 低介电常数，热膨胀，低成本的材料，其包括具有分子尺寸（在纳米级）的空隙均匀分布的气凝胶微珠的控制系数是通过挤压和标准浸渍和层压技术制备。 气凝胶微球通过溶胶 - 凝胶技术和溶胶 - 凝胶微粒的超临界干燥制备的。 层压材料包括这种材料可以干净地通孔被钻出，并且可以用作用于表面安装装置一个基材。 所以，论文低介电气凝胶微球包含复合树脂，当树脂是光敏聚合物，可施用到基底表面：如陶瓷或多层陶瓷基板和光刻处理。

公开(公告)号：EP3158015A4

公开(公告)日：2018-02-07

申请号：EP15810065

申请日：2015-06-19

Applicant: NATIONAL RES COUNCIL OF CANADA ,  GROUPE GRAHAM INT INC

Inventor： KELL ARNOLD ,  LAFRENIERE SYLVIE ,  PAQUET CHANTAL ,  MALENFANT PATRICK ,  MOZENSON OLGA

IPC: C09D11/52 ,  H01Q9/04 ,  H05K1/09 ,  H05K3/12

CPC classification number: C09D11/52 ,  C09D11/033 ,  C09D11/08 ,  C09D11/14 ,  C09D11/38 ,  H01Q1/2225 ,  H01Q1/24 ,  H01Q1/364 ,  H01Q1/38 ,  H05K1/095 ,  H05K3/105 ,  H05K3/1216 ,  H05K2201/0257 ,  H05K2203/1131 ,  H05K2203/1136

Abstract: A flake-less molecular ink suitable for printing (e.g. screen printing) conductive traces on a substrate has 30-60 wt % of a C8-C12 silver carboxylate or 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate, 0.1-10 wt % of a polymeric binder (e.g. ethyl cellulose) and balance of at least one organic solvent. Conductive traces formed with the molecular ink are thinner, have lower resistivity, have greater adhesion to a substrate than metal flake inks, have better print resolution and are up to 8 times less rough than metal flake inks. In addition, the shear force required to remove light emitting diodes bonded to the traces using Loctite 3880 is at least 1.3 times stronger than for commercially available flake-based inks.

公开(公告)号：EP3250013A4

公开(公告)日：2018-01-24

申请号：EP16758718

申请日：2016-02-09

Applicant: OMRON TATEISI ELECTRONICS CO

Inventor： KAWAI WAKAHIRO

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/119 ,  H01L2224/20 ,  H01L2224/24195 ,  H05K1/185 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/09118

Abstract: An electronic component (11) is embedded in an end portion of a surface (P1) and an end portion of a surface (P2) adjacent to each other in a three-dimensional base (2). The portion of an electrode (21) exposed from the surface (P1) and an electrode (101) of a packaged IC (41) are connected to each other via a wiring line (201). The portion of the electrode (21) exposed from the surface (P2) and an electrode (25) of an electronic component (15) are connected to each other via a wiring line (202). Accordingly, it is possible to realize a three-dimensional circuit structure requiring no wiring line spanning over or along an end portion thereof.