公开(公告)号：EP0421709A1

公开(公告)日：1991-04-10

申请号：EP90310734.0

申请日：1990-10-01

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Emori, Kenji, c/o Sumitomo 3M Ltd. ,  Ishii, Shigeyoshi, c/o Sumitomo 3M Ltd.

IPC: H01B1/22 ,  H05K3/32 ,  C09J7/00

CPC classification number: H05K3/323 ,  C08L2666/54 ,  C09J7/10 ,  C09J201/00 ,  H01B1/22 ,  H01R4/04 ,  H05K3/361 ,  H05K2201/023 ,  H05K2201/0266

Abstract: Anisotropically electroconductive adhesive films comprising coagulated nickel electroconductive particles, primary particles having an average particle size of 0.02 - 2.0 µm, the amount of particles in the film being 0.5% - 10.0% by volume. The films are useful for effecting electrical connector of fine multiple pin terminals.

Abstract translation: 包含凝固的镍导电颗粒的各向异性导电粘合剂膜，平均粒度为0.02-2.0μm的一次颗粒，膜中的颗粒的量为0.5体积％至10.0体积％。 这些薄膜可用于实现精细多针端子的电连接器。

公开(公告)号：EP0260141A3

公开(公告)日：1989-07-26

申请号：EP87308019.6

申请日：1987-09-10

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Takeno, Shozo ,  Kakegawa, Masayuki ,  Adachi, Yoshimasa

IPC: G02F1/133

CPC classification number: G02F1/13452 ,  H05K1/117 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/023 ,  H05K2201/0266 ,  H05K2201/094 ,  H05K2201/09663

Abstract: A liquid crystal apparatus in which an anisotropic conductive layer (122) made of organic resin (120) containing several electrical conductive particles (121) having a substantially identical particle sizes is disposed between lead electrodes of a liquid crystal device (112) and the lead electrodes of a drive circuit board (114-117), thermocompression bonding being applied to make a simple substance of the electrical conductive particles (121) in direct contact with the both lead electrodes to allow both lead electrodes to be electrically connected with each other. Further, at least one of the lead electrodes of a common electrode (106) in the liquid crystal device (112) and the lead electrodes of the circuit board (114-117) corresponding to the lead electrode of the common electrode (106) are spaced, and the pitches and widths of the lead electrodes belonging to at least one of the liquid crystal device (112) and the circuit board (114-117) are in the range of ± 30% around their respective averaged values.

公开(公告)号：EP0265212A1

公开(公告)日：1988-04-27

申请号：EP87309226.6

申请日：1987-10-19

Applicant: JAPAN SYNTHETIC RUBBER CO., LTD.

Inventor： Kasai, Kiyoshi ,  Watanabe, Masaji ,  Hattori, Masayuki ,  Tadenuma, Hiroshi ,  Miyamoto, Masahiro

IPC: H01B5/14 ,  H01B5/16 ,  H01B1/22 ,  H01R4/04 ,  C09J7/00

CPC classification number: H01B1/22 ,  C09J201/00 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01R4/04 ,  H05K1/181 ,  H05K3/323 ,  H05K3/361 ,  H05K13/0469 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0266

Abstract: Electroconductive particles having substantially uniform particle diameters, which are obtained by forming a thin metal layer on the surface of each of fine polymer particles having such a narrow particle diameter distribution that at least 80% by weight of the polymer particles have particle diameters falling within a range of 0.9Sn to 1.1Sn wherein Sn is defined as the number average particle diameter of the polymer particles, as well as an electroconductive adhesive consisting essentially of (a) said electroconductive particles and (b) an electrically insulating adhesive material. Use of this electroconductive adhesive makes it possible to obtain good, anisotropic, electric connection.

Abstract translation: 导电颗粒具有基本上均匀的粒径，其通过在具有如此窄的粒径分布的每种聚合物微粒的表面上形成薄金属层而获得，使得至少80重量％的聚合物颗粒的粒径落入 范围为0.9Sn至1.1Sn，其中Sn定义为聚合物颗粒的数均粒径，以及基本上由（a）所述导电颗粒和（b）电绝缘粘合剂材料组成的导电粘合剂。 使用这种导电粘合剂可以获得良好的各向异性电连接。

公开(公告)号：US20240324103A1

公开(公告)日：2024-09-26

申请号：US18613202

申请日：2024-03-22

Applicant: IBIDEN CO., LTD.

Inventor： Masashi KUWABARA ,  Jun SAKAI ,  Shiho FUKUSHIMA

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/16

CPC classification number: H05K1/115 ,  H05K1/0306 ,  H05K3/16 ,  H05K2201/0209 ,  H05K2201/0242 ,  H05K2201/0266 ,  H05K2201/032 ,  H05K2201/09536

Abstract: A wiring substrate includes a core substrate including a through-hole conductor, a first resin insulating layer, a first conductor layer including a seed layer and an electrolytic plating layer, a via conductor formed such that the via conductor electrically connects the through-hole conductor and first conductor layer, and a second resin insulating layer covering the first conductor layer. The core substrate includes a glass substrate such that the through-hole conductor is penetrating through the glass substrate, the seed layer includes a first layer formed on the first resin insulating layer and a second layer formed on the first layer, and the first conductor layer includes a conductor circuit such that a width of the first layer is larger than a width of the second layer in the conductor circuit and a width of the electrolytic plating layer is larger than the width of the first layer in the conductor circuit.

公开(公告)号：US20180213633A1

公开(公告)日：2018-07-26

申请号：US15499586

申请日：2017-04-27

Applicant: Shiu Li Technology Co., Ltd.

Inventor： Chung-Cheng Chien

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/12

CPC classification number: H05K1/0209 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/14 ,  H05K3/44 ,  H05K2201/0266 ,  H05K2201/10106 ,  H05K2203/0736 ,  H05K2203/1366

Abstract: A heat dissipator having a circuit formed by screen printing or spraying includes a circuit layer and an isolation layer. The circuit layer, which is on a surface of a heat dissipation part of the heat dissipator having the circuit formed by screen printing or spraying, is formed by screen printing or spraying a uniformly distributed plastic material and low electrical resistance conductive powder. The isolation layer is disposed on the circuit layer and the heat dissipation part.

公开(公告)号：US20170367194A1

公开(公告)日：2017-12-21

申请号：US15612182

申请日：2017-06-02

Applicant: Nanoshield Technology Co. Ltd.

Inventor： James Cheng LEE

IPC: H05K3/28 ,  C23C14/08 ,  H05K1/03

CPC classification number: H05K3/285 ,  C23C14/08 ,  C23C18/1212 ,  C23C18/1216 ,  C23C18/1254 ,  C23C18/1266 ,  H05K1/0306 ,  H05K3/282 ,  H05K3/284 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09872 ,  H05K2203/0783 ,  H05K2203/1366 ,  H05K2203/1476

Abstract: A method includes steps of forming an inner coating on an object and forming an outer coating in contact with the inner coating. A first solution including metal oxide nanoparticles and a first solvent is applied onto the object. The first solvent is removed to form the inner coating with the metal oxide nanoparticles. A second solution having silicon dioxide nanoparticles and a second solvent is applied onto the object. The second solvent is removed to form the outer coating with the silicon dioxide nanoparticles. The interfacial binding force between the metal oxide nanoparticles and the silicon dioxide nanoparticles is then strengthened, for example, by applying a third solution such as water, ethanol or a mixture thereof to the inner coating and the outer coating.

公开(公告)号：US20170347449A1

公开(公告)日：2017-11-30

申请号：US15536954

申请日：2015-12-18

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Motohiko SUGIURA ,  Takashi KASUGA ,  Yoshio OKA ,  Shigeaki UEMURA ,  Jinjoo PARK ,  Hiroshi UEDA ,  Kousuke MIURA

IPC: H05K1/09 ,  H05K3/24 ,  H05K1/03 ,  H05K1/02 ,  H05K3/38 ,  H05K1/05 ,  B82Y30/00

CPC classification number: H05K1/097 ,  B82Y30/00 ,  B82Y40/00 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/05 ,  H05K1/09 ,  H05K3/24 ,  H05K3/38 ,  H05K3/388 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/0269

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a metal layer formed on at least one surface side of the base film. In the substrate for a printed circuit board, a plurality of fine particles are disposed between the base film and the metal layer, and the fine particles are formed of a metal the same as a main metal of the metal layer or formed of a metal compound of the main metal. The fine particles preferably have an average particle size of 0.1 nm or more and 20 nm or less. The fine particles are preferably formed of a metal oxide or a metal hydroxide. The fine particles are preferably present between the base film and the metal layer so as to form a layer. The metal layer preferably includes a metal grain layer formed by firing metal nanoparticles.

公开(公告)号：US20170256583A1

公开(公告)日：2017-09-07

申请号：US15440329

申请日：2017-02-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Sukho CHOI ,  Euttum KIM ,  Joonsam KIM

IPC: H01L27/18 ,  H05K1/18 ,  H01L23/00 ,  H05K1/09

CPC classification number: H01L24/73 ,  G02F1/13452 ,  H01L24/17 ,  H01L24/32 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/2919 ,  H01L2224/32135 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12044 ,  H01L2924/13069 ,  H01L2924/1426 ,  H01L2924/3511 ,  H05K3/323 ,  H05K2201/0266 ,  H05K2201/10128

Abstract: A display apparatus includes a display panel, a driving integrated circuit (IC), and an anisotropic conductive film. The display panel includes a non-display area adjacent to a display area and an upper substrate and a lower substrate. The driving IC overlaps the non-display area. The anisotropic conductive film attaches the driving IC to the lower substrate and includes conductive balls with diameters that gradually increase toward the display area.

公开(公告)号：US09718941B2

公开(公告)日：2017-08-01

申请号：US14115306

申请日：2012-04-27

Applicant: Takashi Matsuda ,  Mitsuyoshi Nishino ,  Kiyotaka Komori

Inventor： Takashi Matsuda ,  Mitsuyoshi Nishino ,  Kiyotaka Komori

IPC: C08K3/00 ,  H05K1/03 ,  B32B15/092 ,  C08L63/00 ,  C08J5/24 ,  C08K3/22 ,  C08K3/26

CPC classification number: C08K3/013 ,  B32B15/092 ,  B32B2264/102 ,  B32B2311/12 ,  B32B2363/00 ,  B32B2457/08 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/22 ,  C08K3/26 ,  C08K2003/222 ,  C08K2003/2224 ,  C08K2003/2227 ,  C08K2003/265 ,  C08K2201/003 ,  C08K2201/005 ,  C08K2201/014 ,  C08L63/00 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T442/20 ,  Y10T442/3431 ,  Y10T442/3472

Abstract: Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D50) of 1 to 15 μm; (B) aluminum oxide particles having an average particle size (D50) of 1.5 μm or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.

公开(公告)号：US20170127514A1

公开(公告)日：2017-05-04

申请号：US15354668

申请日：2016-11-17

Applicant: Waseda University ,  Fuji Electric Co., Ltd.

Inventor： Yoshimichi Ohki ,  Yuichi Hirose ,  Genta Wada ,  Toshikatsu Tanaka ,  Kenji Okamoto

IPC: H05K1/05 ,  C09D163/00 ,  C09D7/12 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/056 ,  C09D7/67 ,  C09D7/68 ,  C09D7/69 ,  C09D163/00 ,  H05K1/0201 ,  H05K1/0204 ,  H05K1/0256 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0769 ,  H05K2201/10106 ,  Y10T428/24893

Abstract: A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 μm with an average particle diameter (D50) of 500 nm to 20 μm, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.