公开(公告)号：US08456857B2

公开(公告)日：2013-06-04

申请号：US12293777

申请日：2007-03-21

Applicant: Uwe Gröschner ,  Falk Steiner ,  Stefan Asch

Inventor： Uwe Gröschner ,  Falk Steiner ,  Stefan Asch

IPC: H05K1/11

CPC classification number: H05K7/1439 ,  H05K1/14 ,  H05K1/144 ,  H05K2201/044 ,  H05K2201/045 ,  H05K2201/10409

Abstract: A backplane arrangement is provided for an electronic mounting rack with a base backplane with several contact strips, wherein a free space, into which at least one additional backplane can be inserted, is provided on the base backplane.

Abstract translation: 为具有带有多个接触条的基座背板的电子安装架提供背板布置，其中可在其上插入有至少一个附加背板的自由空间设置在基底板上。

公开(公告)号：US20130008703A1

公开(公告)日：2013-01-10

申请号：US13635364

申请日：2011-04-11

Applicant: Johannes Stahr ,  Markus Leitgeb

Inventor： Johannes Stahr ,  Markus Leitgeb

IPC: H05K1/11 ,  H05K3/36 ,  H05K3/32

CPC classification number: H05K1/185 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K1/144 ,  H05K1/181 ,  H05K1/186 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: In a method for integrating a component (3) into a printed circuit board, the following steps are provided: providing two completed printed circuit board elements (1, 4), which more particularly consist of a plurality of interconnected plies or layers (6, 7, 8), wherein at least one printed circuit board element (4) has a cutout or depression (10), arranging the component (3) to be integrated on one of the printed circuit board elements (1) or in the cutout of the at least one printed circuit board element, and connecting the printed circuit board elements (1, 4) with the component (3) being accommodated in the cutout (10), as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor (3) in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component (3) integrated therein is provided.

Abstract translation: 在将组件（3）集成到印刷电路板中的方法中，提供以下步骤：提供两个完整的印刷电路板元件（1,4），其更特别地由多个相互连接的层或层（6， 其中至少一个印刷电路板元件（4）具有切口或凹陷（10），将组件（3）布置成集成在一个印刷电路板元件（1）上或者在 所述至少一个印刷电路板元件，并且将所述印刷电路板元件（1,4）与所述部件（3）连接在所述切口（10）中，结果可以获得安全可靠的住宿 在印刷电路板中的部件或传感器（3）。 此外，提供一种包括集成在其中的电子部件（3）的这种类型的印刷电路板。

公开(公告)号：US08122598B2

公开(公告)日：2012-02-28

申请号：US12468626

申请日：2009-05-19

Applicant: Toshihiko Yokomaku

Inventor： Toshihiko Yokomaku

IPC: H05K3/34

CPC classification number: H05K3/3463 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16251 ,  H05K1/0262 ,  H05K1/141 ,  H05K3/341 ,  H05K3/3415 ,  H05K3/3457 ,  H05K3/4602 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10674 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2224/05599

Abstract: A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third and fourth solders, the first, second, third and fourth solders have different melting points and the melting points of the first, second, third and fourth solders are arranged as the melting point of the first solder, the melting point of the second solder, the melting point of the third solder and the melting point of the fourth solder in order of high melting point and the first, second, third and fourth solders are sequentially used to solder electronic components and the like in order of high melting point. Further, in that case, it is preferable that the solder bump having large volume should be soldered earlier than other solder bumps. This multilayer printed wiring board is easy to mount components, excellent in work efficiency or easy in reworkable process and a mounting method of such multilayer printed wiring board is also provided.

Abstract translation: 多层印刷电路板的部件安装方法包括：多个焊料凸块，用于安装形成在其前后的电子元件，其中当焊料凸块由第一，第二，第三和第四 焊料，第一，第二，第三和第四焊料具有不同的熔点，第一，第二，第三和第四焊料的熔点被排列为第一焊料的熔点，第二焊料的熔点，熔化 第三焊料的点和第四焊料的熔点按照高熔点顺序依次使用，并且第一，第二，第三和第四焊料依次用于以高熔点的顺序焊接电子部件等。 此外，在这种情况下，优选地，具有大体积的焊料凸块应比其它焊料凸块更早地焊接。 该多层印刷电路板容易安装组件，工作效率优异或易于再加工的工艺，并且还提供了这种多层印刷线路板的安装方法。

公开(公告)号：US20110183474A1

公开(公告)日：2011-07-28

申请号：US13079939

申请日：2011-04-05

Applicant: Kunio Shigemura ,  Kenji Hanada ,  Masaki Nakanishi ,  Takafumi Nishita ,  Masayoshi Shinoda ,  Seiichi Tomoi

Inventor： Kunio Shigemura ,  Kenji Hanada ,  Masaki Nakanishi ,  Takafumi Nishita ,  Masayoshi Shinoda ,  Seiichi Tomoi

IPC: H01L21/56

CPC classification number: H01L25/162 ,  H01L23/3121 ,  H01L23/4824 ,  H01L23/5227 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L25/50 ,  H01L27/0617 ,  H01L27/0629 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2201/045 ,  H05K2203/081 ,  H05K2203/1476 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/43 ,  H01L2924/01006

Abstract: A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component 43, an integrated chip component 44, and a semiconductor chip IC2 by Pb-free solder is carried out by heat treatment at a temperature below 280° C. using a heat block. Solder connection of a semiconductor chip IC1 by high-melting point solder is carried out by heat treatment at a temperature of 280° C. or higher using a hot jet. Thus, the semiconductor chip IC1 can be solder connected to PCB 38 using high-melting point solder without the following troubles: damage to the PCB 38 due to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip IC1 can be mounted over the PCB 38 with high connection strength.

Abstract translation: 提供了一种可以提高使用PCB作为其模块基板的模块的可靠性的技术。 通过使用热块在低于280℃的温度下进行热处理，进行无铅焊料的单芯片部件43，集成芯片部件44和半导体芯片IC2的焊接连接。 通过高熔点焊料的半导体芯片IC1的焊接连接通过使用热射流在280℃以上的温度进行热处理来进行。 因此，可以使用高熔点焊料将半导体芯片IC1焊接到PCB 38上，而不会有以下问题：由于热而导致的PCB 38的损坏，例如焊料抗蚀剂的燃烧; 和预浸料从芯材剥离。 因此，半导体芯片IC1可以以高连接强度安装在PCB 38上。

公开(公告)号：US20110051382A1

公开(公告)日：2011-03-03

申请号：US12913136

申请日：2010-10-27

Applicant: Masanori YUMOTO ,  Yoshihisa HIRANO ,  Chiaki IMAEDA

Inventor： Masanori YUMOTO ,  Yoshihisa HIRANO ,  Chiaki IMAEDA

IPC: H05K1/00

CPC classification number: G02F1/13452 ,  G02F1/133615 ,  H05K1/141 ,  H05K1/147 ,  H05K3/361 ,  H05K2201/045 ,  H05K2201/055

Abstract: An electro-optical apparatus comprising an electro-optical panel including a display section, a flexible printed circuit board, and a rigid circuit board. The flexible printed circuit board includes a first terminal connected to the electro-optical panel and a second terminal connected to an external circuit. The rigid circuit board includes a first surface on which electronic components are mounted and a second surface mounted to the flexible printed circuit board. The second surface of the rigid circuit board is opposite to the first surface. An entirety of the rigid circuit board is stacked on the flexible printed circuit board within the flexible printed circuit board. The rigid circuit board is electrically connected to the flexible printed circuit board. The flexible printed circuit board is bent toward the external circuit.

Abstract translation: 一种电光装置，包括包括显示部分，柔性印刷电路板和刚性电路板的电光面板。 柔性印刷电路板包括连接到电光面板的第一端子和连接到外部电路的第二端子。 刚性电路板包括安装有电子部件的第一表面和安装到柔性印刷电路板的第二表面。 刚性电路板的第二表面与第一表面相对。 整个刚性电路板堆叠在柔性印刷电路板上的柔性印刷电路板上。 刚性电路板电连接到柔性印刷电路板。 柔性印刷电路板向外部电路弯曲。

公开(公告)号：US07566835B2

公开(公告)日：2009-07-28

申请号：US11689858

申请日：2007-03-22

Applicant: Toshihiko Yokomaku

Inventor： Toshihiko Yokomaku

IPC: H01R12/04

CPC classification number: H05K3/3463 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16251 ,  H05K1/0262 ,  H05K1/141 ,  H05K3/341 ,  H05K3/3415 ,  H05K3/3457 ,  H05K3/4602 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10674 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2224/05599

Abstract: A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third and fourth solders, the first, second, third and fourth solders have different melting points and the melting points of the first, second, third and fourth solders are arranged as the melting point of the first solder, the melting point of the second solder, the melting point of the third solder and the melting point of the fourth solder in order of high melting point and the first, second, third and fourth solders are sequentially used to solder electronic components and the like in order of high melting point. Further, in that case, it is preferable that the solder bump having large volume should be soldered earlier than other solder bumps. This multilayer printed wiring board is easy to mount components, excellent in work efficiency or easy in reworkable process and a mounting method of such multilayer printed wiring board is also provided.

Abstract translation: 多层印刷电路板的部件安装方法包括：多个焊料凸块，用于安装形成在其前后的电子元件，其中当焊料凸块由第一，第二，第三和第四 焊料，第一，第二，第三和第四焊料具有不同的熔点，第一，第二，第三和第四焊料的熔点被排列为第一焊料的熔点，第二焊料的熔点，熔化 第三焊料的点和第四焊料的熔点按照高熔点顺序依次使用，并且第一，第二，第三和第四焊料依次用于以高熔点的顺序焊接电子部件等。 此外，在这种情况下，优选地，具有大体积的焊料凸块应比其它焊料凸块更早地焊接。 该多层印刷电路板容易安装组件，工作效率优异或易于再加工的工艺，并且还提供了这种多层印刷线路板的安装方法。

公开(公告)号：US20090073655A1

公开(公告)日：2009-03-19

申请号：US12119439

申请日：2008-05-12

Applicant: Masahiko Takakusaki ,  Minoru Enomoto

Inventor： Masahiko Takakusaki ,  Minoru Enomoto

IPC: G06F1/20 ,  H05K1/14 ,  H05K7/20 ,  G06F1/18 ,  H05K5/00

CPC classification number: H05K1/141 ,  G06F1/1616 ,  G06F1/1658 ,  G06F1/185 ,  G06F1/203 ,  H05K1/144 ,  H05K2201/045 ,  H05K2201/09954 ,  H05K2201/10189

Abstract: An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.

Abstract translation: 电子设备包括：壳体; 住在房屋中的主板; 容纳在壳体中的第一个子板; 容纳在壳体中的第二子板; 安装在主板上的主机控制器; 桥式控制器，其安装在第一子板上并电连接到主机控制器; 安装在第一子板上并电连接到桥接控制器的第一芯片; 以及安装在第二子板上并电连接到桥接控制器的第二芯片。

公开(公告)号：US07505284B2

公开(公告)日：2009-03-17

申请号：US11416757

申请日：2006-05-03

Applicant: Bert J. Offrein ,  Stefano S. Oggioni ,  Mauro Spreafico

Inventor： Bert J. Offrein ,  Stefano S. Oggioni ,  Mauro Spreafico

IPC: H05K1/11

CPC classification number: H01L23/66 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/522 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/167 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/81143 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/222 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/10121 ,  H05K2201/1053 ,  H05K2201/10674 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals. The electric coupling comprises a direct electric connection particularly formed by a flexible electrical interconnection member, between the first and the second electronic components, the electric connection being independent of the electronic system support substrate.

Abstract translation: 一种电子系统，包括：用于附接所述电子系统的部件的电子系统支撑基板，所述电子系统支撑基板包括用于在所述系统部件之间传播电信号的电信号传播路径; 至少第一和第二电子部件，其中至少所述第一电子部件是与所述电子系统支撑基板机械和电连接的模块的一部分，所述模块包括模块基板，所述第一电子部件至少机械连接到所述模块基板 以及第一和第二电子部件之间的电耦合，用于电耦合，允许第一和第二电子部件交换电信号。 电耦合包括在第一和第二电子部件之间特别由柔性电互连部件形成的直接电连接，电连接独立于电子系统支撑基板。

公开(公告)号：US20080105869A1

公开(公告)日：2008-05-08

申请号：US11935119

申请日：2007-11-05

Applicant: Shin-Hyung KIM

Inventor： Shin-Hyung KIM

IPC: H01L23/58 ,  G01R31/26 ,  H05K1/00 ,  H01L21/66

CPC classification number: H05K1/141 ,  G01R1/0408 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K1/144 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/10689 ,  H05K2201/10734 ,  H01L2924/00014

Abstract: Provided is a printed circuit board for a semiconductor device. The printed circuit board includes an upper surface ball out structure configured the same as a ball array of a semiconductor device package mounted on the upper surface of the printed circuit board, and a lower surface ball out structure configured the same as a ball out structure of a lower board. The lower surface ball out structure is a standardized structure.

Abstract translation: 提供了一种用于半导体器件的印刷电路板。 印刷电路板包括与安装在印刷电路板的上表面上的半导体器件封装的球阵列相同的上表面球出结构，以及下表面球出结构，其配置为与 一个下板。 下表面球出结构是标准化结构。

公开(公告)号：US07351072B2

公开(公告)日：2008-04-01

申请号：US11481676

申请日：2006-07-06

Applicant: Simon Muff ,  Siva Raghuram

Inventor： Simon Muff ,  Siva Raghuram

IPC: H05K1/14

CPC classification number: G11C5/04 ,  H05K1/144 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K2203/1572

Abstract: A memory extension memory module, a memory module system, and a memory module is disclosed. The memory module including at least one memory device and a connector for connecting the memory module to a computer system, wherein the memory module additionally includes a surface-mounted connector for connecting a memory extension memory module to the memory module. Furthermore, a method for manufacturing a memory module is disclosed. The memory module including at least one memory device and at least one connector for connecting a memory extension memory module to the memory module, wherein the at least one memory device and the at least one connector are connected to the memory module in a single manufacturing process.

Abstract translation: 公开了一种存储器扩展存储器模块，存储器模块系统和存储器模块。 所述存储器模块包括至少一个存储器件和用于将所述存储器模块连接到计算机系统的连接器，其中所述存储器模块还包括用于将存储器扩展存储器模块连接到所述存储器模块的表面安装连接器。 此外，公开了一种用于制造存储器模块的方法。 所述存储器模块包括至少一个存储器设备和用于将存储器扩展存储器模块连接到所述存储器模块的至少一个连接器，其中所述至少一个存储器设备和所述至少一个连接器在单个制造过程中连接到所述存储器模块 。