公开(公告)号：EP3456160A2

公开(公告)日：2019-03-20

申请号：EP17728449.4

申请日：2017-05-10

Applicant: Linxens Holding

Inventor： MORGENTHALER, Frédéric ,  KALCK, Sébastien

IPC: H05K1/11 ,  H05K3/20 ,  G06K19/077 ,  H01L23/498 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K3/202 ,  G06K19/07718 ,  G06K19/07743 ,  H01L23/49838 ,  H01L23/49855 ,  H05K1/11 ,  H05K1/117 ,  H05K3/0097 ,  H05K3/32 ,  H05K2201/09063 ,  H05K2201/09136 ,  H05K2201/10287 ,  H05K2203/1545

公开(公告)号：EP3358615A1

公开(公告)日：2018-08-08

申请号：EP16850843.0

申请日：2016-07-27

Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Materials Co., Ltd.

Inventor： KATO, Hiromasa ,  KITAMORI, Noboru

IPC: H01L23/13 ,  H01L23/12 ,  H01L23/36 ,  H05K1/02

CPC classification number: C04B35/584 ,  C04B37/025 ,  C04B37/026 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/368 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/88 ,  H01L23/13 ,  H01L23/15 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/49861 ,  H05K1/02 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/0011 ,  H05K3/0061 ,  H05K2201/09136

Abstract: The present invention provides a silicon nitride circuit board in which metal plates are attached on front and rear sides of a silicon nitride substrate having a three-point bending strength of 500 MPa or higher, with attachment layers interposed therebetween, wherein assuming that a thickness of the metal plate on the front side is denoted by t1, and a thickness of the metal plate on the rear side is denoted by t2, at least one of the thicknesses t1 and t2 is 0.6 mm or larger, a numerical relation: 0.10 ≤ |t1 - t2| ≤ 0.30 mm is satisfied, and warp amounts of the silicon nitride substrate in a long-side direction and a short-side direction both fall within a range from 0.01 to 1.0 mm. Due to above configuration, TCT properties of the silicon nitride circuit board can be improved even if the thicknesses of the front and rear metal plates are large.

公开(公告)号：EP3340291A1

公开(公告)日：2018-06-27

申请号：EP16206797.9

申请日：2016-12-23

Applicant: Infineon Technologies AG

Inventor： Bayerer, Reinhold

IPC: H01L23/10 ,  H01L23/16 ,  H01L23/367 ,  H01L23/433 ,  H05K1/02

CPC classification number: H05K7/14 ,  H01L23/10 ,  H01L23/16 ,  H01L23/3735 ,  H01L23/4006 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0271 ,  H05K1/18 ,  H05K3/284 ,  H05K5/0239 ,  H05K7/2039 ,  H05K2201/0162 ,  H05K2201/066 ,  H05K2201/09018 ,  H05K2201/09136 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/2018 ,  H05K2203/1105 ,  H05K2203/302 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: One aspect relates to a method for producing an electronic module assembly. In that method, a curable first mass extending between a substrate assembly and a module housing is cured while a circuit carrier of the substrate assembly comprises at least a first temperature. Between a side wall of the module housing and the substrate assembly, an adhesive connection is formed by curing a curable second mass. Subsequent to curing the first mass, the circuit carrier is cooled down to below a second temperature lower than the first temperature.

公开(公告)号：EP3157606A4

公开(公告)日：2018-04-04

申请号：EP15809576

申请日：2015-06-17

Applicant: CATHPRINT AB

Inventor： KAELLBAECK BENGT ,  BAGAIAN TIBERIU ,  ROKOSCH TOBIAS

IPC: A61M25/00 ,  A61B5/00 ,  A61B5/0215 ,  G01L7/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28

CPC classification number: A61M25/00 ,  A61B5/0215 ,  A61B5/6852 ,  A61B2562/166 ,  A61M2025/0002 ,  G01L7/00 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0162 ,  H05K2201/09136 ,  H05K2201/10151 ,  H05K2201/2009

Abstract: The invention relates to a conductor assembly comprising a resilient tubular outer casing (1) with a flexible printed circuit board (6) in the outer casing's interior. On the circuit board a sensor (3) is arranged. A cavity (8a-c) in the outer casing adjacent to the sensor is filled with a rigid filling material (9). Where the rigid filling material extends in the lengthwise direction of the tubular outer casing (1) at least from one side of the sensor to the opposite side of the sensor. This means that the sensor will not be affected when the conductor assembly is bent or otherwise affected mechanically. The conductor assembly's outer casing (1) comprises an opening (7a-c) to a cavity (8a-c) in the outer casing in connection to the sensor, through which a filling material can be supplied in liquid form. Typically the conductor assembly includes two cavities (8a-b) in the outer casing on the side of the flexible circuit board (6) where the sensor is mounted, the two cavities being on either side of the sensor, and a third cavity (8c) in the outer casing on the side of the flexible circuit board (6) which is opposite to the sensor. In an advantageous embodiment the extension of at least one cavity (8a-c) in the outer casing is limited by bumps (4a-f) on either side of the cavity thus defining the cavity. Injected filler material propagation is governed by these bumps to the relevant space. Typically, the conductor assembly is a catheter or part of a catheter.

公开(公告)号：EP2460393B1

公开(公告)日：2017-10-11

申请号：EP10803777.1

申请日：2010-07-28

Applicant: ATI Technologies ULC

Inventor： LEUNG, Andrew ,  TOPACIO, Roden ,  MARTINEZ, Liane ,  LOW, Yip Seng

IPC: H05K3/00 ,  H01L23/12 ,  H01L23/488 ,  H05K1/02 ,  H05K3/10

CPC classification number: H01L23/49822 ,  B32B37/02 ,  B32B2309/105 ,  B32B2310/0843 ,  B32B2457/00 ,  H01L21/4857 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09136 ,  Y10T29/49117 ,  Y10T156/10 ,  H01L2224/05599

公开(公告)号：EP3195704A1

公开(公告)日：2017-07-26

申请号：EP15747797.7

申请日：2015-08-04

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： KREUTZWIESNER, Elisabeth ,  SCHULZ, Gernot

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H05K1/0207 ,  H05K3/12 ,  H05K3/146 ,  H05K3/16 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/4688 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09136

Abstract: A mounting device for mounting electronic components, wherein the mounting device comprises an electrically conductive structure having a first value of thermal expansion in at least one pre-defined spatial direction, an electrically insulating structure having a second value of thermal expansion in the at least one pre-defined spatial direction being different from the first value and being arranged on the electrically conductive structure, and a thermal expansion adjustment structure having a third value of thermal expansion in the at least one pre-defined spatial direction, wherein the third value is selected and the thermal expansion adjustment structure is located so that thermally induced warpage of the mounting device resulting from a difference between the first value and the second value is at least partially compensated by the thermal expansion adjustment structure.

Abstract translation: 1。一种用于安装电子部件的安装装置（100），其中所述安装装置（100）包括在至少一个预定空间方向上具有第一热膨胀值的导电结构（102），电绝缘结构（104） 在所述至少一个预定义的空间方向上具有第二热膨胀值，所述第二热膨胀值不同于所述第一值并且尤其小于所述第一值并且被布置在所述导电结构（102）上;以及热膨胀调节结构（106） ，特别是在所述导电结构（102）中和/或之上，在所述至少一个预定空间方向上具有第三热膨胀值，其中选择所述第三值并且所述热膨胀调节结构（106）为 其位置使得由所述第一值与所述第二值之间的差引起的所述安装装置（100）的热诱导翘曲至少部分地由所述第 不适当的膨胀调节结构（106）。

公开(公告)号：EP3157606A1

公开(公告)日：2017-04-26

申请号：EP15809576.0

申请日：2015-06-17

Applicant: Cathprint AB

Inventor： KÄLLBÄCK, Bengt ,  BAGAIAN, Tiberiu ,  ROKOSCH, Tobias

IPC: A61M25/00 ,  G01L7/00 ,  H05K1/02

CPC classification number: A61M25/00 ,  A61B5/0215 ,  A61B5/6852 ,  A61B2562/166 ,  A61M2025/0002 ,  G01L19/06 ,  G01L19/147 ,  G01L19/148 ,  G01L19/149 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0162 ,  H05K2201/09136 ,  H05K2201/10151 ,  H05K2201/2009

Abstract: The invention relates to a conductor assembly comprising a resilient tubular outer casing (1) with a flexible printed circuit board (6) in the outer casing's interior. On the circuit board a sensor (3) is arranged. A cavity (8a-c) in the outer casing adjacent to the sensor is filled with a rigid filling material (9). Where the rigid filling material extends in the lengthwise direction of the tubular outer casing (1) at least from one side of the sensor to the opposite side of the sensor. This means that the sensor will not be affected when the conductor assembly is bent or otherwise affected mechanically. The conductor assembly's outer casing (1) comprises an opening (7a-c) to a cavity (8a-c) in the outer casing in connection to the sensor, through which a filling material can be supplied in liquid form. Typically the conductor assembly includes two cavities (8a-b) in the outer casing on the side of the flexible circuit board (6) where the sensor is mounted, the two cavities being on either side of the sensor, and a third cavity (8c) in the outer casing on the side of the flexible circuit board (6) which is opposite to the sensor. In an advantageous embodiment the extension of at least one cavity (8a-c) in the outer casing is limited by bumps (4a-f) on either side of the cavity thus defining the cavity. Injected filler material propagation is governed by these bumps to the relevant space. Typically, the conductor assembly is a catheter or part of a catheter.

Abstract translation: 本发明涉及一种导体组件，该导体组件包括在外壳内部具有柔性印刷电路板（6）的弹性管状外壳（1）。 在电路板上布置传感器（3）。 与传感器相邻的外壳中的空腔（8a-c）填充有刚性填充材料（9）。 在刚性填充材料沿管状外壳（1）的纵向方向至少从传感器的一侧延伸到传感器的相对侧的情况下。 这意味着当导体组件弯曲或受到机械影响时，传感器不会受到影响。 导体组件的外壳（1）包括与外壳中的空腔（8a-c）连接的传感器的开口（7a-c），通过该开口可以以液体形式供应填充材料。 典型地，导体组件在柔性电路板（6）的安装有传感器的一侧上的外壳中包括两个空腔（8a-b），两个空腔位于传感器的任一侧，第三空腔（8c ）位于柔性电路板（6）的与传感器相对的一侧上的外壳中。 在有利的实施例中，外壳中的至少一个空腔（8a-c）的延伸由空腔任一侧上的凸块（4a-f）限制，从而限定了空腔。 注入填充材料的传播是由这些颠簸所控制的相关空间。 通常，导体组件是导管或导管的一部分。

公开(公告)号：EP3094162A1

公开(公告)日：2016-11-16

申请号：EP15735428.3

申请日：2015-01-06

Applicant: Mitsubishi Gas Chemical Company, Inc.

Inventor： TOMIZAWA, Katsuya ,  CHIBA, Tomo ,  ITO, Meguru ,  SHIGA, Eisuke

IPC: H05K1/03 ,  B32B15/08 ,  C08J5/24 ,  H01B3/00 ,  H01B17/56

CPC classification number: H05K1/0271 ,  B32B15/08 ,  C08J5/043 ,  C08J5/24 ,  C08J2379/08 ,  C08J2465/00 ,  C08J2479/04 ,  H05K1/0298 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/022 ,  H05K3/4644 ,  H05K2201/0355 ,  H05K2201/09136

Abstract: The present invention provides an insulating layer for printed circuit boards having a difference of within 20% between the flexural modulus at 25°C and the flexural modulus under heat at 250°C.

Abstract translation: 本发明提供了一种用于印刷电路板的绝缘层，其在25℃下的弯曲模量与在250℃的加热下的挠曲模量之间的差异在20％以内。

公开(公告)号：EP2940727A1

公开(公告)日：2015-11-04

申请号：EP13866760.5

申请日：2013-12-20

Applicant: Mitsubishi Materials Corporation

Inventor： NISHIMOTO, Shuji ,  NAGATOMO, Yoshiyuki

IPC: H01L23/36 ,  H01L23/40 ,  H05K1/02

CPC classification number: H05K1/0271 ,  C04B37/021 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/86 ,  H01L23/3735 ,  H01L23/42 ,  H01L23/473 ,  H01L2224/32225 ,  H05K1/0203 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/0061 ,  H05K3/248 ,  H05K3/32 ,  H05K3/465 ,  H05K7/14 ,  H05K2201/066 ,  H05K2201/09136

Abstract: A power module substrate includes an insulating layer (11), a circuit layer (12) that is formed on a first surface of the insulating layer, and a metal layer (13) that is formed on a second surface of the insulating layer, in which a first base layer (20) is laminated on a surface of the metal layer on the opposite side of the surface to which the insulating layer is provided, and the first base layer has: a first glass layer that is formed at the interface with the metal layer; and a first Ag layer that is laminated on the first glass layer.

公开(公告)号：EP2460393A4

公开(公告)日：2015-03-04

申请号：EP10803777

申请日：2010-07-28

Applicant: ATI TECHNOLOGIES ULC

Inventor： LEUNG ANDREW ,  TOPACIO RODEN ,  MARTINEZ LIANE ,  LOW YIP SENG

IPC: H05K3/00 ,  H01L23/12 ,  H01L23/488 ,  H05K1/02 ,  H05K3/10

CPC classification number: H01L23/49822 ,  B32B37/02 ,  B32B2309/105 ,  B32B2310/0843 ,  B32B2457/00 ,  H01L21/4857 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09136 ,  Y10T29/49117 ,  Y10T156/10 ,  H01L2224/05599