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    ARRANGEMENT OF INTEGRATED CIRCUITS IN A MEMORY MODULE
    201.
    发明申请
    ARRANGEMENT OF INTEGRATED CIRCUITS IN A MEMORY MODULE 审中-公开
    集成电路在存储器模块中的布置

    公开(公告)号：WO03077132A8

    公开(公告)日：2003-12-18

    申请号：PCT/US0306978

    申请日：2003-03-06

    Applicant: NETLIST INC ,  BHAKTA JAYESH R ,  PAULEY ROBERT S JR

    Inventor： BHAKTA JAYESH R ,  PAULEY ROBERT S JR

    IPC: G11C5/00 ,  H05K1/02 ,  H05K1/18 ,  G06F12/00 ,  G06F12/14 ,  G06F12/16 ,  G06F13/00 ,  G06F13/28 ,  H05K7/00

    CPC classification number: H05K1/181 ,  H05K1/0266 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/10689 ,  Y02P70/611

    Abstract: Integrated circuits (202) utilizing standard commercial packaging are arranged on a printed circuit board (104) to allow the production of 1-Gigabyte and 2-Gigabyte capacity memory modules (200). A first row of integrated circuits (202) is oriented in an opposite orientation to a second row of integrated circuits (202). The integrated circuits (202) in a first half of the first row and in the corresponding half of the second row are connected via a signal trace to a first register (210). The integrated circuits (202) in a second half of the first row and in the corresponding half of the second row are connected to a second register (220). Each register processes a non-contiguous subset of the bits in each data word.

    Abstract translation: 使用标准商业包装的集成电路（202）布置在印刷电路板（104）上，以允许生产1千兆字节和2GB容量的存储器模块（200）。 第一排集成电路（202）以与第二排集成电路（202）相反的方向取向。 第一行的前半部分和第二行的相应一半中的集成电路（202）经由信号迹线连接到第一寄存器（210）。 第一行的第二半部分和第二行的相应一半中的集成电路（202）连接到第二寄存器（220）。 每个寄存器处理每个数据字中位的不连续子集。

    METHOD AND ARTICLE FOR THE CONNECTION AND REPAIR OF FLEX AND OTHER CIRCUITS
    202.
    发明申请
    METHOD AND ARTICLE FOR THE CONNECTION AND REPAIR OF FLEX AND OTHER CIRCUITS 审中-公开
    用于连接和修复弯曲和其他电路的方法和文章

    公开(公告)号：WO01017323A1

    公开(公告)日：2001-03-08

    申请号：PCT/GB2000/003090

    申请日：2000-08-10

    IPC: H01R12/79 ,  H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/22 ,  H05K3/36

    CPC classification number: H05K3/361 ,  H05K1/0293 ,  H05K1/117 ,  H05K1/118 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/053 ,  H05K2201/09127 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2203/0228 ,  H05K2203/175 ,  Y10T29/49124 ,  Y10T29/49169 ,  Y10T29/4973 ,  Y10T29/49732

    Abstract: An article and method for making and repairing connections between first and second circuits, such as flex circuits. The article (10) includes: a flexible dielectric substrate (12) having first and second edges 14/16, and a plurality of conductive circuit traces (18) arranged on or within the substrate, wherein each of the traces extends from proximate the first edge (14) to proximate the second edge (16). Each of the circuit traces (18) includes: a first connection feature (20) disposed proximate the first edge (14); a second connection feature (22) disposed proximate the second edge (16); and at least one third connection feature (24) disposed between the first and second edges (14/16). Each of the first, second, and third connection features (20/22/24) is a plated through hole, a plated blind via, or a mounting pad. This article (10) may be used to connect together the first and second circuits (50/60) using the first and second connection features (20/22), such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article (10) may be cut so as to present a set of third connection features (24) to which a new replacement circuit may be connected.

    Abstract translation: 用于制造和修复第一和第二电路之间的连接的物品和方法，例如柔性电路。 制品（10）包括：具有第一和第二边缘14/16的柔性电介质基底（12）和布置在基底上或内部的多个导电电路迹线（18），其中每个迹线从第一 边缘（14）靠近第二边缘（16）。 每个电路迹线（18）包括：靠近第一边缘（14）设置的第一连接特征（20）; 设置在所述第二边缘（16）附近的第二连接特征（22）; 以及设置在第一和第二边缘（14/16）之间的至少一个第三连接特征（24）。 第一，第二和第三连接特征（20/22/24）中的每一个是电镀通孔，电镀盲孔或安装垫。 本文（10）可以用于使用第一和第二连接特征（20/22）例如通过焊接将第一和第二电路（50/60）连接在一起。 如果两个电路中的任一个需要随后分离（例如，由于部件故障），则可以切割物品（10），以便呈现一组第三连接特征（24），新的替换电路可以 连接的。

    METHOD AND DEVICE FOR MEASURING A DEVICE FOR PRODUCING ELECTRICAL COMPONENTS
    203.
    发明申请
    METHOD AND DEVICE FOR MEASURING A DEVICE FOR PRODUCING ELECTRICAL COMPONENTS 审中-公开
    方法和设备测量器件来制造电器元件

    公开(公告)号：WO98042167A2

    公开(公告)日：1998-09-24

    申请号：PCT/DE1998/000759

    申请日：1998-03-13

    IPC: H05K1/02 ,  H05K3/30 ,  H05K13/08 ,  H05K3/00

    CPC classification number: H05K1/0269 ,  H05K3/303 ,  H05K13/08 ,  H05K2201/0108 ,  H05K2201/09409 ,  H05K2201/09918 ,  H05K2201/10689 ,  H05K2203/166

    Abstract: Transparent simulated components (4) are inserted into a test board (1) in an insertion machine for inserting such electrical components into printed-circuit boards at defined points. The simulated components are provided with scale-type markings (5). The test board has reference marks (3) with scales which are parallel with these scales and overlap said markings (4). The two vernier-type scales enable scale displacements to be read more clearly in the case of deviations from the ideal position.

    Abstract translation: 试验板（1）被装配在一个贴片机用于在与透明副本（4）这样的设备定义的位置来填充与电组件的印刷电路板。 副本被提供有鳞片状的标记（5）。 该测试板具有在与所述（4）的标记重叠参考标记（3）平行的规模这些尺度。 两个noniusartigen秤能够在从理想位置的偏差标尺移位的准确的读数。

    PRINTED WIRING BOARD
    207.
    发明公开
    PRINTED WIRING BOARD 审中-公开

    公开(公告)号：EP3174374A4

    公开(公告)日：2018-04-04

    申请号：EP15824394

    申请日：2015-07-10

    Applicant: FUJIKURA LTD ,  DDK LTD

    Inventor： ISHIDA YUKI ,  SUZUKI MASAYUKI ,  URAI HARUNORI

    IPC: H05K1/11 ,  H01R12/77 ,  H01R12/88

    CPC classification number: H05K1/115 ,  H01R12/77 ,  H01R12/78 ,  H01R12/88 ,  H05K1/111 ,  H05K1/113 ,  H05K1/117 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09409

    Abstract: A printed wiring board is provided which comprises: a first substrate (31) on which a plurality of pads (15, 17) to be connected to a connector is arranged to form a front array and a rear array in two rows; a second substrate (32) that is laminated on the first substrate (31) and formed with first wirings (9) connected to first pads (15) of the front array and second wirings (11) connected through vias to second pads (17) of the rear array; engageable parts (28, 29) that are to be engaged with engagement parts of the connector; and one or more reinforcement layers (R1, R2) that are provided at the frontward side in the connecting direction (I) than the engageable parts (28, 29) of the first substrate (31) and/or the second substrate (32). The wirings (9, 11) each have a part formed to have a constant width along the inserting direction to the connector and an expanded-width part expanded to have a wider width than the constant width in the inserting direction of the connector. The expanded-width parts are provided at locations corresponding to respective pads (15, 17). The expanded-width parts include first expanded-width parts having approximately the same shape as that of the first pads (15) and second expanded-width parts having approximately the same shape as that of the second pads (17).

    PRINTED WIRING BOARD
    209.
    发明公开
    PRINTED WIRING BOARD 审中-公开
    印刷线路板

    公开(公告)号：EP3174374A1

    公开(公告)日：2017-05-31

    申请号：EP15824394.9

    申请日：2015-07-10

    Applicant: Fujikura Ltd. ,  DDK Ltd.

    Inventor： ISHIDA, Yuki ,  SUZUKI, Masayuki ,  URAI, Harunori

    IPC: H05K1/11 ,  H01R12/77 ,  H01R12/88 ,  H05K1/02

    CPC classification number: H05K1/115 ,  H01R12/77 ,  H01R12/78 ,  H01R12/88 ,  H05K1/111 ,  H05K1/113 ,  H05K1/117 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09409

    Abstract: A printed wiring board is provided which comprises: a first substrate (31) on which a plurality of pads (15, 17) to be connected to a connector is arranged to form a front array and a rear array in two rows; a second substrate (32) that is laminated on the first substrate (31) and formed with first wirings (9) connected to first pads (15) of the front array and second wirings (11) connected through vias to second pads (17) of the rear array; engageable parts (28, 29) that are to be engaged with engagement parts of the connector; and one or more reinforcement layers (R1, R2) that are provided at the frontward side in the connecting direction (I) than the engageable parts (28, 29) of the first substrate (31) and/or the second substrate (32). The wirings (9, 11) each have a part formed to have a constant width along the inserting direction to the connector and an expanded-width part expanded to have a wider width than the constant width in the inserting direction of the connector. The expanded-width parts are provided at locations corresponding to respective pads (15, 17). The expanded-width parts include first expanded-width parts having approximately the same shape as that of the first pads (15) and second expanded-width parts having approximately the same shape as that of the second pads (17).

    Abstract translation: 提供一种印刷线路板，其包括：第一基板（31），其上布置有连接到连接器的多个焊盘（15,17），以形成两排的前阵列和后阵列; （31）上形成的第二衬底（32），所述第二衬底形成有连接到所述前阵列的第一焊盘（15）的第一布线（9）和通过通孔连接到第二焊盘（17）的第二布线（11） 后排阵列; 可接合部件（28,29），其将与连接器的接合部件接合; 以及与第一基板（31）和/或第二基板（32）的卡合部（28,29）相比设置在连接方向（I）的前方侧的一个以上的加强层（R1，R2） 。 配线（9,11）的一部分形成为沿着向连接器的插入方向具有恒定宽度，并且扩展宽度部分在连接器的插入方向上扩展为具有比恒定宽度更宽的宽度。 扩展宽度部分设置在对应于相应垫（15,17）的位置处。 扩展宽度部分包括具有与第一焊盘（15）大致相同形状的第一扩展宽度部分和具有与第二焊盘（17）的形状近似相同形状的第二扩展宽度部分。

    KONTAKTIERUNGSVORRICHTUNG
    210.
    发明公开
    KONTAKTIERUNGSVORRICHTUNG 审中-公开

    公开(公告)号：EP3123564A1

    公开(公告)日：2017-02-01

    申请号：EP15713190.5

    申请日：2015-03-27

    Applicant: Eugen Forschner GmbH

    Inventor： BRANDT, Thomas ,  PUSKAS, Ludwig

    IPC: H01R12/58 ,  H01R12/70

    CPC classification number: H01R12/585 ,  H01R12/7088 ,  H01R13/74 ,  H05K1/0295 ,  H05K1/115 ,  H05K2201/09409 ,  H05K2201/0979 ,  H05K2201/09954 ,  H05K2201/10181 ,  H05K2201/10303 ,  H05K2201/10962

    Abstract: The invention relates to a contact-making device for producing an electrical contact between a printed circuit board (150) accommodated in an electronics box (2) and an electrical component part (160, 162, 163), wherein the printed circuit board (150) has at least one conductor track or conductor area (F1, F2, F3, F4) having at least one contact opening (152) for receiving at least one contact pin (137; 144) arranged on the electronic component part (160, 162, 163). For simplified and permanently safe contact-making, provision is made for the printed circuit board (150) to have at least one conductor area (F1, F2, F3, F4), which has a multiplicity of contact openings (152) arranged in a regular grid pattern, said contact openings being configured to receive different electrical component parts (160, 162, 163) with in each case a different number of contact pins (137; 138; 144).

    Abstract translation: 本发明涉及一种用于在容纳在电子箱（2）中的印刷电路板（150）和电气部件（160,162,163）之间产生电接触的接触制造装置，其中印刷电路板 ）具有至少一个具有至少一个接触开口（152）的导体轨道或导体区域（F1，F2，F3，F4），用于接收布置在电子部件部件（160,162）上的至少一个接触销（137; 144） ，163）。 为了简化和永久安全的接触，为印刷电路板（150）提供具有至少一个导体面积（F1，F2，F3，F4）的导体区域（F1，F2，F3，F4），其具有多个布置在 所述接触开口被配置为接收不同的电气部件（160,162,163），每种情况下都具有不同数量的接触销（137; 138; 144）。

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