公开(公告)号：EP1130446A3

公开(公告)日：2004-06-23

申请号：EP01300503.8

申请日：2001-01-19

Applicant: Memscap S.A.

Inventor： Hill, Edward Arthur ,  Dhuler, Vijayakumar Rudrappa

IPC: G02B26/08 ,  G02B7/18

CPC classification number: B81B3/004 ,  B81B2201/032 ,  B81B2203/0109 ,  B81B2203/033 ,  B81B2203/058 ,  G02B7/1821 ,  G02B26/0816 ,  H01H1/0036 ,  H01H61/00 ,  H01H2001/0063 ,  H01H2061/006

Abstract: A micromechanical system can include a substrate, an actuator, and an actuated element. In particular, the actuator can include a serpentine arrangement of alternating actuating and opposing segments anchored at a first end thereof to the substrate wherein the actuating segments deflect in response to actuation thereof so that a second end of the serpentine arrangement moves relative to the substrate upon deflection of the actuating segments. The actuated element is attached to the second end of the serpentine arrangement so that the actuated element moves relative to the substrate upon deflection of the actuating segments. Related methods and actuators are also discussed.

公开(公告)号：EP1306350A2

公开(公告)日：2003-05-02

申请号：EP02023905.9

申请日：2002-10-24

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Herbert, Patrick C. ,  Annis, Jeffrey R. ,  Yao, Jun J. ,  Morris, Winfred L. ,  Larsson, Henric ,  Harris, Richard D. ,  Kretschmann, Robert J.

IPC: B81B3/00

CPC classification number: H03H9/462 ,  B81B3/0072 ,  B81B2201/032 ,  B81B2203/0109 ,  B81B2203/051

Abstract: In a MEMS device employing a beam supported by transverse arms, potential bowing of the transverse arms caused by fabrication processes, temperature or local self-heating from resistive losses is accommodated by flexible terminations of the transverse arms. Alternatively, this bowing is controlled so as to provide selective biasing to the beam or mechanical advantage in the sensing of beam motion.

Abstract translation: 在使用由横向臂支撑的光束的MEMS装置中，通过制造工艺引起的横向臂的电位弯曲，来自电阻损耗的温度或局部自加热由横向臂的柔性端接来适应。 或者，该弯曲被控制，以便在感测光束运动时提供对光束的选择偏置或机械优点。

公开(公告)号：US20230373781A1

公开(公告)日：2023-11-23

申请号：US18319154

申请日：2023-05-17

Applicant: Hahn-Schickard-Gesellschaft für angewandte Forschung e. V.

Inventor： Jan Rockstroh ,  Achim Bittner ,  Daniel Hoffmann ,  Alfons Dehé

IPC: B81B3/00 ,  B81C1/00 ,  G02B26/08

CPC classification number: B81B3/0043 ,  B81C1/00158 ,  G02B26/0833 ,  B81B2201/032 ,  B81B2201/042 ,  B81B2203/0118 ,  B81C2201/0132 ,  B81B2203/055 ,  B81B2203/0127

Abstract: A MEMS actuator comprising a frame structure and at least one actuator arm. The actuator arm is connected at a first end to the frame structure and at a second end to an actuator body. The MEMS actuator is characterized in that the at least one actuator arm has a meander structure comprising two or more actuator sections. The two or more actuator sections are oriented substantially perpendicular to the longitudinal axis of the actuator arm. Furthermore, the two or more actuator sections comprise at least one layer of an actuator material, wherein a movement of the actuator body can be effected by actuating the two or more actuator sections. Further disclosed is a method for producing the MEMS actuator.

公开(公告)号：US20230251556A1

公开(公告)日：2023-08-10

申请号：US18134671

申请日：2023-04-14

Applicant: STMicroelectronics S.r.l.

Inventor： Nicolo' BONI ,  Roberto CARMINATI ,  Massimiliano MERLI

IPC: G03B21/00 ,  B81B3/00 ,  G02B26/08 ,  G02B26/10 ,  G03B21/28

CPC classification number: G03B21/008 ,  B81B3/0021 ,  G02B26/0858 ,  G02B26/105 ,  G03B21/28 ,  B81B2201/042 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2203/058 ,  B81B2201/032

Abstract: Disclosed herein is a microelectromechanical device that features a fixed structure defining a cavity, a tiltable structure elastically suspended within the cavity, and a piezoelectrically driven actuation structure that rotates the tiltable structure about a first rotation axis. The actuation structure includes driving arms with piezoelectric material, elastically coupled to the tiltable structure by decoupling elastic elements that are stiff to out-of-plane movements but compliant to torsional movements. The tiltable structure is elastically coupled to the fixed structure at the first rotation axis using elastic suspension elements, while the fixed structure forms a frame surrounding the cavity with supporting elements. A lever mechanism is coupled between a supporting element and a driving arm.

公开(公告)号：US20230189654A1

公开(公告)日：2023-06-15

申请号：US18109180

申请日：2023-02-13

Applicant: Apple Inc.

Inventor： Majid KHAN ,  Roberto M. RIBEIRO ,  Savas GIDER

IPC: H10N30/88 ,  G01S3/781 ,  H10N30/00 ,  H10N30/20

CPC classification number: H10N30/88 ,  G01S3/781 ,  H10N30/1071 ,  H10N30/2047 ,  B81B2201/0264 ,  B81B2201/032

Abstract: Aspects of the subject disclosure include a pressure-sensing device consisting of a housing including a membrane and one or more piezoresistive elements disposed on the membrane to sense a displacement due to a deflection of the membrane. A first set of electrodes is disposed over the membrane, and a second set of electrodes is disposed on a permeable port of the device at a distance from the membrane. The first and second sets of electrodes form an electrostatic actuator to exert a repulsive force onto the membrane to reduce the deflection of the membrane.

公开(公告)号：US20180192204A1

公开(公告)日：2018-07-05

申请号：US15861787

申请日：2018-01-04

Applicant: Robert Bosch GmbH

Inventor： Ahmad Mansour ,  Daniel Pantel ,  Fabian Purkl ,  Kerrin Doessel ,  Thomas Buck ,  Thomas Northemann

IPC: H04R17/02 ,  H04R17/00 ,  H04R31/00 ,  B81B3/00

CPC classification number: H04R17/025 ,  B81B3/0051 ,  B81B3/0072 ,  B81B2201/0257 ,  B81B2201/032 ,  B81B2203/0118 ,  H04R17/005 ,  H04R31/006

Abstract: A micromechanical sound transducer system includes a substrate that includes (a) a cavity with a cavity edge area, (b) a front side, and (c) a rear side; a piezoelectric vibrating beam that is elastically suspended on the front side and that extends across the cavity; and, for the piezoelectric vibrating beam, a respective deflection limiting device that is on a front edge area of the respective vibrating beam and that is configured to limit a deflection of the respective vibrating beam to a limiting deflection by causing the respective front edge area of the respective vibrating beam to interact with the cavity edge area or an opposing front edge area of another vibrating beam.

公开(公告)号：US20180180873A1

公开(公告)日：2018-06-28

申请号：US15594287

申请日：2017-05-12

Applicant: STMicroelectronics S.r.l.

Inventor： Roberto Carminati ,  Domenico Giusti ,  Sonia Constantini

IPC: G02B26/08 ,  B81B3/00 ,  G02B26/10 ,  H04N9/31

CPC classification number: G02B26/0858 ,  B81B3/0083 ,  B81B2201/032 ,  B81B2203/0118 ,  G02B26/105 ,  H04N9/3129

Abstract: A MEMS device includes a fixed structure and suspended structure including an internal structure and a first arm and a second arm. Each arm has a first end fixed to the fixed structure and a second end fixed to the internal structure. The ends are angularly arranged at a distance apart. Piezoelectric actuators mounted to the arms are driven so as to cause deformation of the arm and produce a rotation of the internal structure. In a resting condition, each of the first and second arms has a respective elongated portion with a respective concavity. The internal structure extends in part within the concavities of the elongated portions of the first and second arms.

公开(公告)号：US20180179053A1

公开(公告)日：2018-06-28

申请号：US15902570

申请日：2018-02-22

Applicant: UBEAM INC.

Inventor： Andrew Joyce ,  Sean Taffler ,  Paul Reynolds ,  Nicholas Lavada Nemeth ,  Adam Stephen Elhadad ,  Boozarjomehr Faraji

IPC: B81C1/00 ,  H01L21/00 ,  F16B11/00 ,  G03F7/00

CPC classification number: B81C1/00182 ,  B81B2201/0271 ,  B81B2201/032 ,  B81B2203/0127 ,  B81C2203/032 ,  F16B11/006 ,  G03F7/00 ,  H01L21/00

Abstract: Systems and techniques are provided for membrane bonding. A photoresist may be applied to an ultrasonic device. A portion of the photoresist may be removed. A bonding agent may be applied a portion of the photoresist that is not removed. A membrane may be placed on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent and the photoresist. The membrane and the ultrasonic device may be placed in between a first flat plate and a second flat plate, such that the second flat plate rests on top of the membrane. Light pressure may be applied to the membrane. The light pressure may be applied by one or more of the weight of the second flat plate and a pressure providing device applying pressure to either or both of the first flat plate and the second flat plate.

公开(公告)号：US20180088321A1

公开(公告)日：2018-03-29

申请号：US15699346

申请日：2017-09-08

Applicant: Yuki MARUYAMA ,  Tsukasa YAMADA

Inventor： Yuki MARUYAMA ,  Tsukasa YAMADA

IPC: G02B26/08 ,  G02B26/10

CPC classification number: G02B26/0858 ,  B81B3/0072 ,  B81B2201/032 ,  B81B2201/042 ,  B81B2203/058 ,  G02B26/10

Abstract: An optical scanning device is provided. The optical scanning device includes a mirror having an optical reflection surface, a movable frame supporting the mirror, a pair of drive beams supporting the movable frame from both sides, a drive source, disposed on the drive beams, that causes the movable frame to be swung around a predetermined axis, a fixed frame supporting the drive beams. Each of the drive source includes a lower electrode formed on the drive beams, a piezoelectric thin film formed on the lower electrode, an upper electrode formed on the piezoelectric thin film, and a stress counter film, formed on the upper electrode or formed between the piezoelectric thin film and the upper electrode, that generates a compressive stress on the drive beams.

公开(公告)号：US09866971B2

公开(公告)日：2018-01-09

申请号：US15305089

申请日：2014-08-26

Applicant: GOERTEK INC.

Inventor： Quanbo Zou ,  Zhe Wang ,  Jifang Tao ,  Guanxun Qiu

IPC: H04R25/00 ,  H04R19/02 ,  H04R7/06 ,  H04R31/00 ,  H04R19/01 ,  B81B7/00 ,  B81C1/00

CPC classification number: H04R19/02 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2201/032 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00158 ,  B81C2201/0197 ,  H04R7/06 ,  H04R19/013 ,  H04R31/00 ,  H04R31/003 ,  H04R2201/003 ,  H04R2307/025 ,  H04R2307/027

Abstract: The present invention provides a method for manufacturing a thermal bimorph diaphragm and a MEMS speaker with thermal bimorphs, wherein the method comprises the steps of: thermally oxidizing a substrate to obtain an insulating layer thereon and providing a metal layer on the insulating layer; providing a sacrificial layer on the metal layer; providing a first thermal bimorph layer on the sacrificial layer; providing a second thermal bimorph layer on the first thermal bimorph layer; providing a metal connecting layer at the positions on the metal layer where the sacrificial layer is not provided; forming corresponding back holes on the substrate and the insulating layer and releasing the sacrificial layer; forming the thermal bimorph diaphragm which is warped with the first thermal bimorph layer and the second thermal bimorph layer after the sacrificial layer is released.