Abstract:
A microshutter array has a frame having a light transmissive portion. Linear microshutter elements extend across the light transmissive portion and in parallel to each other. Each microshutter element has a flat blade extended in a length direction and first and second torsion arms extending outwards from each side of the blade in the length direction, the blade extending across the light transmissive portion. There is at least one electrode associated with each linear microshutter element and extended in the length direction parallel to the microshutter element.
Abstract:
Briefly, in accordance with one embodiment of the invention, a switch structure or the like such as a valve, motor, or optical switch, may be constructed based on a thermoresponsive polymer. At a first temperature the thermoresponsive polymer may be in a first volume state, and at a second temperate the thermoresponsive polymer may be in a second volume state. The change in volume of the thermoresponsive polymer may be operative to push or pull the mechanical structures of the switch, valve, motor, optical switch, and so on, to effectuate operation of the structures.
Abstract:
A bi-stable micro-actuator is formed from a first and a second silicon-on-insulator wafer fused together at an electrical contact layer. A cover with a V-groove defines an optical axis. A collimated optical signal source in the V-groove couples an optical signal to an optical port in the V-groove. A mirror surface on a transfer member blocks or reflects the optical signal. The transfer member has a point of support at the first and second end. An expandable structure applies a compressive force between the first and second point of support of the transfer member along a compressive axis to hold the transfer member in a bowed first state or a bowed second state. A control signal applied to a heating element in the expandable structure reduces the compressive force, switching the transfer member to a second state.
Abstract:
An electrostatic MEMS element for flattening a drive side electrode surface and improving its performance as well as for improving degree of design freedom in a manufacturing process. A manufacturing method of the electrostatic MEMS element is also disclosed. Moreover, a GLV device using the MEMS element and a laser display using the GLV device are also disclosed. The electrostatic MEMS element includes a substrate side electrode and a beam having a drive side electrode driven by an electrostatic attracting force or electrostatic repulsive force functioning between the substrate side electrode and the drive side electrode. The substrate side electrode is formed in a conductive semiconductor region having impurities in the semiconductor substrate so as to constitute an electrostatic drive MEMS element.
Abstract:
A microelectromechanical device, comprizing: at least one flexible member formed from an alloy comprising: one or more noble metals selected from the group consisting of gold, platinum and palladium; and one or more alloying elements, the elements selected from iridium, ruthenium, rhodium, palladium, gold, tungsten, osmium and nickel, wherein the one or more alloying elements form a solid solution with the one or more noble metals and wherein the one or more alloying elements are present in an amount sufficient to provide at least one performance characteristic at least 50% greater than the noble metal alone, said performance characteristic selected from the group consisting of yield srength, tensile strength and hardness.
Abstract:
MEMS device (300) having an actuator (302, 306) with curved electrodes (308, 310). According to one embodiment of the present invention, an actuator is provided for moving an actuating device linearly. The actuator includes a substrate (304) having a planar surface and an actuating device movable in a linear direction relative to the substrate. The actuator includes at least one electrode beam (312, 314) attached to the actuating device and having an end attached to the substrate (304). The electrode beam is flexible (322, 324) between the actuating device and the end of the electrode beam attached to the substrate. Furthermore, the actuator includes at least one electrode (308, 310) attached to the substrate. The electrode (308, 310) has a curved surface aligned in a position adjacent the length of the electrode beam, whereby the actuating device is movable in its substantially linear direction as the electrode beam (312, 314) moves in a curved fashion corresponding substantially to the curved surface of the electrode.
Abstract:
An optical MEMS device is fabricated by micromachining a substrate (10) that has an antireflective coating (12A, 12B) on at least one surface. The micromachining process creates a microstructure that is movable and capable of interacting with an optical signal that is propagating through the substrate. A metal layer (14) is patterned to provide an electrical contact as means of actuating the movable microstructure. Also described is a method in which two substrate are bonded together form the optical MEMS device. Prior to the bonding of the two substrates, one substrate has an antireflective coating while the other substrate contains the movable microstructure.
Abstract:
An optical MEMS device is fabricated by forming an aperture (20) through the thickness of a first substrate (10) to enable an optical signal to be transmitted through the aperture (20). A movable, actuatable microstructure is formed on a second substrate (30). The second substrate (30) is bonded to the first substrate (10). The first and second substrates (10, 30) are aligned to enable the microstructure to interact with the optical signal upon actuation of the microstructure. A conductive element (25A) is formed on the first substrate (10) to serve as a contact or an interconnect. A channel (43) is formed in the second substrate (30). An insulating layer (57A) can be deposited on the inside surfaces of this channel (43). When the first and second substrates (10, 30) are bonded together, the conductive element (25A) formed on the first substrate (10) is disposed within the channel (43) and is isolated from conductive regions of the resulting optical MEMS device. In another method, an optical MEMS device is fabricated from a substrate (200) that comprises an etch-stop layer (200C) interposed between first and second bulk layers (200A, 200B). The movable, actuatable microstructure is formed into the first bulk layer (200A), and the aperture (230) is formed through the second bulk layer (200B).
Abstract:
A method for forming a suspend structure with thin film flexible elements is disclosed. In one embodiment, the method etches a trench in a bulk substrate around to be released components. The trench is filled with sacrificial material. The surface of the sacrificial material is planarized. Thin film hinge material is patterned and etched on the surface of the sacrificial material. The bulk substrate is then etched from the backside to pre-release the sacrificial material. The sacrificial material is etched to remove the sacrificial material, thus forming a suspended structure with thin film hinges.