公开(公告)号：EP0620594A3

公开(公告)日：1995-01-18

申请号：EP94302551.0

申请日：1994-04-12

Applicant: SHINKO ELECTRIC INDUSTRIES CO. LTD.

Inventor： Tanaka, Masato, c/o SHINKO ELECTRIC IND. CO. LTD. ,  Higashi, Mitsutoshi, c/o SHINKO ELEC. IND. CO.LTD ,  Takahashi, Iwao, c/o SHINKO ELECTRIC IND. CO. LTD. ,  Miyasaka, Toshiji, c/o SHINKO ELECTRIC IND. CO.LTD

IPC: H01L23/498 ,  H01L23/057

CPC classification number: H01L23/49827 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/301 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/4038 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10477 ,  H05K2201/10704 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A semiconductor device includes: a plate like device substrate (12) having upper and lower surfaces and a semiconductor chip (14) rigidly mounted on one of them. Circuit patterns (16) are formed on the one surface, each circuit pattern having one end electrically connected to the semiconductor chip (14) and the other end formed as a land portion (20) for electrical connection to an outside circuit. A plate like terminal substrate (26) has upper and lower surfaces and a plurality of through holes (30) and a plurality of mounting terminals (32) inserted into and fixed to the through holes (30). The mounting terminal (32) projects from the upper and lower surfaces of the terminal substrate, respectively. The terminal substrate (26) is attached to the device substrate (12), so that upper contacts (34) on the terminal substrate are electrically connected to the land portions (20) on the device substrate (12).

Abstract translation: 半导体器件包括：具有上表面和下表面的板状器件基板（12）和刚性地安装在其中一个上的半导体芯片（14）。 电路图案（16）形成在一个表面上，每个电路图案的一端电连接到半导体芯片（14），另一端形成为用于与外部电路电连接的接地部分（20）。 板状端子基板（26）具有上表面和下表面，以及插入并固定到通孔（30）的多个通孔（30）和多个安装端子（32）。 安装端子（32）分别从端子基板的上表面和下表面突出。 端子基板（26）附接到器件基板（12），使得端子基板上的上触点（34）电连接到器件基板（12）上的焊盘部分（20）。

公开(公告)号：EP0443578A1

公开(公告)日：1991-08-28

申请号：EP91102547.6

申请日：1991-02-21

Applicant: NEC CORPORATION

Inventor： Inasaka, Jun, c/o NEC Corporation

IPC: H05K1/11

CPC classification number: H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15312 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/4076 ,  H05K3/4605 ,  H05K3/4629 ,  H05K3/467 ,  H05K2201/0154 ,  H05K2201/09563 ,  H05K2201/10318 ,  H01L2924/00

Abstract: A multilayer ceramic wiring substrate includes a polyimide resin layer, first lands, and pins for external connection. The polyimide resin layer is formed on a ceramic substrate and has via holes arranged at positions where the polyimide resin layer is connected to through holes filled with a conductive material. The first lands are formed on the upper surface of the polyimide resin layer to cover the via holes. The pins are respectively brazed to the first lands by a brazing material.

Abstract translation: 多层陶瓷布线基板包括聚酰亚胺树脂层，第一焊盘和用于外部连接的引脚。 聚酰亚胺树脂层形成在陶瓷基板上，并且在聚酰亚胺树脂层连接到填充有导电材料的通孔的位置处具有通孔。 第一焊盘形成在聚酰亚胺树脂层的上表面上以覆盖通孔。 引脚分别通过钎焊材料钎焊到第一焊盘。

公开(公告)号：EP0162474A2

公开(公告)日：1985-11-27

申请号：EP85106413.9

申请日：1985-05-24

Applicant: FUJITSU LIMITED

Inventor： Tanibe, Norio

IPC: H05K9/00 ,  H05K3/30

CPC classification number: H04M1/0277 ,  H01R12/58 ,  H01R12/718 ,  H05K1/0237 ,  H05K1/141 ,  H05K3/308 ,  H05K3/368 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10333 ,  H05K2201/10371 ,  H05K2201/10871

Abstract: A printed circuit board (10) comprises a baseboard (15), having conductor patterns (15c,15d,15e) therein and ground layers (15a,15b) on both surfaces thereof, and terminal pins (16) mounted on the baseboard (15). The terminal pins (16) have a root portion which does not project from the baseboard (15) and a contact portion which projects from the baseboard (15). A circuit assembly comprises a mother printed circuit board (10), such as the above-mentioned printed circuit board, on which circuit modules (11) are mounted. The circuit module (11) has terminal jacks (14), which are enclosed within a shielded package (13) and into which the terminal pins (16) of the mother printed circuit board (10) are connected by insertion.

公开(公告)号：EP2194576B1

公开(公告)日：2017-12-06

申请号：EP08832607.9

申请日：2008-09-16

Applicant: Olympus Corporation

Inventor： NAKAMURA, Mikio ,  KONDO, Yu

IPC: H01L25/07 ,  H01L25/065 ,  H01L25/10 ,  H05K1/14 ,  H05K3/30 ,  H01L23/31 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/30 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/19 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/274 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/0002 ,  H01L2924/01079 ,  H05K1/144 ,  H05K3/284 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10318 ,  H05K2203/025 ,  H05K2203/1316 ,  Y10T29/49117 ,  Y10T29/4913 ,  H01L2924/00

Abstract: There is provided a stacked mounting structure in which, it is possible to realize a narrowing of pitch and to secure a height which enables to mount components to be mounted, and a method of manufacturing stacked mounting structure. The stacked mounting structure includes a plurality of members provided with a mounting area which is necessary for installing and operating components to be mounted on at least one principal surface, and an area for connections for signal transfer for operating the components to be mounted, and an electroconductive member which is disposed on the area for connections between the mutually facing members, and a cross section of the electroconductive member is same as or smaller than the area for connections, and an end portion of the electroconductive member is extended from a principal surface of one member up to a principal surface of the other member, and a height of the electroconductive member regulates a distance of the mounting area.

公开(公告)号：EP3139447A4

公开(公告)日：2017-08-09

申请号：EP15802417

申请日：2015-05-18

Applicant: HUAWEI TECH CO LTD

Inventor： ZHANG GUODONG ,  ZHANG JIAN ,  SHU JIANPING

IPC: H01R12/75 ,  H04Q1/02 ,  H05K1/18 ,  H05K7/14

CPC classification number: H05K7/1439 ,  H01R12/7005 ,  H01R12/75 ,  H01R12/79 ,  H04Q1/15 ,  H05K1/141 ,  H05K1/18 ,  H05K7/1449 ,  H05K7/1451 ,  H05K7/1452 ,  H05K2201/044 ,  H05K2201/10318 ,  H05K2201/10356

Abstract: A backplane and a communications device are disclosed. The backplane includes: at least one fixing plate (200), multiple connectors (300), and multiple flexible cables (400), where signal connection is implemented between corresponding connectors (300) by means of the flexible cables (400), each of the connectors (300) is provided with a housing (301) and multiple signal pins (302) installed on the housing (301), and the housing (301) is installed on the fixing plate (200) and is provided with a jack for insertion of a connector of a subcard in the communications device; one end of each signal pin (302) is inserted into the jack, and the other end is connected to each flexible cable (400); and a surface of the fixing plate (200) facing the subcard in the communications device is an insertion surface, and the multiple flexible cables (400) are located on a side of the fixing plate opposite to the insertion surface. When the communications device provided with the backplane transmits a high-rate signal, transmission quality and a transmission rate are relatively high.

Abstract translation: 公开了背板和通信设备。 背板包括：至少一个固定板（200），多个连接器（300）和多个柔性电缆（400），其中通过柔性电缆（400）在对应的连接器（300）之间实现信号连接， 所述连接器（300）具有安装在所述壳体（301）上的壳体（301）和多个信号引脚（302），并且所述壳体（301）安装在所述固定板（200）上并且设置有插孔 在通信设备中插入子卡的连接器; 每个信号引脚（302）的一端插入插座，另一端连接到每根柔性电缆（400）; 所述通信设备中面向所述子卡的固定板的表面为插入面，所述多根柔性线缆位于所述固定板的与所述插入面相对的一侧。 当配备底板的通信设备发送高速率信号时，传输质量和传输速率相对较高。

公开(公告)号：EP3152986A1

公开(公告)日：2017-04-12

申请号：EP15730353.8

申请日：2015-06-04

Applicant: Apple Inc.

Inventor： LEE, Meng Chi ,  PENNATHUR, Shankar ,  GOOCH, Scott, L. ,  PYPER, Dennis, R. ,  SALEHI, Amir

IPC: H05K1/14 ,  H05K3/40 ,  H05K3/28

CPC classification number: H05K1/181 ,  H05K1/115 ,  H05K1/141 ,  H05K1/144 ,  H05K1/189 ,  H05K3/284 ,  H05K3/303 ,  H05K3/363 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2203/1316 ,  Y10T29/49128

Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer (120 ) for providing an interconnection between a system-in-a-package module comprising a first board (110), electronic components (130, 132) and a molded portion (140), and other components (150) in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.

Abstract translation: 易于修改和可定制的低面积架空互连结构，用于在系统级封装模块和电子设备中的其他组件之间形成连接。 一个示例可以提供用于在系统级封装模块和电子设备中的其它部件之间提供互连的插入器。 另一个可以提供多个导电引脚以在模块和其他部件之间形成互连路径。

公开(公告)号：EP2937628A1

公开(公告)日：2015-10-28

申请号：EP13865211.0

申请日：2013-12-16

Applicant: Leeleds Lighting (Xiamen) Co., Ltd.

Inventor： WANG, Linhua ,  ZHU, Xiaolei ,  ZHOU, Lin ,  ZHAO, Han

IPC: F21V23/00 ,  F21Y101/02

CPC classification number: F21V23/06 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V23/00 ,  F21V23/006 ,  F21Y2115/10 ,  H01R33/18 ,  H01R33/225 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10333 ,  H05K2201/10393 ,  H05K2201/1059 ,  H05K2201/10878

Abstract: An electric connecting piece (30) and an LED lamp using the electric connecting piece (30) are provided. The electric connecting piece (30) is used for the electric connection between a light source substrate (20) and a driving board (40) of the LED lamp (100), and comprises an input terminal (32) and an output terminal (34). The LED lamp (100) comprises the driving board (40) and the light source substrate (20). The output terminal (34) is provided on the driving board (40) of the LED lamp (100), and the light source substrate (20) is provided with a fixing hole (22) corresponding to the input terminal (32). The input terminal (32) is fixed in the fixing hole (22) of the light source substrate (20) and is electrically connected with the light source substrate (20). The output terminal (34) comprises two contacts (342), and one end of each of the two contacts (342) is electrically connected with the driving board (40) respectively. The input terminal (32) comprises two connection heads which are respectively provided corresponding to the two contacts (342). One end of each of the two connection heads is electrically connected with the light source substrate (20) respectively. During assembling, the two contacts (342) of the output terminal (34) are respectively inserted into the two corresponding connection heads of the input terminal (32), and the two connection heads are elastically propped against the two contacts (342) respectively. The electric connecting piece (30) has the advantage of convenience in automatic assembling.

Abstract translation: 提供了电连接件（30）和使用电连接件（30）的LED灯。 电连接件（30）用于LED灯（100）的光源基板（20）和驱动板（40）之间的电连接，并包括输入端子（32）和输出端子（34） ）。 LED灯（100）包括驱动板（40）和光源基板（20）。 输出端子34设置在LED灯100的驱动板40上，光源基板20设置有与输入端子32对应的固定孔22。 输入端子（32）固定在光源基板（20）的固定孔（22）中并与光源基板（20）电连接。 输出端子（34）包括两个触点（342），两个触点（342）中的每一个的一端分别与驱动板（40）电连接。 输入端子（32）包括分别对应于两个触点（342）设置的两个连接头。 两个连接头中的每一个的一端分别与光源基板（20）电连接。 在组装时，输出端子（34）的两个触点（342）分别插入到输入端子（32）的两个对应的连接头中，并且两个连接头分别弹性地抵靠两个触点（342）。 电连接件（30）具有便于自动组装的优点。

公开(公告)号：EP2328391B1

公开(公告)日：2015-05-27

申请号：EP10014504.4

申请日：2010-11-11

Applicant: STILL GmbH

Inventor： Wilhoeft, Adolf ,  Schmidt, Niels ,  Schettgen, Nils Christoph

IPC: H05K1/14 ,  H02M7/00

CPC classification number: H05K1/144 ,  H02M7/003 ,  H05K1/056 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/209 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10272 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10409 ,  H05K2201/10871 ,  H05K2201/2036

公开(公告)号：EP2273129A3

公开(公告)日：2013-07-03

申请号：EP10006762.8

申请日：2010-06-30

Applicant: LTi DRiVES GmbH

Inventor： Wiesing, Josef, Dr. ,  Wagner, Martin

IPC: F04D19/04 ,  H01R13/52 ,  F04D25/06 ,  F04D29/08

CPC classification number: F04D19/042 ,  F04D19/04 ,  F04D25/0693 ,  F04D29/083 ,  H01R13/533 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2203/1147

Abstract: In einer elektrischen Verbindungseinheit, die mit vakuumdichter Signalführung an eine Vakuumpumpe angeschlossen werden kann, ist eine einlagige durchkontaktierte Keramikplatte (3) zwischen einem atmosphärenseitigen Gehäuseteil (1) und einem vakuumseitigen Gehäuseteil (2) vakuumdicht eingeklemmt. In dem atmosphärenseitigen Gehäuseteil (1) ist ein Steckverbinder (25, 26) angeordnet, der auf der Atmosphärenseite außen anschließbar ist und mit Durchkontaktierungen (16, 16', 17, 17') der Keramikplatte (3) in signalführender Verbindung steht. An der Vakuumseite der Keramikplatte (3) ist mindestens ein Steckverbinder (18, 19) angebracht, der über die Durchkontaktierungen (16, 16', 17, 17') der Keramikplatte (3) mit dem auf der Atmosphärenseite außen anschließbaren Steckverbinder (25, 26) signalführend verbunden ist.

公开(公告)号：EP2220678A4

公开(公告)日：2012-04-25

申请号：EP08756454

申请日：2008-05-29

Applicant: OCCAM PORTFOLIO LLC

Inventor： FJELSTAD JOSEPH C

IPC: H05K1/18 ,  H05K1/14

CPC classification number: H05K1/144 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/3025 ,  H05K1/0207 ,  H05K1/185 ,  H05K3/284 ,  H05K3/4664 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10386 ,  H05K2201/1056 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012