公开(公告)号：EP3001782A4

公开(公告)日：2017-03-22

申请号：EP13897416

申请日：2013-11-15

Applicant: WONDER FUTURE CORP

Inventor： SATO AKIRA ,  FUKUDA KOKI ,  SUGIYAMA KAZUHIRO

IPC: H05K3/36 ,  H05K3/34

CPC classification number: H05K3/22 ,  B29C65/14 ,  B29C65/1432 ,  B29C65/1445 ,  H05K1/032 ,  H05K1/0326 ,  H05K1/117 ,  H05K1/118 ,  H05K1/119 ,  H05K1/147 ,  H05K3/0014 ,  H05K3/101 ,  H05K3/3494 ,  H05K3/363 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/2018 ,  H05K2203/101 ,  H05K2203/1105

Abstract: The object of the present invention is to provide a method for preventing a molded body made of low melting point resin from being thermally damaged when external connection terminals provided on the molded body and external connection terminals provided on a flexible sheet are joined together via soldering. The method comprises an arranging step of arranging the connection terminal of the molded body and the connection terminal of the flexible sheet such that the connection terminals face each other, and an electromagnetic induction heating step of performing electromagnetic induction heating after the arranging step.

公开(公告)号：EP3100359A1

公开(公告)日：2016-12-07

申请号：EP15742811.1

申请日：2015-01-26

Applicant: Ricoh Company, Ltd.

Inventor： ADACHI, Kazuhiko ,  HARASAKA, Kazuhiro ,  ITOH, Akihiro

IPC: H03L7/26 ,  H01S1/06 ,  H05K1/18 ,  H05K3/34

CPC classification number: H03L7/26 ,  G04F5/14 ,  H01L23/345 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01S5/005 ,  H01S5/02248 ,  H01S5/02453 ,  H01S5/183 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/11 ,  H05K1/189 ,  H05K3/0052 ,  H05K2201/052 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09063 ,  H05K2201/10075 ,  H05K2201/10174 ,  H05K2201/2018 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An atomic oscillator includes a gas cell and a plurality of components. The plurality of components includes a temperature control device for the gas cell; an excitation light source that emits excitation light to excite atoms enclosed in the gas cell; a temperature control device for the excitation light source; and a light receiving element that detects the excitation light that passes through the gas cell. The plurality of components is mounted on an insulating film having wiring.

公开(公告)号：EP3090854A1

公开(公告)日：2016-11-09

申请号：EP15166811.8

申请日：2015-05-07

Applicant: Electrolux Appliances Aktiebolag

Inventor： De Pellegrin, Andrea ,  Armonia, Massimiliano ,  Castellarin, Valter

IPC: B29C45/14 ,  D06F39/00 ,  H05K3/28 ,  H05K5/00 ,  H05K5/06 ,  B29C70/72 ,  H05K1/11

CPC classification number: H05K3/284 ,  B29C70/72 ,  D06F39/00 ,  H05K1/117 ,  H05K2201/10446 ,  H05K2201/2018 ,  H05K2203/1316

Abstract: Household appliance (2) with at least one control circuit board (150) , said control circuit board (150) comprising at least one contact (180, 184) provided at the periphery (182) of said board (150), and further comprising a protective layer (220, 226), said layer (220, 226) covering said board (150) at least partially, wherein a separating element (52) is provided on said board (150), said separating element (52) being configured and positioned to separate said at least one contact (180, 184) from said protective layer (220, 226).

Abstract translation: 具有至少一个控制电路板（150）的家用电器（2），所述控制电路板（150）包括设置在所述板（150）的外围（182）处的至少一个触点（180,184），并且还包括 保护层（220,226），所述层（220,226）至少部分地覆盖所述板（150），其中在所述板（150）上设置有分离元件（52），所述分离元件（52）被配置 并且定位成将所述至少一个触点（180,184）与所述保护层（220,226）分离。

公开(公告)号：EP2187054A4

公开(公告)日：2016-10-19

申请号：EP08777657

申请日：2008-06-27

Applicant: MITSUBISHI HEAVY IND LTD

Inventor： NAKAGAMI TAKASHI ,  YAKUSHIJI SHUNSUKE ,  NAKANO KOJI ,  ASAI MASAHIKO ,  HATTORI MAKOTO ,  NIWA KAZUKI

IPC: F04B39/00 ,  H02K11/04 ,  H02K11/33 ,  H02M7/00 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/368 ,  F04B39/121 ,  H02K11/33 ,  H02M7/003 ,  H05K1/144 ,  H05K3/3447 ,  H05K2201/09409 ,  H05K2201/10303 ,  H05K2201/2018

Abstract: In an inverter control apparatus in which a control circuit board is fixed by use of pin-like terminals provided in a power board, the breakage of the pin-like terminals is prevented. The power board 160 is provided with a plurality of signal transmission terminals 210a, 210b, 220a, 220b for signal transmission to and from the control circuit board 150 and for grounding along each of a pair of opposed sides, the control circuit board 150 is electrically connected to the plurality of signal transmission terminals 210a etc. and is fixed by soldering to the plurality of signal transmission terminals 210a etc., and the plurality of signal transmission terminals 210a etc. are arranged along each of the pair of sides in a plurality of rows.

公开(公告)号：EP2774141A4

公开(公告)日：2015-07-22

申请号：EP12845474

申请日：2012-10-24

Applicant: NOKIA CORP

Inventor： CALVO ALONSO VICENTE

IPC: G06F3/041 ,  G02F1/1333 ,  G06F1/16 ,  H05K3/30 ,  H05K3/32

CPC classification number: G06F1/1643 ,  G02F1/13458 ,  G06F1/1656 ,  G06F3/0416 ,  H05K3/301 ,  H05K3/32 ,  H05K2201/10128 ,  H05K2201/10962 ,  H05K2201/2018 ,  Y10T29/49117

公开(公告)号：EP2792222A1

公开(公告)日：2014-10-22

申请号：EP12795763.7

申请日：2012-11-20

Applicant: Robert Bosch GmbH

Inventor： LISKOW, Uwe

IPC: H05K1/11 ,  H05K3/30 ,  H05K3/34 ,  H05K1/02 ,  H05K5/00

CPC classification number: H05K1/11 ,  F16H61/0251 ,  H05K1/021 ,  H05K1/0296 ,  H05K1/112 ,  H05K1/181 ,  H05K3/303 ,  H05K3/3421 ,  H05K2201/10424 ,  H05K2201/2018 ,  Y02P70/613

Abstract: The invention relates to a control unit (2) for a motor vehicle. The control unit (2) has an electrical SMD (surface mounted device) component (4) having at least one corresponding connection pin (18, 30) and a circuit board (8). The circuit board (8) has at least one soldering surface (12). The soldering surface (12) is permanently connected to the circuit board (8). The soldering surface (12) and the connection pin (18, 30) are connectable to each other in an electrically conductive and firmly bonded manner by means of a soldering process. According to the invention, a contact hold-down piece (40) is permanently connected to the circuit board (8). The connection pin (18, 30) is positioned in such a manner by the contact hold-down piece (40) that, when the connection pin (18, 30) is connected to the soldering surface (12) in an integrally bonded manner, the connection pin (18, 30) and the circuit board (8) have a predetermined distance (A) from each other.

Abstract translation: 本发明涉及一种用于机动车辆的控制单元（2）。 控制单元（2）具有具有至少一个对应的连接引脚（18,30）和电路板（8）的电子SMD（表面安装器件）部件（4）。 电路板（8）具有至少一个焊接表面（12）。 焊接表面（12）永久地连接到电路板（8）。 焊接表面（12）和连接销（18,30）可通过焊接工艺以导电和牢固接合的方式彼此连接。 根据本发明，触点压紧件（40）永久地连接到电路板（8）。 连接销（18,30）以这样的方式通过接触件压紧件（40）定位，使得当连接销（18,30）以整体接合的方式连接到焊接表面（12）时， 连接销（18,30）和电路板（8）彼此之间具有预定距离（A）。

公开(公告)号：EP2749152A1

公开(公告)日：2014-07-02

申请号：EP12790724.4

申请日：2012-10-26

Applicant: Apple Inc.

Inventor： The designation of the inventor has not yet been filed

IPC: H05K1/02 ,  H05K3/28

CPC classification number: H05K1/0218 ,  H05K3/284 ,  H05K2201/0317 ,  H05K2201/09618 ,  H05K2201/09872 ,  H05K2201/09909 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.

公开(公告)号：EP2385402A3

公开(公告)日：2014-04-02

申请号：EP11164694.9

申请日：2011-05-04

Applicant: Funai Electric Co., Ltd.

Inventor： Tajiri, Tomohisa ,  Suzuki, Yuto

IPC: G02B6/00 ,  G02F1/13357 ,  H05K1/00 ,  F21K99/00 ,  F21V29/00 ,  F21V8/00 ,  H05K3/00 ,  H05K1/18 ,  F21Y101/02

CPC classification number: F21V29/004 ,  F21V29/70 ,  F21Y2115/10 ,  G02B6/0085 ,  G02B6/009 ,  G02F1/133603 ,  G02F2001/133628 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10969 ,  H05K2201/2018 ,  Y02P70/611

Abstract: A light source structure includes a light-emitting diode (20), an optical component (90), a frame (40) and a mounting substrate (10). The light-emitting diode emits light. The frame has an inside face (45) defining an inside area and outside face (43) with an attachment opening (42) extending between the inside and outside faces. The light-emitting diode (20) is disposed in the attachment opening (42) to emit the light toward the inside area of the frame. The frame (40) houses the optical component (90) in the inside area of the frame. The mounting substrate (10) has a base member (11), a copper layer (12) that is laminated on the base member, and a resist film (13) that is laminated on the copper layer. The resist film has a first aperture with the light-emitting diode extending through the first aperture such that the light-emitting diode is electrically coupled to and mounted on the copper layer. The mounting substrate is disposed on the outside face of the frame.

公开(公告)号：EP2306795B1

公开(公告)日：2013-12-04

申请号：EP09797941.3

申请日：2009-07-15

Applicant: Sharp Kabushiki Kaisha

Inventor： INUI, Tadashi

IPC: H05K1/14 ,  G02F1/1333 ,  G02F1/1345 ,  H04M1/02

CPC classification number: G02F1/13452 ,  H04M1/0266 ,  H05K1/141 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/2018 ,  H05K2201/2045 ,  H05K2203/0191

公开(公告)号：EP2355628B1

公开(公告)日：2013-10-16

申请号：EP11000582.4

申请日：2011-01-25

Applicant: LG Electronics Inc.

Inventor： Won, Dongsu ,  Jang, Seunghwan ,  Cho, Yongsang

IPC: H05K1/02 ,  H01L23/36 ,  H04B1/036 ,  H05K5/02 ,  G06F1/20 ,  H01L23/433 ,  H04M1/725 ,  H01L23/367

CPC classification number: H05K5/0278 ,  G06F1/20 ,  H01L23/3675 ,  H01L2924/0002 ,  H04B1/036 ,  H05K1/0203 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/2018 ,  H01L2924/00