公开(公告)号：WO1995028278A1

公开(公告)日：1995-10-26

申请号：PCT/FR1995000505

申请日：1995-04-18

Applicant: KERMEL SNC. ,  CASSAT, Robert ,  FAURE, Jean-Paul

Inventor： KERMEL SNC.

IPC: B32B05/24

CPC classification number: B32B5/02 ,  B32B5/24 ,  B32B7/12 ,  B32B15/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/32 ,  B32B27/34 ,  B32B27/365 ,  B32B27/42 ,  B32B2305/08 ,  B32B2307/206 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2323/00 ,  B32B2361/00 ,  B32B2367/00 ,  B32B2369/00 ,  B32B2377/00 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0236 ,  H05K2201/0278 ,  Y10T428/23943 ,  Y10T428/23986

Abstract: A composite material and a method for making same are disclosed. A composite article including an electrically and/or thermally insulating substrate and protective layers on each side thereof is particularly disclosed. Said material includes protective layers consisting of fibres of a heat-stable material flocked onto the insulating substrate, and a heat-stable coating resin. The resulting protective layer has improved protective properties, particularly moisture-proofness. The composite material may also be used as a metal layer carrier for forming flexible printed electrical circuits.

Abstract translation: 公开了一种复合材料及其制造方法。 特别公开了一种复合制品，其包括电隔离和/或隔热基板及其每侧的保护层。 所述材料包括由嵌入到绝缘基板上的热稳定材料的纤维构成的保护层和热稳定的涂层树脂。 所得到的保护层具有改进的保护性能，特别是防潮性。 复合材料也可以用作用于形成柔性印刷电路的金属层载体。

公开(公告)号：WO1991018957A1

公开(公告)日：1991-12-12

申请号：PCT/US1991003211

申请日：1991-05-09

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： MINNESOTA MINING AND MANUFACTURING COMPANY ,  HALL, Joyce, B. ,  HOGERTON, Peter, B. ,  PUJOL, Jean-Marc, P.

IPC: C09J181/06

CPC classification number: H01L24/83 ,  C09J181/06 ,  C09J201/00 ,  H01B1/22 ,  H01L23/4828 ,  H01L24/28 ,  H01L24/98 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/8388 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01055 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0239 ,  H01L2924/00 ,  H01L2924/3512

Abstract: Reworkable adhesive that has a high shear strength through a range of use temperatures but which has a low strength and is reworkable at a suitable processing.

Abstract translation: 可重复使用的粘合剂，其在一定范围的使用温度下具有高的剪切强度，但是具有低的强度并且在合适的加工中可再加工。

公开(公告)号：US20240341031A1

公开(公告)日：2024-10-10

申请号：US18525799

申请日：2023-11-30

Applicant: AAC Microtech (Changzhou) Co., Ltd.

Inventor： Guohui Chen ,  Zhigao Lu

IPC: H05K1/03

CPC classification number: H05K1/036 ,  H05K2201/0145 ,  H05K2201/0154

Abstract: The present disclosure provides a composite board material and a flexible printed circuit. The composite board material includes a first material layer, and two second material layers attached to top surface and bottom surface of the first material layer opposite to each other, respectively. The first material layer is bonded to the two second material layers by adhesive layers. The first material layer includes at least one sublayer, and a material of the at least one sublayer includes polyethylene terephthalate. A material of the two second material layers includes polyimide. In this composite board material, polyethylene terephthalate material functions as inner layer(s), and polyimide material functions as outer layers. In this way, the flatness, hardness, and cost of materials can be balanced, thereby making the obtained flexible printed circuit adaptive to various application scenarios and improving the cost performance of the products.

公开(公告)号：US20240300208A1

公开(公告)日：2024-09-12

申请号：US18669093

申请日：2024-05-20

Applicant: Samsung Display Co., Ltd.

Inventor： Jun Namkung ,  Sujin Jung ,  Hyunkyu Choi

IPC: B32B3/30 ,  B32B3/26 ,  B32B7/12 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B27/06 ,  B32B27/28 ,  B32B27/36 ,  H05K3/28 ,  H05K3/38

CPC classification number: B32B3/30 ,  B32B3/263 ,  B32B7/12 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B27/06 ,  B32B27/281 ,  B32B27/36 ,  H05K3/281 ,  B32B2250/03 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/51 ,  B32B2405/00 ,  B32B2457/08 ,  B32B2457/10 ,  B32B2457/20 ,  B32B2571/00 ,  H05K3/285 ,  H05K3/387 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2203/0557

Abstract: A protection tape for a printed circuit board (PCB) includes an insulating base plate, a conductive layer over the insulating base plate, and an adhesive layer over the conductive layer, the adhesive layer including a main part having a first thickness and a subsidiary part having a second thickness less than the first thickness, the main part corresponding to at least a center portion of the insulating base plate and the subsidiary part being arranged at an outside of the main part.

公开(公告)号：US20240284599A1

公开(公告)日：2024-08-22

申请号：US18617514

申请日：2024-03-26

Applicant: LongKai LI

Inventor： LongKai LI

IPC: H05K3/00 ,  H05K1/05

CPC classification number: H05K3/0011 ,  H05K1/056 ,  H05K2201/0112 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2203/1581

Abstract: The present invention discloses a method for preparing a novel material layer structure of a circuit board, comprising the steps of: (1) combining a film with a copper layer to form an FCCL single-sided board; (2) applying a semi-cured functional material layer on a back side of the film of the FCCL single-sided board, wherein the semi-cured functional material layer is an MPI film, an LCP film, a TFP film, a PTFE film, a copper ion migration resistant film, an LDK high-frequency functional adhesive, a copper ion migration resistant adhesive, or a mixture of the LDK high-frequency functional adhesive and the copper ion migration resistant adhesive to form a novel material layer structure for a circuit board. An article prepared by performing the above methods is also disclosed. The prepared novel material layer structure of the circuit board has high-frequency characteristics and/or copper ion migration resistance, and can be used as an integral structure. In the circuit board manufacturing process, it can be manufactured as the circuit board manufacturing material to be different circuit board structures, which brings great convenience for subsequent circuit board manufacturing and simplifies the manufacturing process.

公开(公告)号：US12035459B2

公开(公告)日：2024-07-09

申请号：US18521587

申请日：2023-11-28

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Parker Brown ,  Dongao Yang ,  Michael Lawrence Miller ,  Paul Henry Lego

IPC: H05K3/00 ,  H01M50/519 ,  H05K1/02 ,  H05K1/11 ,  H05K3/06 ,  H05K3/20 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K1/0201 ,  H01M50/519 ,  H05K1/118 ,  H05K3/007 ,  H05K3/0073 ,  H05K3/06 ,  H05K3/20 ,  H05K3/281 ,  H05K3/4623 ,  H05K3/064 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/10037 ,  H05K2203/066 ,  Y02E60/10 ,  Y10T29/49156

Abstract: A method of forming a flexible interconnect circuit is described. The method may comprise laminating a substrate to a conductive layer and patterning the conductive layer using a laser while the conductive layer remains laminated to the substrate thereby forming a first conductive portion and a second conductive portion of the conductive layer. The substrate maintains the orientation of the first conductive portion relative to the second conductive portion during and after patterning. The method may also comprise laminating a first insulator to the conductive layer and removing the substrate from the conductive layer such that the first insulator maintains the orientation of the first conductive portion relative to the second conductive portion while and after the substrate is removed. The method may also comprise laminating a second insulator to the second side of the conductive layer while the first insulator remains laminated to the substrate.

公开(公告)号：US11910525B2

公开(公告)日：2024-02-20

申请号：US16259302

申请日：2019-01-28

Applicant: C3Nano Inc

Inventor： Xiaofeng Chen ,  Byunghwan Kang ,  Jackie Chen ,  Yadong Cao ,  Vicki Luo ,  Arthur Yung-Chi Cheng ,  Andrew Hyeongjoo Moon ,  Xiqiang Yang ,  Ajay Virkar

IPC: G06F3/044 ,  G06F3/041 ,  H05K1/03 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0393 ,  G06F3/044 ,  G06F3/0412 ,  H05K1/0298 ,  H05K1/118 ,  B32B2457/208 ,  H05K2201/0108 ,  H05K2201/0145

Abstract: Structures are described having thin flexible polymer substrates with electrically conductive films on each opposing surface while having high optical transmittance and good optical properties. The structures can have total thicknesses of no more than about 30 microns and good flexibility. Processing approaches are described that allow for the coating of the very thin structures by providing support through the coating process. The structures are demonstrated to have good durability under conditions designed to test accelerated wear for touch sensor use.

公开(公告)号：US11751327B2

公开(公告)日：2023-09-05

申请号：US17204037

申请日：2021-03-17

Applicant: GENTHERM GMBH

Inventor： Martin Schaetzle

IPC: H05K1/02 ,  H05B3/03 ,  H05B3/34 ,  H05K3/04 ,  H01M50/502 ,  H05B1/02 ,  H01M50/249 ,  H01M50/569 ,  H01M50/209

CPC classification number: H05K1/0277 ,  H01M50/249 ,  H01M50/502 ,  H01M50/569 ,  H05B1/0294 ,  H05B3/03 ,  H05B3/34 ,  H05K1/0296 ,  H05K3/043 ,  H01M50/209 ,  H01M2220/20 ,  H05B2203/003 ,  H05B2203/013 ,  H05B2203/017 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/09263 ,  H05K2201/09727

Abstract: The invention relates to an electrically conductive film (10) having an electrically nonconductive substrate layer (12), and an electrically conductive metal layer (14) that has a structure produced by material removal and that on a first side is joined, at least in sections, to the substrate layer (12).

公开(公告)号：US20180332720A1

公开(公告)日：2018-11-15

申请号：US16031748

申请日：2018-07-10

Applicant: Amphenol Corporation

Inventor： Arthur E. Harkness, JR. ,  Eva M. Kenny-McDermott ,  Paul W. Farineau ,  Raymond A. Lavallee ,  Michael Fancher

IPC: H05K3/46 ,  H05K3/22 ,  H05K3/38 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K1/09 ,  H05K1/03 ,  H05K3/20

CPC classification number: H05K3/4632 ,  H05K1/0242 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/09 ,  H05K1/111 ,  H05K1/115 ,  H05K1/116 ,  H05K3/0073 ,  H05K3/202 ,  H05K3/22 ,  H05K3/38 ,  H05K3/382 ,  H05K3/383 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/389 ,  H05K3/4658 ,  H05K3/4685 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/1194

Abstract: High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.

公开(公告)号：US20180255637A1

公开(公告)日：2018-09-06

申请号：US15446898

申请日：2017-03-01

Applicant: Microsoft Technology Licensing, LLC

Inventor： Siyuan Ma ,  James David Holbery ,  Hanbit Jin

IPC: H05K1/09 ,  B41F15/00 ,  H05K1/03 ,  H05K3/12 ,  C09D11/52 ,  C09D11/106 ,  C09D11/102 ,  C09D11/033

CPC classification number: C09D11/033 ,  B41F15/00 ,  B41F15/0868 ,  B41F19/005 ,  B41M1/12 ,  B41M1/30 ,  C09D11/037 ,  C09D11/102 ,  C09D11/106 ,  C09D11/52 ,  H05K1/038 ,  H05K1/097 ,  H05K3/1216 ,  H05K3/1225 ,  H05K3/125 ,  H05K2201/0145 ,  H05K2201/0203 ,  H05K2201/0245 ,  H05K2201/026 ,  H05K2201/0278 ,  H05K2201/029

Abstract: One disclosed example comprises an ink formulated for printing an electrically conductive trace on a flexible fabric substrate. The ink includes an elastomer and a liquid vehicle capable of swelling the elastomer, the liquid vehicle having a boiling point of 150° C. or greater at one atmosphere. A plurality of non-spherical, electrically conductive particles are suspended in the liquid vehicle to impart electrical conductivity to the ink.