公开(公告)号：US06258203B1

公开(公告)日：2001-07-10

申请号：US09399775

申请日：1999-09-21

Applicant: Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

Inventor： Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

IPC: D04H500

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D21F11/002 ,  D21H13/18 ,  D21H13/22 ,  D21H13/24 ,  D21H13/26 ,  D21H13/40 ,  D21H25/005 ,  D21H25/04 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T442/2008 ,  Y10T442/2738 ,  Y10T442/608 ,  Y10T442/632 ,  Y10T442/637

Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50% by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80% straight polyacrylonitrile fibers and 40-20% fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40% of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free. A printed circuit board made using the layers of these non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics, and has improved properties compared to woven glass and non-woven aramid products, including improved fiber consolidation, easy board construction, and improved MD/CD ratio and stability.

公开(公告)号：US06200074B1

公开(公告)日：2001-03-13

申请号：US09287811

申请日：1999-04-07

Applicant: James J. Miller ,  Paul E. Dinneweth ,  Hans Vandervelde ,  James T. Hegeduis

Inventor： James J. Miller ,  Paul E. Dinneweth ,  Hans Vandervelde ,  James T. Hegeduis

IPC: B23B3500

CPC classification number: H05K3/0047 ,  B23B35/005 ,  B23B2250/12 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0152 ,  H05K2203/0214 ,  H05K2203/0786 ,  H05K2203/127 ,  Y10T408/03 ,  Y10T408/561 ,  Y10T408/5623

Abstract: A method and materials for drilling through-holes in printed circuit boards with a drilling tool is disclosed. The method involves the use of a lubricating entry material placed on the top surface of a stack of printed circuit boards and a lubricating backup board placed beneath the bottom surface of the stack of printed circuit boards. The lubricating entry material has a core with skins attached on both sides by a lubricant/adhesive. Similarly, the backup board has a core with skins attached on both sides by a lubricant/adhesive. The skins are hard enough to support the top and bottom surfaces of the printed circuit boards and thereby reduce burring at the entry point and exit point of the through-hole. The lubricant/adhesive coats the drilling tool during the drilling operation to reduce friction and thereby reduce the temperature of the drilling tool.

Abstract translation: 公开了一种用于在具有钻孔工具的印刷电路板中钻通孔的方法和材料。 该方法包括使用放置在印刷电路板堆叠的顶表面上的润滑入口材料和布置在印刷电路板堆叠的底表面下方的润滑支撑板。 润滑进入材料具有芯，其两侧通过润滑剂/粘合剂附着表皮。 类似地，备用板具有通过润滑剂/粘合剂在两侧附着表皮的芯。 表皮很难承受印刷电路板的顶表面和底表面，从而减少通孔入口点和出口处的毛刺。 润滑剂/粘合剂在钻孔操作期间涂覆钻孔工具以减少摩擦，从而降低钻具的温度。

公开(公告)号：US6042936A

公开(公告)日：2000-03-28

申请号：US936045

申请日：1997-09-23

Applicant: Ulrich W. Kempf

Inventor： Ulrich W. Kempf

IPC: B32B27/04 ,  C08J5/24 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H21/54 ,  D21H25/06 ,  H05K1/03 ,  B32B5/16 ,  B32B9/00

CPC classification number: D21H21/54 ,  B32B27/04 ,  C08J5/24 ,  H05K1/0366 ,  H05K1/0373 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H25/06 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/25 ,  Y10T428/27 ,  Y10T428/2933 ,  Y10T428/2962

Abstract: A pre-preg substrate, having a low dielectric constant and containing a substantially uniformly distributed hollow-glass-microsphere filler, and method for making the same. The pre-preg substrate is treated with impregnation and lamination techniques to form a laminate with a low dielectric constant, and good mechanical and electrical properties, suitable as a base material for surface mounted devices in high performance circuits. Improved pre-pregs for making high performance circuit boards and for making surface mounted integrated circuits. Improved high performance circuit boards for making surface mounted integrated circuits.

Abstract translation: 具有低介电常数且含有基本均匀分布的中空玻璃 - 微球填料的预浸料基板及其制造方法。 用浸渍和层压技术处理预浸料底物以形成具有低介电常数和良好机械和电学性能的层压材料，适合作为用于高性能电路中的表面安装装置的基材。 改进了用于制造高性能电路板和制造表面贴装集成电路的预浸料。 改进用于制造表面贴装集成电路的高性能电路板。

公开(公告)号：US5972811A

公开(公告)日：1999-10-26

申请号：US90789

申请日：1998-06-04

Applicant: Michael E. St. Lawrence ,  Doris I. Hand ,  Vincent R. Landi ,  Robert H. Walker ,  Samuel Gazit ,  Raymond R. Miskiavitch

Inventor： Michael E. St. Lawrence ,  Doris I. Hand ,  Vincent R. Landi ,  Robert H. Walker ,  Samuel Gazit ,  Raymond R. Miskiavitch

IPC: C08J5/08 ,  C08J5/10 ,  C08J5/24 ,  C08K3/00 ,  C08K3/10 ,  C08K3/22 ,  C08K3/24 ,  C08K3/34 ,  C08K3/38 ,  C08K3/40 ,  C08K5/00 ,  C08K5/02 ,  C08K5/06 ,  C08K5/3417 ,  C08K7/00 ,  C08K7/02 ,  C08K7/14 ,  C08K7/16 ,  C08K7/20 ,  C08L9/00 ,  C08L21/00 ,  C08L27/18 ,  C08L47/00 ,  C08L53/00 ,  C08L53/02 ,  C08L77/10 ,  H01B3/30 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  B32B7/00

CPC classification number: C08J5/24 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K7/14 ,  C08L9/00 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  C08J2309/00 ,  C08L15/00 ,  C08L23/04 ,  C08L53/00 ,  C08L7/00 ,  C08L9/02 ,  C08L9/06 ,  H05K1/0203 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T442/2934 ,  Y10T442/2992 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/3455

Abstract: An electrical substrate material is presented comprising a thermosetting matrix of polybutadiene or polyisoprene and a co-curable second resin distinct from the first resin. A peroxide cure initiator and/or crosslinking agent may optionally be added. The presence of a very high surface area particulate filler, preferably fumed silica, is also preferred, in that its presence results in a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. The composition of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated onto one or both opposed surfaces to a metal conductive foil such as copper.

Abstract translation: 提供了一种电气基材材料，其包含聚丁二烯或聚异戊二烯的热固性基质和不同于第一树脂的可共固化的第二树脂。 可以任选地加入过氧化物固化引发剂和/或交联剂。 存在非常高的表面积的颗粒填料，优选热解法二氧化硅也是优选的，因为其存在导致预浸料，其具有非常小的粘性，因此可以容易地由操作者处理。 这种低粘性特征允许使用一种或多种已知的辊式层压机来使用常规的自动铺层处理，包括箔包层。 虽然本发明的预浸料无粘性足以用手相对容易地处理，但是它也是粘性足以在室温下使用辊式层压机（例如夹辊）粘合到其自身上。 本发明的组合物特别适用于制造用于微波和数字电路的电路基板，通常将热固性组合物的形式层压在诸如铜的金属导电箔的一个或两个相对的表面上。

公开(公告)号：US5879794A

公开(公告)日：1999-03-09

申请号：US745396

申请日：1996-11-08

Applicant: Joseph E. Korleski, Jr.

Inventor： Joseph E. Korleski, Jr.

IPC: C09J11/04 ,  B32B5/28 ,  C08L27/18 ,  C09J7/02 ,  C09J7/04 ,  C09J123/06 ,  C09J123/12 ,  C09J127/18 ,  C09J201/00 ,  H05K1/03 ,  B32B5/18 ,  B32B27/04 ,  B32B27/20 ,  B32B27/32

CPC classification number: B32B5/28 ,  C09J7/04 ,  H05K1/0353 ,  H05K1/0366 ,  C08L27/18 ,  C09J2400/263 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/249953 ,  Y10T428/249978 ,  Y10T428/249982 ,  Y10T428/249985 ,  Y10T428/249986 ,  Y10T428/249987 ,  Y10T428/24999 ,  Y10T428/249991 ,  Y10T428/249992 ,  Y10T428/249993 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/259 ,  Y10T428/2878 ,  Y10T428/2883 ,  Y10T428/31511 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31678 ,  Y10T428/31692 ,  Y10T428/31699 ,  Y10T428/31935 ,  Y10T428/31938 ,  Y10T442/2861 ,  Y10T442/291 ,  Y10T442/2918 ,  Y10T442/2926 ,  Y10T442/2934 ,  Y10T442/2951 ,  Y10T442/2975 ,  Y10T442/2984 ,  Y10T442/2992 ,  Y10T442/56 ,  Y10T442/57 ,  Y10T442/699

Abstract: A method of preparing an adhesive composite is provided where a fluoropolymer having nodes and interconnected fibrils with a void volume formed from the node and interconnected fibril structure is at least partially filled with a paste formed from a thermoset or thermoplastic adhesive and a particulate vapor phase formed inorganic filler having uniform surface curvature, sufficient adhesive and filler are present to provide a composite having between about 5 to about 40 volume percent polymeric substrate, 10-95 volume percent adhesive and filler imbibed within the voids of said substrate and 5 to 85 volume percent inorganic filler is contained within the composite. In the composite, the ratio of mean flow pore size to largest particle size is at least above 0.7; or the ratio of mean flow pore size to average particle size is greater than 1.5; or the ratio of minimum pore size to average particle size is at least above 0.8; or the ratio of minimum pore size to largest particle size is at least above 0.4.

Abstract translation: 提供一种制备粘合剂复合材料的方法，其中具有节点和具有由节点和相互连接的原纤维结构形成的空隙体积的相互连接的原纤维的含氟聚合物至少部分地填充有由热固性或热塑性粘合剂形成的糊料和形成的颗粒气相 存在具有均匀表面曲率的无机填料，足够的粘合剂和填料，以提供具有介于约5至约40体积％的聚合物基质，10-95体积％的粘合剂和填充物的填料在所述底物的空隙内吸收的复合物，以及5-85体积％ 无机填料包含在复合材料中。 在复合材料中，平均流量孔径与最大粒径之比至少高于0.7; 或平均流量孔径与平均粒径之比大于1.5; 或最小孔径与平均粒径之比至少在0.8以上; 或者最小孔径与最大粒径的比率至少高于0.4。

公开(公告)号：US5692940A

公开(公告)日：1997-12-02

申请号：US676180

申请日：1996-07-15

Applicant: Hidenori Kinbara ,  Mitsuru Nozaki ,  Masanobu Mizoguchi ,  Koji Kimura ,  Naohiko Shimono

Inventor： Hidenori Kinbara ,  Mitsuru Nozaki ,  Masanobu Mizoguchi ,  Koji Kimura ,  Naohiko Shimono

IPC: C08J5/04 ,  C08J5/24 ,  D04H1/42 ,  D04H1/46 ,  D04H1/48 ,  D04H1/58 ,  D04H1/64 ,  D04H13/00 ,  H05K1/03 ,  B32B5/06 ,  B32B9/00 ,  B32B27/06 ,  B32B31/00

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D04H1/435 ,  D04H1/48 ,  D04H1/49 ,  D04H1/587 ,  D04H1/64 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/31 ,  Y10T428/31786 ,  Y10T442/689

Abstract: A substrate for a laminate which comprises a nonwoven fabric which is composed mainly of a liquid crystal polyester fiber, and which is subjected to (1) an entangling treatment, (2) a heating treatment to impart adhesivity to a thermosetting resin, and (3) a surface-modifying treatment, and a laminate containing at least one prepreg prepared by impregnating the substrate with a thermosetting resin and drying are disclosed. The substrate of the present invention has low dielectric constant, is light, exhibits low hygroscopicity, and has good properties to be impregnated with the thermosetting resin and good adhesiveness to the thermosetting resin.

Abstract translation: PCT No.PCT / JP95 / 02328 Sec。 371日期：1996年7月15日 102（e）日期1996年7月15日PCT提交1995年11月15日PCT公布。 公开号WO96 / 15306 日期：1996年5月23日一种层叠体用基材，其为主要由液晶聚酯纤维构成的无纺布，并进行（1）缠结处理，（2）加热处理以赋予热固性树脂 和（3）表面改性处理，以及含有至少一种通过用热固性树脂浸渍基材而制备的预浸料并进行干燥的层压体。 本发明的基材具有低介电常数，轻质，吸湿性低，并且具有良好的热固性树脂浸渍性能和对热固性树脂的良好粘附性。

公开(公告)号：US5571609A

公开(公告)日：1996-11-05

申请号：US322890

申请日：1994-10-13

Applicant: Michael E. St. Lawrence ,  Vincent R. Landi ,  Doris I. Hand ,  Robert H. Walker ,  Samuel Gazit ,  Raymond R. Miskiavitch

Inventor： Michael E. St. Lawrence ,  Vincent R. Landi ,  Doris I. Hand ,  Robert H. Walker ,  Samuel Gazit ,  Raymond R. Miskiavitch

IPC: C08J5/24 ,  C08K3/00 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/00 ,  C08K5/02 ,  C08K7/00 ,  C08K7/14 ,  C08L9/00 ,  C08L21/00 ,  C08L53/00 ,  C08L53/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  B32B7/00

CPC classification number: C08J5/24 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K7/14 ,  C08L9/00 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  C08J2309/00 ,  C08L15/00 ,  C08L23/04 ,  C08L53/00 ,  C08L7/00 ,  C08L9/02 ,  C08L9/06 ,  H05K1/0203 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T442/3431 ,  Y10T442/3569

Abstract: An electrical substrate material is presented which comprises a thermosetting matrix which includes a polybutadiene or polyisoprene resin and an unsaturated butadiene or isoprene containing polymer in an amount of 25 to 50 vol. %; a woven glass fabric in an amount of 10 to 40 vol. %; a particulate, preferably ceramic filler in an amount of from 5 to 60 vol. %; a flame retardant and a peroxide cure initiator. A preferred composition has 18% woven glass, 41% particulate filler and 30% thermosetting matrix. The foregoing component ratios and particularly the relatively high range of particulate filler is an important feature of this invention in that this filled composite material leads to a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. In addition, another important feature of this invention is the low amount of glass fabric filler relative to the higher range of particulate filler which leads to improved (lower) CTE in the Z axis or thickness direction, improved electrical performance (e.g., dissipation factor), lower cost and the ability to tailor dielectric constant through appropriate selection of particulate fillers.

Abstract translation: 提供了一种电气基材材料，其包括热固性基质，其包含聚丁二烯或聚异戊二烯树脂和含量为25至50体积％的不饱和丁二烯或含异戊二烯的聚合物。 ％; 10〜40体积％的编织玻璃织物。 ％; 粒度为5至60体积％的陶瓷填料。 ％; 阻燃剂和过氧化物固化引发剂。 优选的组合物具有18％的玻璃织物，41％的颗粒填料和30％的热固性基质。 上述组分比，特别是颗粒填料的相对高范围是本发明的重要特征，因为该填充的复合材料导致具有非常小的粘性的预浸料，因此可以容易地由操作者处理。 这种低粘性特征允许使用一种或多种已知的辊式层压机来使用常规的自动铺层处理，包括箔包层。 虽然本发明的预浸料无粘性足以用手相对容易地处理，但是它也是粘性足以在室温下使用辊式层压机（例如夹辊）粘合到其自身上。 另外，本发明的另一个重要特征是玻璃织物填料相对于较高范围的颗粒填料的含量较低，这导致在Z轴或厚度方向上改进（降低）CTE，改善了电性能（例如耗散因子） 更低的成本和通过适当选择颗粒填料来调整介电常数的能力。

公开(公告)号：US5314742A

公开(公告)日：1994-05-24

申请号：US41417

申请日：1993-03-31

Applicant: Birol Kirayoglu ,  William J. Sillivan ,  Melvin P. Zussman

Inventor： Birol Kirayoglu ,  William J. Sillivan ,  Melvin P. Zussman

IPC: C08J5/24 ,  B32B27/04 ,  D04H1/42 ,  D21H13/26 ,  H05K1/03 ,  B33B17/00

CPC classification number: H05K1/0366 ,  B32B27/04 ,  D04H1/4342 ,  D21H13/26 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24994 ,  Y10T442/2902 ,  Y10T442/656

Abstract: Dimensionally stable resin impregnated laminates for printed wiring board applications are reinforced with from 43 to 57 weight percent of nonwoven aramid sheet having a coefficient of thermal expansion of less than 10 ppm per .degree. C, a basis weight of from 0.8 to 4.0 oz/yd.sup.2, a density of from 0.5 to 1.0 g/cc and a Gurley Hill Porosity of less than 10 sec.

Abstract translation: 用于印刷线路板应用的尺寸稳定的树脂浸渍层压板用43至57重量％的热膨胀系数小于10ppm /℃，基重为0.8-4.0盎司/ yd2的非织造芳族聚酰胺片材增强， 密度为0.5至1.0g / cc，Gurley Hill孔隙度小于10秒。

公开(公告)号：US5120384A

公开(公告)日：1992-06-09

申请号：US742080

申请日：1991-08-07

Applicant: Tokio Yoshimitsu ,  Kouji Sato ,  Yoshihide Sawa

Inventor： Tokio Yoshimitsu ,  Kouji Sato ,  Yoshihide Sawa

IPC: B29C70/86 ,  B32B15/14 ,  B32B37/00 ,  B32B38/00 ,  H05K1/03 ,  H05K3/38 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC classification number: B32B37/0038 ,  B29C70/865 ,  B32B15/14 ,  H05K3/445 ,  H05K3/4641 ,  B29K2105/0854 ,  B29K2105/16 ,  B29L2031/3425 ,  B32B2311/12 ,  B32B2457/08 ,  B32B38/0012 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0293 ,  H05K2201/09309 ,  H05K2203/0315 ,  H05K2203/1157 ,  H05K2203/143 ,  H05K3/385 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4611 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A method for manufacturing a multilayer laminate provides in metal plates each forming a substrate apertures at positions where through holes are to be formed, fills the apertures with a synthetic resin including a first filler, and prepares prepregs to be disposed on both sides of each substrate by impregnating nonwoven fabric with a thermosetting synthetic resin containing a second filler. The metal plates forming the substrates are thereby allowed to be thicker for realizing larger capacity power supply with an improvement also in heat dissipation characteristics.

Abstract translation: 制造多层叠层体的方法提供在金属板中，每个在要形成通孔的位置处形成基底孔，在包含第一填料的合成树脂中填充孔，并制备待设置在每个基底两侧的预浸料 通过用含有第二填料的热固性合成树脂浸渍无纺布。 因此，形成基板的金属板可以更厚以实现更大容量的电源，并且散热特性也得到改善。

公开(公告)号：US5049435A

公开(公告)日：1991-09-17

申请号：US415959

申请日：1989-10-02

Applicant: Keiichi Uno ,  Yoshimi Ishinami ,  Masaaki Nakamura ,  Tomohiko Nakao

Inventor： Keiichi Uno ,  Yoshimi Ishinami ,  Masaaki Nakamura ,  Tomohiko Nakao

IPC: D04H1/42 ,  D04H1/64 ,  H05K1/03

CPC classification number: H05K1/0326 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/587 ,  D04H1/64 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10S428/902 ,  Y10S428/92 ,  Y10T428/24917 ,  Y10T428/249951 ,  Y10T428/27 ,  Y10T428/31681 ,  Y10T428/31736 ,  Y10T442/2861 ,  Y10T442/656

Abstract: A flexible sheet which comprises a non-woven fabric made predominantly from a poly(aromatic amide) component which is impregnated with a heat- and/or light-curable resin, wherein the non-woven fabric satisfies the following conditions:5 g/m.sup.2