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    Mounting system for electronic modules
    221.
    发明公开
    Mounting system for electronic modules 有权
    Montagesystemfürelektronische模块

    公开(公告)号：EP2635100A1

    公开(公告)日：2013-09-04

    申请号：EP13157017.8

    申请日：2013-02-27

    Applicant: Fifthplay NV

    Inventor： De Witte, Wim Albert Marie-Louise ,  Bodequin, Peter Robert Gabriel

    IPC: H05K7/14 ,  H05K5/02 ,  H05K1/14

    CPC classification number: H05K7/1418 ,  H05K1/141 ,  H05K3/368 ,  H05K5/0291 ,  H05K7/1417 ,  H05K7/1472 ,  H05K2201/2018 ,  H05K2203/167

    Abstract: Mounting system for mounting an electronic module on a carrier, comprising an electronic module with a plate-like base, and with contacts; a first elongate profile provided with a receiving channel for receiving therein the first side of the base; and a second elongate profile provided with a number of clamping tongues configured to hold the second side of the base; which first and second profiles can be arranged on the carrier such that the or each electronic module can be mounted between the first and the second profile.

    Abstract translation: 用于将电子模块安装在载体上的安装系统，包括具有板状基座的电子模块和触点; 第一细长轮廓，其具有用于在其中容纳所述基部的第一侧的接收通道; 以及第二细长轮廓，其具有构造成保持所述基部的第二侧的多个夹紧舌片; 所述第一和第二轮廓可以布置在所述载体上，使得所述或每个电子模块可以安装在所述第一和第二轮廓之间。

    Circuit-terminal connecting device
    223.
    发明公开
    Circuit-terminal connecting device 有权
    电路接线端连接装置

    公开(公告)号：EP2600469A2

    公开(公告)日：2013-06-05

    申请号：EP12192499.7

    申请日：2012-11-14

    Applicant: DAI-ICHI SEIKO CO., LTD.

    Inventor： Takeshi, Hirakawa

    IPC: H01R12/73 ,  H01R12/79 ,  H01R12/78 ,  H01R13/627

    CPC classification number: H01R12/73 ,  H01R12/78 ,  H01R12/79 ,  H01R13/627 ,  H01R13/639 ,  H02K7/08 ,  H02K7/09 ,  H02K15/14 ,  H05K1/182 ,  H05K3/361 ,  H05K2201/0949 ,  H05K2201/10189 ,  H05K2201/2018

    Abstract: A circuit-terminal connecting device comprising a first connector (12) having a first housing (15) fixed to a main circuit board (11) and first contacts (16) supported by the first hous i ng (15) to be connected with first circuit-terminals provided on the main circuit board (11) and a second connector (14; 40) having a second housing (17; 41) attached to a flat circuit member (13) and second contacts (18; 42) supported by the second housing (17; 41) to be connected with second circuit-terminals (20) provided on the flat circuit member (13). The first housing (15) of the first connector (12) fits into a hole (22; 44) formed in the second housing (17; 41) of the second connector (14; 40) so as to create an electrical piling connection between the main circuit board (11) and the flat circuit member (13) wherein the flat circuit member (13) is laid on top of the main circuit board (11) and the first circuit-terminals are electrically connected with the second circuit-terminals (20) through the first and second connectors (12, 14; 40).

    Anti-hacking printed circuit board having high-molecular material deposited thereon and deposition method for the same
    228.
    发明公开
    Anti-hacking printed circuit board having high-molecular material deposited thereon and deposition method for the same 审中-公开
    为了防止电路板，其具有涂覆在其上的高分子量材料穿透和沉积的方法

    公开(公告)号：EP1610598A1

    公开(公告)日：2005-12-28

    申请号：EP05253828.7

    申请日：2005-06-21

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Lee, Eun-Lai

    IPC: H05K3/28

    CPC classification number: H04N21/4181 ,  H05K1/0275 ,  H05K3/284 ,  H05K2201/10689 ,  H05K2201/2018

    Abstract: Disclosed are a set-top box configured for preventing hacking through microelectronic devices (150) or wirings (510) on a printed circuit board therein, and a method of depositing a high-molecular material (520) therefor. The prevention of hacking within a set-top box is obtained by depositing and curing a liquid high-molecular material (520), which includes epoxy and a curing agent, on an area(s) of microelectronic devices (150) or on an area(s) of wirings (510) connecting the microelectronic devices (150) through which the interior of the set-top box may be hacked. In addition, the liquid high-molecular material (520) is deposited in a frame (600) manufactured to a size and shape desired for deposition around the area(s) to deposit the high-molecular material (520) in uniform dimensions and height and thereby reduce manufacturing cost.

    Abstract translation: 公开了一种机顶盒配置用于防止通过微电子器件（150）或布线（510）上的印刷电路板的黑客在其中，并且沉积高分子材料（520）为此的方法。 一个机顶盒内黑客的预防是通过沉积和固化液态高分子材料（520），其包括环氧树脂和固化剂在微电子器件（150）的面积（S）上或在以区域获得，上 （一个或多个）配线（510）连接所述的微电子器件（150），通过该机顶盒的内部可以被黑客攻击的。 此外，液体的高分子材料（520）中制造的尺寸和形状所期望的周围的区域（一个或多个）沉积一个帧（600）被沉积在一致的尺寸和高度来沉积高分子材料（520） 并由此降低制造成本。

    Electronic circuit unit having small size and good productivity
    229.
    发明公开
    Electronic circuit unit having small size and good productivity 审中-公开
    Elektronische Schaltungseinheit，die eine kleineGröe und eine guteProduktivitäthat

    公开(公告)号：EP1513384A2

    公开(公告)日：2005-03-09

    申请号：EP04020884.5

    申请日：2004-09-02

    Applicant: ALPS ELECTRIC CO., LTD.

    Inventor： Furuta, Toshiro ,  Endo, Masaaki ,  Saitoh, Wataru ,  Yamano, Tadaomi

    IPC: H05K5/00 ,  H05K9/00

    CPC classification number: H05K9/002 ,  H05K1/0243 ,  H05K1/18 ,  H05K2201/10075 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/2018

    Abstract: The present invention provides an electronic circuit unit that is suitable for miniaturization and has a good manufacturing productivity. An electronic circuit unit of the present invention comprises a circuit board 3 mounted within a frame member 1, an electronic component 5 with a cover mounted on the circuit board 3, and a plurality of linear terminals 9 passing through and being mounted in the circuit board 3. The terminals 9 comprise at least first and second terminal groups 7a and 7b arranged at an interval between the respective terminals in a line. The first and the second terminal groups 7a and 7b are arranged in a line in the vicinity of one side of the circuit board 3. An opening portion 10 is provided between the first and second terminal groups 7a and 7b, and the electronic component 5 with the cover is mounted on the circuit board 3 while being disposed in the opening portion 10. As a result, a space factor for the arrangement of the electronic component 5 with the cover is very good, and thus it is possible to reduce a widthwise dimension of the circuit board 3, thereby obtaining a small-sized electronic circuit unit.

    Abstract translation: 本发明提供一种适于小型化并具有良好制造生产率的电子电路单元。 本发明的电子电路单元包括安装在框架构件1内的电路板3，安装在电路板3上的盖子的电子部件5和通过并安装在电路板中的多个线性端子9 端子9包括至少第一和第二端子组7a和7b，它们以一行的相应端子间隔布置。 第一和第二端子组7a和7b在电路板3的一侧附近排列成一列。开口部分10设置在第一和第二端子组7a和7b之间，电子部件5具有 盖子安装在电路板3的同时设置在开口部分10中。结果，电子部件5与盖子的布置的空间因子非常好，因此可以减小宽度方向尺寸 ，从而获得小型电子电路单元。

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