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    Process for producing multilayer printed circuit board
    231.
    发明授权
    Process for producing multilayer printed circuit board 失效
    多层印刷电路板生产工艺

    公开(公告)号：US5806177A

    公开(公告)日：1998-09-15

    申请号：US740186

    申请日：1996-10-28

    Applicant: Takeshi Hosomi ,  Toyoaki Kishi ,  Tomoyoshi Honjoya ,  Sei Nakamichi ,  Masahiro Mitsui

    Inventor： Takeshi Hosomi ,  Toyoaki Kishi ,  Tomoyoshi Honjoya ,  Sei Nakamichi ,  Masahiro Mitsui

    IPC: H05K3/00 ,  H05K3/46 ,  H05K3/02

    CPC classification number: H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K3/0023 ,  H05K3/4652 ,  Y10T29/49155

    Abstract: A process for producing a multilayer printed circuit board which comprises coating a light and heat curable undercoating agent on an internal layer circuit board, irradiating the undercoating agent with active energy beams to make the same tack-free, then laminating thereto a metal foil having an insulating adhesive layer and subsequently heating the resulting assembly to integrally cure the same. When the undercoating agent is coated on an internal layer circuit board and irradiated with a light to be made tack-free, and thereto is laminated a copper foil having a thermosetting insulating adhesive by a rigid roll or the like, the undercoating agent is softened or fluidized and the surface is smoothened. When the resulting laminate is thereafter heated, the undercoating agent coated on the internal layer circuit board and the insulating adhesive coated on the copper foil are integrally cured. Since the insulating adhesive coated on the metal foil keeps the thickness, a multilayer printed circuit board having an excellent board thickness precision can be produced without depending on the percentage of the remaining copper foil in the internal layer.

    Abstract translation: 一种多层印刷电路板的制造方法，其特征在于，在内层电路基板上涂布光固化性可热固化的底涂剂，用活性能量射线照射底涂剂，制成相同的无粘性， 绝缘粘合剂层，随后加热所得组件以使其一体地固化。 当将底涂剂涂覆在内层电路板上并用无粘性的光照射时，通过刚性辊等层压具有热固性绝缘粘合剂的铜箔时，底涂剂软化或 流化并使表面平滑。 然后加热所得的层压体后，涂覆在内层电路板上的底涂剂和涂在铜箔上的绝缘胶粘剂整体固化。 由于涂覆在金属箔上的绝缘粘合剂保持厚度，所以可以制造出具有优异的板厚精度的多层印刷电路板，而不依赖于内层中剩余的铜箔的百分比。

    Adhesive for copper foils and adhesive-backed copper foil
    233.
    发明授权
    Adhesive for copper foils and adhesive-backed copper foil 失效
    用于铜箔和粘合剂背衬铜箔的粘合剂

    公开(公告)号：US5707729A

    公开(公告)日：1998-01-13

    申请号：US524802

    申请日：1995-09-07

    Applicant: Tetsuro Satoh

    Inventor： Tetsuro Satoh

    IPC: C09J163/00 ,  H05K3/02 ,  H05K3/38 ,  B32B7/12 ,  B32B27/38

    CPC classification number: H05K3/386 ,  C09J163/00 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K3/022 ,  Y10S428/921 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/2883 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31551 ,  Y10T428/31681 ,  Y10T428/31696

    Abstract: An adhesive composition and foils coated with the adhesive, wherein the adhesive consisting essentially of: (I) a fist amount of a non-modified epoxy resin and a second amount of a rubber-modified epoxy resin in a total amount of 60-100 parts by weight, wherein the amount of rubber-modified epoxy resin is 0.5 to 20 parts by weight; (II) 5-30 parts by weight of a polyvinyl acetal resin; and optionally contains (III) at least one resin selected rom the group consisting of blocked isocyanate resins, polyester resins, polyester resins, melamine resins and urethane resins. The adhesive coating can optionally contain inorganic fillers, fire retardants, and curing agents.

    Abstract translation: 粘合剂组合物和涂有粘合剂的箔，其中粘合剂基本上由以下组成：（I）第一量的未改性环氧树脂和第二量橡胶改性环氧树脂，总量为60-100份 ，其中橡胶改性环氧树脂的量为0.5-20重量份; （II）5-30重量份的聚乙烯醇缩醛树脂; 并且任选地含有（III）选自由封端异氰酸酯树脂，聚酯树脂，聚酯树脂，三聚氰胺树脂和聚氨酯树脂组成的组中的至少一种树脂。 粘合剂涂层可以任选地含有无机填料，阻燃剂和固化剂。

    Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method
    235.
    发明授权
    Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method 失效
    制造具有盲孔的多层印刷电路板和用于该方法的树脂涂覆铜箔的方法

    公开(公告)号：US5544773A

    公开(公告)日：1996-08-13

    申请号：US252928

    申请日：1994-06-02

    Applicant: Youichi Haruta ,  Tomio Kambayashi ,  Hitoshi Kato ,  Hiromu Taguchi

    Inventor： Youichi Haruta ,  Tomio Kambayashi ,  Hitoshi Kato ,  Hiromu Taguchi

    IPC: H05K1/00 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  C23F1/00

    CPC classification number: H05K3/4655 ,  H05K3/002 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0376 ,  H05K2201/09509 ,  H05K2203/0793 ,  H05K3/4069 ,  H05K3/427 ,  H05K3/4652 ,  H05K3/4676

    Abstract: Provided is a method for making a multilayer printed circuit board having blind holes which comprises heat laminating a copper foil and an inner layer panel previously provided with circuit patterns on one or both sides thereof by processing a copper-clad laminate, a resin layer soluble in an aqueous alkali solution and having a flowability upon heating being present between said copper foil and said inner layer panel, forming via holes in the surface copper foil by etching and then dissolving the resin layer under said via holes with an aqueous alkali solution and removing the resin layer, thereby to form blind holes in which the copper foil on the inner layer panel is exposed. Further provided is a copper foil used for making multilayer printed circuit boards, which is provided with a resin layer soluble in an aqueous alkali solution and having flowability upon heating on its roughened surface.

    Abstract translation: 提供一种制造具有盲孔的多层印刷电路板的方法，该方法包括通过加工覆铜层压板将铜箔和预先在其一侧或两侧预先设置有电路图案的内层面板热层压，可溶于 在所述铜箔和所述内层板之间存在加热流动性的碱性水溶液，通过蚀刻在所述表面铜箔中形成通孔，然后用碱水溶液将所述树脂层溶解在所述通孔下方，并除去 从而形成露出内层面板上的铜箔的盲孔。 还提供了一种用于制造多层印刷电路板的铜箔，其具有可溶于碱性水溶液的树脂层，并且在其粗糙化表面上加热时具有流动性。

    Metal-clad laminates and method for producing same
    236.
    发明授权
    Metal-clad laminates and method for producing same 失效
    金属覆层压板及其制造方法

    公开(公告)号：US5300364A

    公开(公告)日：1994-04-05

    申请号：US849416

    申请日：1992-04-29

    Applicant: Hiroaki Hase ,  Kazutsune Kikuta ,  Atsushi Takahashi ,  Shiro Konotsune

    Inventor： Hiroaki Hase ,  Kazutsune Kikuta ,  Atsushi Takahashi ,  Shiro Konotsune

    IPC: B32B15/08 ,  H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/30 ,  H05K3/38

    CPC classification number: H05K1/0346 ,  B32B15/08 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2201/068 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31681

    Abstract: The present invention provides a flexible metal-clad laminate obtained by directly applying a polyimide precursor to a metallic conductive foil, and then drying, heating and curing the precursor to form a polyimide film, this flexible metal-clad laminate being characterized in that the polyimide film is composed of two or more polyimide layers, the linear thermal expansion coefficient of at least one of the second and later polyimide layers is larger than that of the first layer brought into contact with the metallic conductive foil, and the requirements of the following formulae are met:3.0 t.sub.n and ##EQU1## wherein t.sub.n is the thickness (.mu.m) of the outermost layer (the nth layer) of the polyimide layers, t.sub.n-1 is the thickness (.mu.m) of the film comprising the first layer to the (n-1)th layer of the polyimide layers, and Q.sub.n-1 is a double value (cm) of the curvature radius of the curl of the film comprising the first layer to the (n-1)th layer of the polyimide layers and Rz is the average surface roughness (.mu.m) of the metallic conductive foil. This board does not curl immediately after curing, and the curl does not occur even after the formation of a circuit by etching.

    Abstract translation: PCT No.PCT / JP91 / 01176 Sec。 一九九二年四月二十九日 102（e）日期1992年4月29日PCT 1991年9月3日PCT PCT。 出版物WO92 / 0481100 本发明提供了一种柔性金属包覆层压板，其通过将聚酰亚胺前体直接施加到金属导电箔上，然后干燥，加热和固化前体以形成聚酰亚胺膜，该柔性金属包层 其特征在于，所述聚酰亚胺膜由两层以上的聚酰亚胺层构成，所述第二层和后述的聚酰亚胺层中的至少一层的线性热膨胀系数大于与所述金属导电箔接触的所述第一层的线性热膨胀系数， 满足以下公式的要求：3.0 tn和tn-1> tn和（*化学结构*）其中tn是（（my）m） 聚酰亚胺层的最外层（第n层）tn-1是包含第一层至第（n-1）层聚酰亚胺层的膜的厚度（（my）m），Qn-1 是包括第一个1a的膜的卷曲的曲率半径的双重值（cm） 对于第（n-1）层的聚酰亚胺层，Rz是金属导电箔的平均表面粗糙度（（my）m）。 该板在固化后不会立即卷曲，即使在通过蚀刻形成电路之后也不会发生卷曲。

    Flexible multilayer polyimide laminates
    239.
    发明授权
    Flexible multilayer polyimide laminates 失效
    柔性多层聚酰亚胺层压板

    公开(公告)号：US4675246A

    公开(公告)日：1987-06-23

    申请号：US746887

    申请日：1985-06-20

    Applicant: Ernst F. Kundinger ,  Erich Klimesch ,  Hans G. Zengel ,  Jeffrey D. Lasher

    Inventor： Ernst F. Kundinger ,  Erich Klimesch ,  Hans G. Zengel ,  Jeffrey D. Lasher

    IPC: B05D7/16 ,  H05K1/03 ,  B32B15/00

    CPC classification number: B05D7/16 ,  H05K1/0346 ,  H05K1/036 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/066 ,  Y10T428/265 ,  Y10T428/2826 ,  Y10T428/294 ,  Y10T428/2947 ,  Y10T428/2967 ,  Y10T428/31681 ,  Y10T428/31721

    Abstract: The invention relates to laminates comprising at least one layer of an intractable, fully aromatic polyimide which, on one side, is directly bonded to a layer of a substrate and, on the other side, to a layer of a heat-sealable polyimide. The basic elements thus produced may be bonded to one another on the heat-sealable polyimide sides or one basic element may be bonded to another layer of substrate. Further layers may be bonded to one or both outside(s) of the laminates. The laminates may be produced by a novel temperature-controlled process. The substrates are preferably foils of metals or alloys. The multilayer laminates obtained are distinguished by outstanding mechanical, thermal and electrical properties. They may be used as reinforcing materials or for printed electrical circuits.

    Abstract translation: 本发明涉及包含至少一层难治性的完全芳族聚酰亚胺的层压材料，其一面直接结合到基材层上，另一侧则是可热封聚酰亚胺层。 由此制得的基本元素可以在可热封的聚酰亚胺侧上彼此结合，或者一个碱性元素可以结合到另一层基底上。 另外的层可以结合到层压体的一个或两个外部。 层压体可以通过新的温度控制方法制备。 基板优选为金属或合金的箔。 所获得的多层层压板通过出色的机械，热和电性能来区分。 它们可以用作增强材料或印刷电路。

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