公开(公告)号：EP2451018A1

公开(公告)日：2012-05-09

申请号：EP10794009.0

申请日：2010-06-18

Applicant: Yazaki Corporation

Inventor： NOMURA, Shoichi ,  NAKAMURA, Goro

IPC: H01R13/52

CPC classification number: H01R12/613 ,  H01R13/5208 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/09154 ,  H05K2201/09445 ,  H05K2201/09472 ,  H05K2201/09709 ,  H05K2203/0264 ,  Y10T29/49194

Abstract: A flexible flat cable connecting structure and a flexible flat cable connecting method are provided so that a connector can be connected by pitch conversion without complicating the structure of the connector and metal molds for forming mold parts become unnecessary.
A flexible flat cable connecting structure for connecting a flexible flat cable (13) in which a plurality of rectangular conductors (11) are provided in parallel and a plurality of connector terminals arranged at an array pitch different from that of the rectangular conductors comprises an intermediate cable arranging member (17) one end of which is coupled to the connector terminals and in which a plurality of branch conductors (19) are provided in parallel which are set to have mutually different longitudinal dimensions according to the array pitch. The intermediate cable arranging member (17) is laid on the flexible flat cable (13) so that the intermediate cable arranging member (17) and the flexible flat cable (13) are in the same plane and form an angle. The other ends (21) of the branch conductors (19) of the intermediate cable arranging member (17) are connected to the respective rectangular conductors (11).

Abstract translation: 提供柔性扁平电缆连接结构和柔性扁平电缆连接方法，使得连接器可以通过间距转换而连接，而不会使连接器的结构复杂化，并且不需要用于形成模具部件的金属模具。 用于连接柔性扁平电缆（13）的柔性扁平电缆连接结构，其中平行设置有多个矩形导体（11），并且以与矩形导体不同的阵列间距排列的多个连接器端子包括中间 电缆排列构件（17），其一端连接到连接器端子，并且多个分支导体（19）平行地设置，根据阵列间距被设置为具有相互不同的纵向尺寸。 中间电缆排列构件（17）被放置在柔性扁平电缆（13）上，使得中间电缆排列构件（17）和柔性扁平电缆（13）处于同一平面并形成一个角度。 中间电缆排列构件（17）的分支导体（19）的另一端（21）连接到各个矩形导体（11）。

公开(公告)号：EP0921566B1

公开(公告)日：2007-03-07

申请号：EP98402905.8

申请日：1998-11-20

Applicant: ELA MEDICAL (Société anonyme)

Inventor： Legay, Thierry ,  Gilet, Dominique ,  Van Campenhout, Yves

IPC: H01L23/485 ,  H01L23/31 ,  H01L23/00 ,  G01P15/08

CPC classification number: H05K3/3442 ,  H01L23/3107 ,  H01L29/0657 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2201/09154 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP1754400A1

公开(公告)日：2007-02-21

申请号：EP05748489.1

申请日：2005-06-03

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： HIDAKA, Akio ,  IKEBE, Shouichi ,  MURANO, Yuuichi ,  KAZITANI, Hirozumi ,  IKEDA, Mika ,  MIZOGUCHI, Yoshitaka

IPC: H05K5/00

CPC classification number: H05K3/3426 ,  H01G2/065 ,  H05K5/0095 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10909 ,  H05K2201/2009 ,  Y02P70/613

Abstract: The present invention aims to supply an electronic component which is manufactured in a manufacturing process at low cost, and realize improvement of shock resistance, endurance, flexure resistance, mounting reliability etc. at the same time, without requiring fine adjustment etc. The invention is an electronic component 1 which has an element 2, a pair of terminal portions 4 which were disposed on the element 2, and an external covering material 5 which covers the a part of the terminal portions 4 and the element 2, and configured in such a manner that inclined portions 10 are disposed on corner portions of a bottom surface 9 and side surfaces of the external covering material 5, and the terminal portions 4 are protruded from corner portions where the inclined portions 10 and the bottom surface 9 of the external covering material intersect.

公开(公告)号：EP0926935B1

公开(公告)日：2005-08-31

申请号：EP98403209.4

申请日：1998-12-18

Applicant: AIRBUS France

Inventor： Bedos, Jean-Philippe ,  Sune, Gérard

IPC: H05K3/40 ,  H05K1/14

CPC classification number: H05K1/141 ,  H05K1/111 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/049 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/10689

公开(公告)号：EP1110243A1

公开(公告)日：2001-06-27

申请号：EP99947214.5

申请日：1999-07-14

Applicant: Infineon Technologies AG

Inventor： NEU, Achim ,  JANCZEK, Thies

IPC: H01L23/498 ,  H01L23/538 ,  H01L21/60

CPC classification number: H01L24/02 ,  H01L23/49805 ,  H01L23/49861 ,  H01L29/0657 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19042 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/0919 ,  Y02P70/613 ,  H01L2924/00

Abstract: The invention relates to an integrated component (35) with at least one contact element (20) for connecting the component (35) to a fixing means (90). According to the invention, the component (35) is embodied in such a way that the contact element (20) is disposed in an edge area of the integrated component (35) and the contact element (20) has at least one contact surface (22) which is inclined in relation to a main surface of the component (35). The invention also relates to a method for the production of said component.

公开(公告)号：EP1038417A1

公开(公告)日：2000-09-27

申请号：EP99970553.6

申请日：1999-10-12

Applicant: Matsushita Electric Works, Ltd.

Inventor： FILLION, Arthur, J. ,  KOGAMI, Osamu ,  KURATA, Kanji2-8 Aza-Furumachi ,  MURRAY, Jeffrey, A. ,  SMITH, Terrence, A.

IPC: H05K1/16 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0256 ,  H05K1/162 ,  H05K3/0052 ,  H05K2201/0355 ,  H05K2201/09154 ,  H05K2201/09309 ,  H05K2203/0228 ,  H05K2203/0346 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/4981 ,  Y10T428/24777 ,  Y10T428/24917

Abstract: The present invention provides thin-laminate panels (i.e., thin-laminate panels (2) having dielectric layers (8) about 0.006 inches (0.15 mm) or less and conductive layers (6) on either side of the dielectric layer (8)), wherein the edges of the dielectric layers of the panels are free of conductive material, such as copper. The thin-laminate panel is designed to provide necessary capacitance for all or a substantial number of the integrated circuits to be formed thereon. The thin-laminate panels of the present invention may be tested for manufacturing defects, such as short circuits, before further processing of the panels to produce PCBs. 'Finishing' methods for shearing sheets of unfinished thin-laminate into the finished thin-laminate panels of the present invention in a manner that does not cause smearing of the conductive material onto the dielectric layer are also provided.

公开(公告)号：EP0884775A1

公开(公告)日：1998-12-16

申请号：EP98401397.9

申请日：1998-06-10

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Matsuda, Katsuji, c/o Murata Manufac. Co., Ltd. ,  Uchiyama, Kazuyoshi, c/o Murata Manufac. Co., Ltd. ,  Kawaguchi, Masahiko, c/o Murata Manufac. Co., Ltd. ,  Misaki, Katsuhiro, c/o Murata Manufac. Co., Ltd. ,  Iida, Naoki, c/o Murata Manufacturing Co., Ltd.

IPC: H01L21/78 ,  H01L21/48 ,  H01F41/04 ,  H01F27/29

CPC classification number: H01F41/041 ,  H01F27/292 ,  H05K1/0306 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2201/0919 ,  H05K2203/0228

Abstract: The present invention provides a method of manufacturing an electronic part capable of ensuring a wide area which can be used for forming elements on the surface of a unit substrate (1), and effectively producing an element part having desired performance. In the method, at least a portion of the unit substrate (1) is cut by using a blade (11) having a shape in which a portion thereof butted against the boundary (1c) between the electrode arrangement surface (1a) and the cut end surface (1b) of the unit substrate (1) or a portion which becomes the boundary (1c) is inclined at a predetermined angle to form an inclined surface (4) in the boundary (1c) or the portion which becomes the boundary (1c) and expose a part of an electrode (2, 2a) from the inclined surface (4).

Abstract translation: 本发明提供一种能够确保可用于在单元基板（1）的表面上形成元件的广泛区域的电子部件的制造方法，并且有效地制造具有期望性能的元件部件。 在该方法中，通过使用具有与电极布置表面（1a）和切割的边界（1c）对接的部分的形状的刀片（11）来切割单元基板（1）的至少一部分 单位基板（1）的端面（1b）或成为边界（1c）的部分以预定角度倾斜，以在边界（1c）或成为边界的部分（ 1c）并且从倾斜表面（4）暴露电极（2,2a）的一部分。

公开(公告)号：EP0333994B1

公开(公告)日：1994-09-28

申请号：EP89101221.3

申请日：1989-01-25

Applicant: Nippon CMK Corp.

Inventor： Seki, Kameharu ,  Kubo, Isamu

IPC: B23C3/12

CPC classification number: H05K3/0052 ,  B23C3/12 ,  H05K1/0269 ,  H05K3/0008 ,  H05K2201/09154 ,  H05K2203/0228 ,  H05K2203/1536 ,  H05K2203/163 ,  Y10T83/0259 ,  Y10T409/303808 ,  Y10T409/304144 ,  Y10T409/307336 ,  Y10T409/50246

公开(公告)号：EP0485790A3

公开(公告)日：1992-09-23

申请号：EP91118290.5

申请日：1991-10-26

Applicant: Löhr & Herrmann GmbH

Inventor： Löhr, Hans-Günter, Dr.-Ing. ,  Herrmann, Gunter, Dr.-Ing. ,  Mozzi, Josef

IPC: H05K3/00 ,  B23D45/10 ,  B27B33/20

CPC classification number: B23D45/105 ,  B27B33/20 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2203/0228

Abstract: Die Vorrichtung zum Trennen und Besäumen, insbes. von dünnen Leiterplatten, aber auch mehrlagigen Leiterplatten arbeitet mit zwei in einer Ebene einander gegenüberliegend angeordnete Kreissägeblätter (10a,10b), vorzugsweise mit Diamantschneiden, deren Sägezähne (21) jeweils in die Oberfläche der Leiterplatten (8) eintauchen und diese von beiden Seiten ankerben ohne sie vollständig durchzuschneiden. Der verbliebene "Reststeg" (22) wird möglichst dünn gewählt, jedoch ausreichend groß, damit die beiden Sägeblätter (10a,10b) so eingestellt werden können, daß ihre Zähne (21) Spitze gegen Spitze gestellt werden können ohne sich im Betrieb zu berühren. Das vollständige Durchtrennen der Leiterplatte (8) erfolgt in einem zweiten Bearbeitungsschritt mit einer dünnen Trennscheibe (16), die mit hoher Umfangsgeschwindigkeit umläuft und den Reststeg (22) durchtrennt.

公开(公告)号：EP0315739A3

公开(公告)日：1990-09-12

申请号：EP88113095.9

申请日：1988-08-12

Applicant: Löhr & Herrmann GmbH

Inventor： Löhr, Hans-Günter, Dr.-Ing. ,  Herrmann, Gunter, Dr.-Ing. ,  Mozzi, Josef Walter ,  Claus, Dieter

IPC: H05K3/00 ,  H05K13/00

CPC classification number: B23D45/105 ,  B23D47/005 ,  B23D47/042 ,  B23D59/008 ,  B23Q1/623 ,  B23Q7/02 ,  B27B33/20 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2203/0228 ,  Y10S269/903 ,  Y10T29/5148 ,  Y10T83/02 ,  Y10T83/7684 ,  Y10T83/783 ,  Y10T83/7843 ,  Y10T409/303808 ,  Y10T409/304144 ,  Y10T409/309184

Abstract: Die Erfindung bezieht sich auf eine Vorrichtung zum Trennen und Besäumen von Leiterplatten, insbes. mehrlagigen Leiterplatten (Multilayers), unterschiedlichen Formats mit hoher Maßgenauig­keit und Geschwindigkeit bei geringer Belastung der Leiterplatte, wobei das Trennen bzw. Besäumen in einem Arbeitsgang mit der Profilierung der Kanten erfolgt. Dies geschieht durch zwei in einer Ebene einander gegenüberliegend angeordnete Kreissägeblätter, vorzugsweise mit Diamantschneiden, deren Sägezähne ineinander kämmend beidseits in die Leiterplatte eintauchen - ohne, daß eines der Kreissägeblätter allein die Leiterplatte durch­trennt - zum gratfreien Trennen bzw. Besäumen der Leiterplatten bei gleichzeitiger Profilierung entsprechend den Sägezahn-Randprofilen.