公开(公告)号：US20190189152A1

公开(公告)日：2019-06-20

申请号：US16273721

申请日：2019-02-12

Applicant: NHK SPRING CO., LTD.

Inventor： Hajime ARAI

IPC: G11B5/48 ,  H05K1/02 ,  H05K1/18 ,  G11B5/127 ,  H05K3/00 ,  H05K3/18

CPC classification number: G11B5/4846 ,  G11B5/1272 ,  G11B5/4826 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0245 ,  H05K1/0277 ,  H05K1/0298 ,  H05K1/056 ,  H05K1/18 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/18 ,  H05K2201/05 ,  H05K2201/09245 ,  H05K2201/097 ,  H05K2201/2009 ,  Y10T29/49194

Abstract: A wiring structure of a head suspension including a flexure that supports a head and is attached to a load beam applying load onto the head, includes write wiring and read wiring formed on the flexure and connected to the head, each having wires of opposite polarities and further including a stacked interleaved part which includes segments electrically connected to the respective wires of the write wiring, the segments stacked on and facing the wires through an electrical insulating layer so that the facing wire and segment have opposite polarities, is manufactured by a wiring step, an insulating layer forming step and a stacked interleaved part forming step.

公开(公告)号：US20190081389A1

公开(公告)日：2019-03-14

申请号：US16123021

申请日：2018-09-06

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chien-Hung TSAI ,  Kuo-Chu LIAO ,  Wei-Cheng LO ,  Te-Li LIEN ,  Hsuan-Chi TSAI ,  Ming-Shan WU ,  Yung-Chieh YU

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/02

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q7/00 ,  H04B5/0081 ,  H05K1/028 ,  H05K1/165 ,  H05K2201/05 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10098

Abstract: An antenna module is provided. The antenna module includes a circuit board, a conductive layer, and a spiral coil. The circuit board has a first surface and a second surface opposite to each other. The circuit board further includes a first block and a second block connected to each other. The conductive layer is disposed on the first block. The spiral coil is disposed in the second block of the circuit board. The conductive layer at least partially surrounds the spiral coil.

公开(公告)号：US20180255636A1

公开(公告)日：2018-09-06

申请号：US15758527

申请日：2016-09-23

Applicant: AMOGREENTECH CO., LTD.

Inventor： In Yong SEO

IPC: H05K1/03 ,  H05K3/12 ,  D04H1/728

CPC classification number: H05K1/038 ,  A41D1/002 ,  D04H1/728 ,  D10B2401/18 ,  D10B2403/02431 ,  G02B27/017 ,  G06F1/163 ,  H05K1/0212 ,  H05K3/12 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/05 ,  H05K2201/10151

Abstract: Provided is a wearable device and a method of manufacturing the same. The wearable device includes: a wearable flexible printed circuit board having a circuit pattern formed on a base substrate having flexibility, air-permeability, and waterproofness; and a functional module mounted on the wearable flexible printed circuit board.

公开(公告)号：US20180175274A1

公开(公告)日：2018-06-21

申请号：US15578472

申请日：2016-06-02

Applicant: WISOL CO., LTD.

Inventor： Jung Rae NOH ,  Jae Hyung CHOI ,  Yo Sep CHOI

IPC: H01L41/04 ,  H02N2/04 ,  H05K1/18

CPC classification number: H01L41/042 ,  H01L41/094 ,  H02N2/04 ,  H05K1/189 ,  H05K2201/05 ,  H05K2201/10068 ,  H05K2203/0292

Abstract: A piezoelectric vibration module includes a vibration plate adapted to have one end fixed and the other end not fixed and driven in a vertical direction based on the fixed first end, a first piezoelectric element attached to the top or bottom of the vibration plate and adapted to generate a vibration power when power is applied, and a weight formed in the other end of the top or bottom of the vibration plate and adapted to control the vibration frequency of the piezoelectric vibration module. The first piezoelectric element is attached to the top or bottom of the vibration plate with a predetermined interval from a fixed point at the one end of the vibration plate.

公开(公告)号：US09955574B2

公开(公告)日：2018-04-24

申请号：US14369909

申请日：2012-01-13

Applicant: Koichiro Tanaka ,  Kazuki Kammuri

Inventor： Koichiro Tanaka ,  Kazuki Kammuri

IPC: B32B15/00 ,  H05K1/03 ,  B32B15/08 ,  H05K1/09 ,  H05K3/02 ,  B32B7/02 ,  B32B15/20 ,  H05K1/05

CPC classification number: H05K1/0393 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/712 ,  B32B2457/08 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/05 ,  H05K2201/06 ,  Y10T29/302 ,  Y10T428/12438 ,  Y10T428/273

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1

公开(公告)号：US20180042125A1

公开(公告)日：2018-02-08

申请号：US15365674

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang ,  Tsung-Hsien Tsai

IPC: H05K3/46 ,  C08L79/08 ,  H05K1/03

CPC classification number: H05K3/007 ,  C03C17/3405 ,  C03C2218/11 ,  C03C2218/32 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08L79/08 ,  C08L2203/20 ,  C09D179/08 ,  H01L21/6835 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2221/68345 ,  H01L2221/68386 ,  H05K1/0393 ,  H05K3/4682 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2203/0152 ,  H05K2203/016 ,  H05K2203/0264 ,  C08L27/18 ,  C08K5/544

Abstract: A method of fabricating a flexible printed circuit includes providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other, forming a flexible substrate on the carrying support, the formed flexible substrate being adhered in contact with the release layer, applying one or more processing step on the flexible substrate while the flexible substrate is supported by the carrying support, and peeling the flexible substrate with an electric circuit formed thereon from the release layer while the release layer remains adhered in contact with the support base.

公开(公告)号：US09875834B2

公开(公告)日：2018-01-23

申请号：US15184626

申请日：2016-06-16

Applicant: Sensata Technologies, Inc.

Inventor： Janselme M. Eral ,  Richard R. Guerrero

IPC: H01F7/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01F7/0205 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/111 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2201/09063 ,  Y02P70/611

Abstract: A flexible printed circuit may include a flexible body portion and a flexible head end portion, where conductors and/or elongated cut outs may be formed in a pattern. The flexible body may include a proximal end and a distal end, wherein the proximal end is configured to be connected to a stationary object and the distal end is configured to be connected to a moving object that moves in relation to the stationary object. The head end of the flexible printed circuit may be located at the distal end of the flexible body. The head end may include a plurality of elongated cut-outs, and/or a plurality of electrical connection pads suspended from the flexible body by the plurality of elongated cutouts.

公开(公告)号：US20180019417A1

公开(公告)日：2018-01-18

申请号：US15587625

申请日：2017-05-05

Applicant: Japan Display Inc.

Inventor： Naohisa ANDOU

IPC: H01L51/00 ,  H01L51/56 ,  H01L27/32

CPC classification number: H01L51/0097 ,  H01L27/3244 ,  H01L51/56 ,  H01L2251/5338 ,  H05K1/0269 ,  H05K1/028 ,  H05K1/118 ,  H05K2201/05

Abstract: A method for manufacturing a display device includes the steps of preparing a spacer that includes a first alignment mark, forming a notch on a back reinforcing film and cutting the back reinforcing film in a size corresponding to a size of a first bottom surface, disposing the back reinforcing film on a back surface side of a display area, disposing the spacer on a back surface side of a flexible substrate, and bending a bent area so as to conform to a shape of the spacer and disposing a terminal area on a back surface side of the spacer. In the step of disposing the spacer, viewed from the back surface side of the flexible substrate, the spacer is positioned on the back reinforcing film based on a position of the notch and a position of the first alignment mark.

公开(公告)号：US09872383B1

公开(公告)日：2018-01-16

申请号：US14266636

申请日：2014-04-30

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Anwar Mohammed ,  Zhen Feng

IPC: H05K1/00 ,  H05K1/03 ,  H01R4/00 ,  D05B17/00 ,  H01R4/02 ,  H01R43/02 ,  H05K1/18 ,  H05K9/00

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire cloths, one electrically conductive wire cloth coupled to one electrical connection point on an electronic component. The electrically conductive wire cloth is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire cloth.

公开(公告)号：US09795039B2

公开(公告)日：2017-10-17

申请号：US15346043

申请日：2016-11-08

Applicant: HARRIS CORPORATION

Inventor： Louis Joseph Rendek, Jr.

IPC: H05K1/00 ,  H05K3/34 ,  H05K1/16 ,  H05K3/16 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K1/03

CPC classification number: H05K3/3452 ,  H01L2224/16225 ,  H05K1/028 ,  H05K1/03 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/115 ,  H05K1/167 ,  H05K3/16 ,  H05K3/3436 ,  H05K3/4038 ,  H05K2201/0141 ,  H05K2201/05 ,  Y02P70/613

Abstract: A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film resistor on the LCP solder mask and coupling the at least one LCP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings.