公开(公告)号：EP0333995A3

公开(公告)日：1990-08-22

申请号：EP89101222.1

申请日：1989-01-25

Applicant: Nippon CMK Corp.

Inventor： Seki, Kameharu ,  Kubo, Isamu

IPC: B23C3/12

CPC classification number: H05K3/0052 ,  B23C3/12 ,  H05K1/0269 ,  H05K3/0008 ,  H05K2201/09154 ,  H05K2203/0228 ,  H05K2203/1536 ,  H05K2203/163 ,  Y10T83/0259 ,  Y10T409/303808 ,  Y10T409/304144 ,  Y10T409/307336 ,  Y10T409/50246

Abstract: The invention concerns an apparatus of chamfering edges of planar plates, particularly of printed wiring boards. According to the invention the plates are stacked in a first step and then chamfered in such a manner that the lower edge of an upper plate and the upper edge of a lower plate are chamfered simultaneously.

公开(公告)号：EP0259716A3

公开(公告)日：1990-05-30

申请号：EP87112511.8

申请日：1987-08-28

Applicant: Held, Kurt

Inventor： Held, Kurt

IPC: B23D45/20 ,  B23D47/00

CPC classification number: B27G19/10 ,  B23D45/20 ,  B23D47/005 ,  B23D59/006 ,  B23D59/008 ,  B23D61/026 ,  B27B33/20 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09154 ,  H05K2203/0228 ,  H05K2203/068 ,  H05K2203/1545 ,  Y10T83/7507 ,  Y10T83/7863 ,  Y10T156/108 ,  Y10T156/1084 ,  Y10T156/1741

Abstract: Die Erfindung betrifft ein Verfahren zur Aufteilung einer konti­nuierlich hergestellten metallkaschierten Laminatbahn (13) kommisionsweise in einzelne Platten (15) in beliebiger Grösse mittels Rechnereinsatz und einer Säge. Die zugehörige Vorrichtung besteht aus einer durch den Rechner bahngesteuerten NC-Säge (14), deren im Sägekopf (47) befindliches Sä­geblatt (31) entlang den Schnittkanten eine Seitenabstützung besitzt. Die­se Seitenabstüztung enthält Schneidenplättchen (37a,b), die mit einer Sei­tenfläche unter leichtem Druck an das Sägeblatt (31) angelegt sind und mit einer weiteren schmalen Kantenfläche die Schnittkante auf der metallkaschierten Laminatbahn (13) abstützten. Zur Besäumung des drucklos ausgehärteten Pressrandes sind vor dem Sägekopf am Rande der metall­kaschierten Laminatbahn feststehende Kreissägen mit einer Seitenab­stützung des Sägeblatts angeordnet.

公开(公告)号：EP0310437A1

公开(公告)日：1989-04-05

申请号：EP88309137.3

申请日：1988-09-30

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Sato, Hideki, ,  Hatori, Masakazu, ,  Mizunoya, Nobuyuki,

IPC: H01L21/48 ,  H01L23/12 ,  H01L23/26

CPC classification number: H01L21/4807 ,  H01L23/13 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/403 ,  H05K2201/09154 ,  H05K2201/09845 ,  Y10S428/901 ,  Y10T428/24355 ,  Y10T428/24413 ,  Y10T428/24479 ,  Y10T428/24777 ,  Y10T428/24917 ,  H01L2924/00

Abstract: Disclosed is an aluminum nitride circuit board which is advantageously used as a carrier for a part emitting a large volume of heat, the substrate of the circuit board is a sintered aluminum nitride substrate (6) which comprises a basal part (4) and projection (5) rising from the basal part and offering a surface for application of a metallizing composition, a metallized layer (7) thereof is formed on the upper side of the projection by applying the metallizing composition thereon and forming the applied layer of the composition by firing, the metallizing composition applied on the upper side of the projection is prevented from sagging down the lateral side of the basal part owing to the step formed with the projection and the basal part, the preclusion of the otherwise inevitable sagging of the composition contributes greatly to improving the circuit board's voltage withstanding property. Owing to the curved surfaces formed in the rising part (16) of the projection, the edge (14) on the upper side of the projection, and the corner (15) along the edge of the basal part, the production of circuit boards enjoys a very yield and the circuit boards are protected against accidents due to the otherwise possible occurrence of cracks during service.

Abstract translation: 公开了一种氮化铝电路板，其有利地用作发射大量热量的部件的载体，电路板的基板是烧结氮化铝基板（6），其包括基部（4）和突起（ 5）从基底部分上升并提供用于施加金属组合物的表面，其上的金属化层（7）通过在其上施加金属化组合物而形成在突起的上侧，并通过烧制形成组合物的施加层 施加在突起的上侧的金属组合物由于形成有突起和基部的台阶而被阻止在基部的侧面下垂，因此排除组合物的其它不可避免的下垂很大程度上有助于 提高电路板的耐电压性能。 由于在突起的上升部分（16）中形成的弯曲表面，突起的上侧上的边缘（14）和沿着基部边缘的拐角（15），电路板的生产享有 非常收益，并且由于在使用期间可能发生裂缝，电路板被保护以免发生事故。

公开(公告)号：US20240357739A1

公开(公告)日：2024-10-24

申请号：US18639407

申请日：2024-04-18

Applicant: TOPPAN Holdings Inc.

Inventor： Tomoyuki Ishii

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/0306 ,  H05K3/0017 ,  H05K3/4644 ,  H05K2201/0266 ,  H05K2201/0338 ,  H05K2201/09154 ,  H05K2203/0548 ,  H05K2203/1105

Abstract: A wiring board includes: a substrate; a first seed layer provided on the substrate; a first conductive layer provided on the first seed layer; a first insulating layer provided on the first conductive layer; a second seed layer provided on the first insulating layer; and a second conductive layer provided on the second seed layer. An area of the first insulating layer is smaller than an area of the first conductive layer. An area of the second conductive layer is smaller than the area of the first insulating layer. A region of the first insulating layer not overlapping the second conductive layer includes a first region surrounding the second conductive layer and a second region outside the first region. A surface roughness of the second region is larger than a surface roughness of the first region.

公开(公告)号：US12080637B2

公开(公告)日：2024-09-03

申请号：US17725627

申请日：2022-04-21

Applicant: Dai Nippon Printing Co., Ltd.

Inventor： Satoru Kuramochi ,  Sumio Koiwa ,  Hidenori Yoshioka

IPC: H01L23/498 ,  H01L23/48 ,  H01L25/065 ,  H01L25/18 ,  H05K1/11 ,  H05K3/28 ,  H05K3/44 ,  H01L23/00 ,  H01L23/13 ,  H01L23/15

CPC classification number: H01L23/49827 ,  H01L23/481 ,  H01L23/49894 ,  H01L25/065 ,  H01L25/18 ,  H05K1/115 ,  H05K3/28 ,  H05K3/445 ,  H01L23/13 ,  H01L23/15 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16165 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81805 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/381 ,  H05K2201/09154 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/09854 ,  H05K2203/0594 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/15787 ,  H01L2924/05432 ,  H01L2924/1579 ,  H01L2924/00014 ,  H01L2224/13109 ,  H01L2924/00014 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2224/13144 ,  H01L2924/00014 ,  H01L2224/81805 ,  H01L2924/00014 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/2919 ,  H01L2924/07025

Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.

公开(公告)号：US20230380062A1

公开(公告)日：2023-11-23

申请号：US17923624

申请日：2021-04-29

Applicant: CORNING INCORPORATED

Inventor： DHANANJAY JOSHI ,  CHUKWUDI AZUBUIKE OKORO ,  SCOTT CHRISTOPHER POLLARD

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/06 ,  H05K3/42

CPC classification number: H05K1/116 ,  H05K1/0306 ,  H05K3/064 ,  H05K3/42 ,  H05K2201/09509 ,  H05K2201/068 ,  H05K2201/09154 ,  H05K2201/0215 ,  H05K2201/09827 ,  H05K2201/09845

Abstract: A substrate including a via with a beveled overburden is disclosed. The substrate can include a substrate having a first surface, a second surface opposite the first surface, and a via passing from the first surface to the second surface. The via can be coated with a metallic layer that includes a first beveled overburden on the first surface, and the first beveled overburden can include a first outer edge that forms a first bevel angle greater than 95° with the first surface. The substrate can include a second beveled overburden that includes a second outer edge that forms a second bevel angle greater than 95° with the second surface. Methods of making the beveled overburdens are also disclosed.

公开(公告)号：US20180317321A1

公开(公告)日：2018-11-01

申请号：US15904577

申请日：2018-02-26

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kenichi MORI ,  Kazuyuki KUBOTA ,  Yoshihiro IHARA

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H01R12/72

CPC classification number: H05K1/144 ,  H01R12/721 ,  H01R12/725 ,  H01R12/728 ,  H05K1/111 ,  H05K1/181 ,  H05K1/183 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/09409 ,  H05K2201/10522

Abstract: A circuit board module is electrically connectable to a socket by inserting one end part thereof into the socket, and includes a circuit board and a terminal board having a first surface provided with a column of socket-connection pads and mounted on the surface of the circuit board at the one end part. The terminal board includes first, second, and third pad columns provided on a second surface of the terminal board opposite to the first surface. The circuit board includes fourth, fifth, and sixth pad columns respectively provided on the surface of the circuit board opposing the second surface of the terminal board, at positions opposing the first, second, and third pad columns of the terminal board, respectively.

公开(公告)号：US09986635B2

公开(公告)日：2018-05-29

申请号：US15379778

申请日：2016-12-15

Applicant: Fujitsu Technology Solutions Intellectual Property GmbH

Inventor： Wilhelm Neukam

IPC: H05K1/02 ,  H05K5/02 ,  H05K1/03 ,  H05K7/14 ,  H05K3/20

CPC classification number: H05K1/0275 ,  H05K1/0284 ,  H05K1/03 ,  H05K3/20 ,  H05K5/0208 ,  H05K7/1427 ,  H05K2201/0388 ,  H05K2201/07 ,  H05K2201/09154 ,  H05K2201/09681

Abstract: An assembly includes a carrier and an electrically conductive mesh, wherein the carrier includes a side surface with an edge, the electrically conductive mesh is attached to the side surface and extends over the edge of the side surface, and the edge has a radius at least as big as a minimal bending radius of electric lines of the electrically conductive mesh.

公开(公告)号：US20180075871A1

公开(公告)日：2018-03-15

申请号：US15689695

申请日：2017-08-29

Applicant: NITTO DENKO CORPORATION

Inventor： Yuu SUGIMOTO ,  Hiroyuki TANABE

IPC: G11B5/48 ,  H05K1/05 ,  H05K1/11 ,  H05K3/40 ,  H05K3/06 ,  H05K3/00

CPC classification number: G11B5/4853 ,  G11B5/3163 ,  G11B2005/0021 ,  H05K1/056 ,  H05K1/119 ,  H05K1/184 ,  H05K3/0023 ,  H05K3/0041 ,  H05K3/06 ,  H05K3/3405 ,  H05K3/4015 ,  H05K2201/09063 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/10106

Abstract: A suspension board with circuit having an opening with an electronic element inserted therein includes an insulating layer disposed at the edge of the opening, a first terminal disposed at one surface of the insulating layer and connected to a magnetic head, and a second terminal disposed at the other surface thereof and connected to the electronic element. The insulating layer includes a first portion in which the first terminal is disposed and a second portion that extends from the first portion toward the opening and is overlapped with a slider. The second portion is thinner than the first portion and is overlapped with the second terminal. The slider has a first surface facing the second portion. The first surface is disposed between the first terminal and the second terminal.

公开(公告)号：US20180024676A1

公开(公告)日：2018-01-25

申请号：US15547796

申请日：2015-03-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Cameron Hutchings ,  Stewart R. Wyatt ,  Scott David Hahn

IPC: G06F3/041 ,  H05K1/02 ,  G06F3/042

CPC classification number: G06F3/0412 ,  G06F3/041 ,  G06F3/0421 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K2201/09036 ,  H05K2201/09154 ,  H05K2201/10106 ,  H05K2201/10121

Abstract: According to an example, a device may comprise a touchscreen light guide assembly, a lens disposed on the touchscreen light guide assembly, and a printed circuit board including a relief cut on an edge of the printed circuit board. The relief cut may be to receive the touchscreen light guide assembly and to allow the lens to extend into the printed circuit board relief cut.