公开(公告)号：WO2003043747A2

公开(公告)日：2003-05-30

申请号：PCT/US2002/037175

申请日：2002-11-19

Applicant: GRAPHIC PACKAGING CORPORATION

Inventor： LAI, Laurence, M., C. ,  RUSSELL, Anthony ,  SHAW, Michael, J.

IPC: B05D5/00

CPC classification number: H05K1/0265 ,  B32B15/04 ,  C23F1/02 ,  H04R7/04 ,  H04R31/003 ,  H05K1/09 ,  H05K1/165 ,  H05K3/06 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/098 ,  H05K2203/1545 ,  H05K2203/1572 ,  Y10T428/10 ,  Y10T428/24 ,  Y10T428/24917 ,  Y10T428/31678

Abstract: To achieve a large thickness of conductive metal-containing material in a feature of a product unit processed with a liquid-based etch process, the desired thickness of material is apportioned to the two opposing surfaces of a substrate to create a two-part feature. Conventional features are made by identically patterning two same-thickness metal-containing layers and electrically connecting the resulting patterned parts in any suitable manner. However, features may also be made that do not have identical parts on opposite sides of the substrate, the two parts being electrically connected but differing in thickness, in shape, or both. Moreover, having two metal-containing layers separated by an insulator is also useful for allowing different sections of the same feature or circuit to cross one another without shorting, or to overlap in whole or in part without shorting.

Abstract translation: 为了在用液基蚀刻工艺处理的产品单元的特征中实现大的厚度的含导电金属材料，将期望厚度的材料分配到基板的两个相对表面 创建一个两部分功能。 常规特征通过以相同方式图案化两个相同厚度的含金属层并且以任何合适的方式电连接所得到的图案化部分而制成。 然而，也可以做出在基板的相对侧上不具有相同部分的特征，这两个部分电连接但厚度，形状或两者不同。 此外，具有由绝缘体分开的两个含金属层也可用于允许相同特征或电路的不同部分彼此交叉而不发生短路，或者全部或部分重叠而不发生短路。

公开(公告)号：WO00004750A1

公开(公告)日：2000-01-27

申请号：PCT/EP1999/004568

申请日：1999-07-01

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/42

CPC classification number: H05K1/0265 ,  H05K3/0032 ,  H05K3/0082 ,  H05K3/027 ,  H05K3/062 ,  H05K3/064 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0305 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2203/0505

Abstract: The rough conducting structures (GL) and the fine conducting structures (FL) are etched out of a metal layer in a common etching process, whereby an etch resist structured by means of photolithography is used in the area containing the rough conducting structures (GL) and an etch resist structured by means of a laser beam is used in the area containing the fine conducting structures.

Abstract translation: 粗导体结构（GL）和精细的导体结构（FL）被蚀刻在金属层的通常的蚀刻方法，其中在粗导体结构（GL）的区域，通过光刻法蚀刻的方式结构化的抗蚀剂，并在细导体结构的通过激光束蚀刻的方式构成的区域的抗蚀剂 被使用。

公开(公告)号：WO1993024939A1

公开(公告)日：1993-12-09

申请号：PCT/US1993005061

申请日：1993-05-27

Applicant: ADVANCED CIRCUIT TECHNOLOGY, INC.

Inventor： ADVANCED CIRCUIT TECHNOLOGY, INC. ,  MURPHY, Davis, W. ,  BONNETTE, Dennis, A. ,  STEARNS, Thomas, H.

IPC: H01B07/08

CPC classification number: H05K3/06 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/4092 ,  H05K2201/0341 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0353 ,  H05K2203/0369 ,  H05K2203/0384 ,  Y10T29/49156 ,  Y10T29/49218 ,  Y10T29/49222 ,  Y10T428/1291

Abstract: A laminate (50) comprising metal layers (56 and 58) separated by an etchant barrier (51) to control depth of etching of the laminate, the barrier being etchable by an etchant which is not an etchant for the layers. A cable (20) incorporating such a laminate and having relatively flexible conductors (22) integral with relatively rigid terminals. A method of making such a cable, using the laminate, by selectively etching the layers down to the barrier to form the conductors and terminals (26 and 28), stripping the barrier and laminating the conductors with an insulating material (42 and 44) preferably extending over at least a portion of the terminals to reinforce the conductor terminal transition and a cable when made of such a method.

公开(公告)号：NO852041A

公开(公告)日：1985-12-30

申请号：NO852041

申请日：1985-05-22

Applicant: NIPPON MEKTRON KK

Inventor： MIZUKO TUTOMU ,  ISUKAHARA TOSHIYUKI ,  YOSHIDA MASAHIRO ,  NEMOTO KOJI

IPC: H05K3/24 ,  H05K1/00 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/42 ,  H05K

CPC classification number: H05K1/028 ,  H05K3/108 ,  H05K3/243 ,  H05K3/427 ,  H05K2201/09736 ,  H05K2203/0557

公开(公告)号：ZA7006172B

公开(公告)日：1971-05-27

申请号：ZA7006172

申请日：1970-09-10

Applicant: STANDARD TELEPHONES CABLES LTD

Inventor： COOKE R ,  TARNOWSKI J ,  PLATER S ,  JUDD R ,  NEALE R

IPC: H05K3/06 ,  H05K3/24 ,  H05K3/34 ,  H05K3/42 ,  H05K

CPC classification number: H05K3/3473 ,  H05K3/061 ,  H05K3/243 ,  H05K3/427 ,  H05K2201/09736

公开(公告)号：WO2017222843A1

公开(公告)日：2017-12-28

申请号：PCT/US2017/036932

申请日：2017-06-12

Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC

Inventor： HOLBERY, James David ,  MA, Siyuan ,  DICKEY, Michael David

IPC: H05K1/14 ,  H01R12/59 ,  H01R12/77 ,  H05K1/02 ,  H05K3/12 ,  H05K3/36

CPC classification number: H05K1/0272 ,  G06F1/1613 ,  H01R12/59 ,  H01R12/77 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/03 ,  H05K1/092 ,  H05K1/148 ,  H05K3/10 ,  H05K3/1275 ,  H05K3/361 ,  H05K3/4644 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/055 ,  H05K2201/09009 ,  H05K2201/09736 ,  H05K2203/0776

Abstract: Examples are provided for a flexible circuit element including a flexible insulating support structure, a solid metal trace extending at least partially between a first connector and a second connector on the flexible insulating support structure, and a liquid metal conductor disposed in contact with the solid metal trace in a region of the trace configured to repeatedly flex when installed in a device.

Abstract translation: 提供了用于柔性电路元件的示例，柔性电路元件包括柔性绝缘支撑结构，至少部分地在柔性绝缘支撑结构上的第一连接器和第二连接器之间延伸的固体金属迹线以及液态金属 导体设置成在迹线的区域中与固体金属迹线接触，被配置为当安装在装置中时反复弯曲。

公开(公告)号：WO2016199446A1

公开(公告)日：2016-12-15

申请号：PCT/JP2016/053794

申请日：2016-02-09

Applicant: 富士フイルム株式会社

Inventor： 宮本　治彦

IPC: G06F3/041

CPC classification number: G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/119 ,  H05K3/0014 ,  H05K3/28 ,  H05K2201/09736 ,  H05K2203/0278 ,  H05K2203/085 ,  H05K2203/302

Abstract: ３次元形状に成形された後もほぼ均一の厚さのカバー部材を有するタッチパネル用導電体の製造方法、導電フィルム積層体およびタッチパネル用導電体を提供する。絶縁性および透明性を有するカバー部材１に、成形時に変形する部分の厚さを他の部分１１の厚さに対してあらかじめ変化させた少なくとも１つの厚さ変化部１２を形成し、カバー部材１の表面上に導電部材を配置することによって導電フィルム積層体を形成し、厚さ変化部１２が形成されている部分の導電フィルム積層体が変形するように一括して３次元形状に成形し、タッチパネル用導電体を製造する。

Abstract translation: 本发明的目的是提供一种制造用于触摸面板的导电体的方法，其具有即使在形成三维形状之后具有大致均匀厚度的盖构件，导电膜层叠体和导电性 身体为触摸屏。 至少一个厚度变化部分12，其中在成形时变形的部分的厚度相对于另一部分11的厚度在成形之前改变，形成在绝缘和透明的盖部件1上。 通过将导电构件定位在盖构件1的表面上而形成导电膜层叠体。导电膜层叠体形成为三维形状，使得导电膜层叠体在其部分变形 在其上形成厚度变化部分12，制造用于触摸面板的导电体。

公开(公告)号：WO2015083160A3

公开(公告)日：2015-10-08

申请号：PCT/IL2014051048

申请日：2014-12-02

Applicant: CLEARJET LTD

Inventor： GROUCHKO MICHAEL ,  MAGDASSI SHLOMO

IPC: C09D11/52 ,  C09D11/033 ,  C23C4/18 ,  C23C26/00 ,  H01G9/20 ,  H01H49/00 ,  H01L27/01 ,  H01L27/28 ,  H01L33/42 ,  H01L51/00 ,  H05K1/09 ,  H05K3/12 ,  H05K3/24 ,  H05K3/46

CPC classification number: H05K3/1208 ,  C09D11/10 ,  C09D11/322 ,  C09D11/36 ,  C09D11/52 ,  C23C24/085 ,  H01L51/0005 ,  H01L51/0007 ,  H05K1/092 ,  H05K1/095 ,  H05K1/097 ,  H05K1/16 ,  H05K3/105 ,  H05K3/12 ,  H05K3/125 ,  H05K3/1283 ,  H05K3/227 ,  H05K3/245 ,  H05K3/4685 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/09681 ,  H05K2201/09736 ,  H05K2201/098 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10143 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/013 ,  H05K2203/0545 ,  H05K2203/0783 ,  H05K2203/081 ,  H05K2203/092 ,  H05K2203/095 ,  H05K2203/1105 ,  H05K2203/111 ,  H05K2203/1173 ,  H05K2203/1476 ,  H05K2203/1492 ,  H05K2203/173 ,  Y02E10/542 ,  Y02E10/549

Abstract: The invention provides a process of forming a continuous pattern on a surface composed of two or more surface regions, each of the regions being of a different surface energy, the process utilizing a novel ink formulation for printing on such multi-region surfaces.

Abstract translation: 本发明提供了一种在由两个或更多个表面区域组成的表面上形成连续图案的方法，每个区域具有不同的表面能，该方法利用新的油墨配方在这种多区域表面上印刷。

公开(公告)号：WO2015140775A1

公开(公告)日：2015-09-24

申请号：PCT/IL2015/000013

申请日：2015-03-11

Applicant: UTILIGHT LTD.

Inventor： NOY, Amir

IPC: B05D1/38 ,  B41M5/40 ,  C09D17/00 ,  H05K3/12

CPC classification number: H05K3/12 ,  B41M3/008 ,  B41M5/26 ,  C09D17/00 ,  H05K1/0265 ,  H05K1/0271 ,  H05K1/095 ,  H05K2201/09736 ,  H05K2203/107 ,  H05K2203/1476

Abstract: Described are an apparatus and a method for printing a high aspect ratio and/or specific vertical geometry pattern. The apparatus operates in a multi-pass printing mode and includes one or more paste dispensing mechanism configured to dispense a high viscosity paste to form a pattern on a substrate. At least one paste dispensing mechanism is configured to dispense the paste to a segment of the pattern printed at an earlier pass. The paste is dispensed to the relevant segment of the pattern earlier printed before the paste printed at the earlier made pass is dry or what is termed "wet- on-wet" printing.

Abstract translation: 描述了用于打印高宽比和/或特定垂直几何图案的装置和方法。 该设备以多遍打印模式操作，并且包括配置成分配高粘度糊料以在基底上形成图案的一个或多个浆料分配机构。 至少一个浆料分配机构被配置为将浆料分配到在较早通过时印刷的图案的一部分。 在较早制造的通行印刷的浆料干燥或称为“湿湿”印刷之前，将浆料分配到先前印刷的图案的相关部分。

公开(公告)号：WO2015101494A1

公开(公告)日：2015-07-09

申请号：PCT/EP2014/078131

申请日：2014-12-17

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： DE VAAN, Adrianus, Johannes, Stephanus, Maria ,  PEELS, Wilhelmus, Gerardus, Maria ,  DEEBEN, Josephus, Paulus, Augustinus

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/12 ,  H05K1/05 ,  H05K3/32

CPC classification number: H05K3/32 ,  H05K1/0284 ,  H05K1/056 ,  H05K1/092 ,  H05K3/0014 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/321 ,  H05K3/44 ,  H05K2201/0129 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2203/1461

Abstract: A method for manufacturing a non-planar printed circuit board assembly (1) is disclosed. The method comprises providing a planar formable substrate (2) for supporting a conductive material (3) and at least one electronic component (4), printing a circuit pattern of an uncured conductive material (3) on the planar substrate (2), forming the substrate (2) and the uncured conductive material (3) into a non-planar shape, and curing the conductive material (3),wherein the substrate (2) comprises a metal sheet and an electrically insulating coating (2b) arranged between the metal sheet and the conductive material (3).

Abstract translation: 公开了一种用于制造非平面印刷电路板组件（1）的方法。 该方法包括提供用于支撑导电材料（3）和至少一个电子部件（4）的平面可成形基底（2），在平面基底（2）上印刷未固化的导电材料（3）的电路图案，形成 所述基板（2）和所述未固化的导电材料（3）成为非平面形状，并且固化所述导电材料（3），其中所述基板（2）包括金属片和布置在所述导电材料（3）之间的电绝缘涂层 金属片和导电材料（3）。