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    ELECTRICAL DEVICES AND METHODS FOR MANUFACTURING SAME
    252.
    发明申请
    ELECTRICAL DEVICES AND METHODS FOR MANUFACTURING SAME 有权
    电气设备及其制造方法

    公开(公告)号：US20150296623A1

    公开(公告)日：2015-10-15

    申请号：US14251988

    申请日：2014-04-14

    Applicant: PRESIDIO COMPONENTS, INC.

    Inventor： Hung Van Trinh

    IPC: H05K1/18 ,  H05K3/30

    CPC classification number: H05K3/3426 ,  B23K1/0016 ,  B23K35/262 ,  C22C13/00 ,  H01G2/06 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/38 ,  H01L23/495 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/498 ,  H01L23/562 ,  H05K2201/10015 ,  H05K2201/10628 ,  H05K2201/10787 ,  H05K2203/047 ,  H05K2203/1173 ,  H05K2203/1377 ,  Y02P70/613

    Abstract: An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically coupling the capacitor to the lead frame. The solder dam includes one of a physical barrier to flow or an area of reduced wettability to the solder. The solder dam is between the solder joint and the circuit board. The solder dam is on one or both of a lead portion and main portion of the lead frame. In one embodiment, the first solder dam extends substantially the full width of the first lead portion. The solder dam may be a barrier and/or include a metal oxide. A method of manufacturing the device includes soldering a lead frame to a capacitor with a solder and modifying a surface on the lead frame to include a physical barrier and/or an area of reduced wettability.

    Abstract translation: 用于焊接到具有焊料的电路板的电气装置包括电容器，包括焊料坝的引线框架和将电容器电耦合到引线框架的焊接接头。 焊料坝包括流动的物理阻挡层或对焊料的润湿性降低的区域之一。 焊点位于焊点和电路板之间。 焊料坝在引线框架的引线部分和主要部分中的一个或两个上。 在一个实施例中，第一焊料坝基本上延伸第一引线部分的整个宽度。 焊料坝可以是阻挡层和/或包括金属氧化物。 一种制造该器件的方法包括用引线焊接引线框架到电容器，并修改引线框架上的表面以包括物理屏障和/或具有降低的润湿性的区域。

    CHIP COMPONENT MOUNTING STRUCTURE, AND MODULE COMPONENT
    253.
    发明申请
    CHIP COMPONENT MOUNTING STRUCTURE, AND MODULE COMPONENT 有权
    芯片组件安装结构和模块组件

    公开(公告)号：US20150257266A1

    公开(公告)日：2015-09-10

    申请号：US14718367

    申请日：2015-05-21

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Hiromi MURAYAMA ,  Kazuaki HIGASHIBATA ,  Noboru KATO

    IPC: H05K1/11 ,  H05K1/03 ,  G06K19/077 ,  H05K1/02

    CPC classification number: H05K1/111 ,  G06K19/0772 ,  G06K19/07754 ,  G06K19/07756 ,  H01L23/49855 ,  H01L2224/16225 ,  H01L2924/15313 ,  H01Q1/2225 ,  H01Q9/20 ,  H05K1/0259 ,  H05K1/028 ,  H05K1/0295 ,  H05K1/03 ,  H05K2201/09427 ,  H05K2201/0979 ,  H05K2201/09954 ,  H05K2201/10628 ,  Y02P70/611

    Abstract: A chip component includes external terminals on a mounting surface thereof at positions that are rotationally symmetric to each other by 180 degrees with respect to a center of the mounting surface. A substrate includes first and second mounting terminals on the mounting surface of the substrate at first diagonal positions of a square indicated by a two dot chain line, and third and fourth mounting terminals on the surface of the substrate at second diagonal positions of the square. The first and fourth mounting terminals are connected by a first terminal connecting portion, and the second and third mounting terminals are connected by a second terminal connecting portion. The chip component is configured to be mounted in any of four directions obtained by rotating the chip component every 90 degrees and achieves the same electrical characteristics.

    Abstract translation: 芯片部件在其安装表面上包括相对于安装表面的中心相互旋转对称180度的位置的外部端子。 衬底包括在由两点划线表示的正方形的第一对角位置处的衬底的安装表面上的第一和第二安装端子，以及在正方形的第二对角线位置处的衬底的表面上的第三和第四安装端子。 第一和第四安装端子通过第一端子连接部分连接，第二和第三安装端子通过第二端子连接部分连接。 芯片部件被配置为安装在通过每90度旋转芯片部件而获得的四个方向中的任一个，并且实现相同的电特性。

    ALIGNMENT OF COMPONENTS COUPLED TO A FLEXIBLE SUBSTRATE FOR WEARABLE DEVICES
    254.
    发明申请
    ALIGNMENT OF COMPONENTS COUPLED TO A FLEXIBLE SUBSTRATE FOR WEARABLE DEVICES 审中-公开
    与柔性基板连接的组件对准可用设备

    公开(公告)号：US20150146355A1

    公开(公告)日：2015-05-28

    申请号：US14541135

    申请日：2014-11-13

    Applicant: Dileep Goyal ,  Mihai Ionescu ,  Hari N. Chakravarthula

    Inventor： Dileep Goyal ,  Mihai Ionescu ,  Hari N. Chakravarthula

    IPC: G06F1/16 ,  H05K3/00 ,  H05K1/18

    CPC classification number: G06F1/163 ,  A61B5/0533 ,  A61B5/6831 ,  G04G17/04 ,  G04G21/025 ,  H05K1/0271 ,  H05K1/0277 ,  H05K1/028 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/0379 ,  H05K2201/10469 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/2009 ,  H05K2203/0126 ,  H05K2203/1327

    Abstract: Embodiments relate generally to wearable electrical and electronic hardware, computer software, wired and wireless network communications, and to wearable/mobile computing devices. More specifically, various embodiments are directed to, for example, aligning a flexible substrate and/or components thereof during fabrication to enhance reliability. In one example, a method includes forming a framework that includes, for example, a portion (e.g., an anchor portion) configured to couple to a flexible substrate, the portion having a neutral axis. Also, the method may include forming a flexible substrate that includes a supported flex region including conductors and one or more rigid regions configured to receive one or more components. A rigid region might include an encapsulated rigid region. The method further may also include aligning the encapsulated rigid region at an angle to the neutral axis, and molding over the encapsulated rigid region.

    Abstract translation: 实施例一般涉及可穿戴电气和电子硬件，计算机软件，有线和无线网络通信以及可穿戴/移动计算设备。 更具体地，各种实施例涉及例如在制造期间对准柔性基板和/或其部件以增强可靠性。 在一个示例中，一种方法包括形成框架，该框架包括例如被配置为耦合到柔性基板的部分（例如，锚定部分），所述部分具有中性轴线。 此外，该方法可以包括形成柔性基板，该柔性基板包括被支撑的柔性区域，该支撑的柔性区域包括导体和一个或多个刚性区域，该刚性区域被配置为 刚性区域可以包括封装的刚性区域。 该方法还可以包括将封装的刚性区域与中性轴线成角度对准，并且在封装的刚性区域上模制。

    PACKAGE FOR HOUSING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
    255.
    发明申请
    PACKAGE FOR HOUSING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE 有权
    住房电子元件和电子设备的包装

    公开(公告)号：US20140368998A1

    公开(公告)日：2014-12-18

    申请号：US14374310

    申请日：2013-01-22

    Applicant: KYOCERA Corporation

    Inventor： Nobuyuki Tanaka ,  Shigenori Takaya

    IPC: H05K7/20 ,  H01L23/04

    CPC classification number: H05K7/2039 ,  H01L23/04 ,  H01L23/047 ,  H01L23/10 ,  H01L23/36 ,  H01L23/4006 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/303 ,  H05K2201/097 ,  H05K2201/10409 ,  H05K2201/10628 ,  H01L2924/00

    Abstract: A package 10 includes a housing 1 in which an electronic component 5 is mounted in a recess 1a having an opening on an upper surface and a screwing section 31 that is fixed on a side face of the housing 1 and extends in a lateral direction. The screwing section 31 includes a thin section 34 which is located on a distal end and is provided with a through hole 36 through which a screw is inserted, a thick section 35 which is located between the thin section 34 and the side face of the housing 1 and has a thickness less than that of the side face of the housing 1 and thicker than that of the thin section 34, and a screw fastening hole 37 which extends in the vertical direction in the thick section 35. Even if the housing 1 has warpage when the package 10 is fixed on the external substrate, heat dissipation from the package to the external substrate can be improved.

    Abstract translation: 包装10包括壳体1，其中电子部件5安装在具有在上表面上的开口的凹部1a中，以及固定在壳体1的侧面上并沿横向延伸的螺纹部31。 螺纹部31包括位于远端的薄部34，并且设置有插入螺钉的通孔36，位于薄部34与壳体的侧面之间的厚壁部35 1，其厚度小于壳体1的侧面的厚度，并且厚度小于薄壁部34的厚度，以及在厚部35中在垂直方向上延伸的螺钉紧固孔37.即使壳体1具有 当包装10固定在外部基板上时，翘曲可以改善从封装到外部基板的散热。

    Coil component and electronic device
    260.
    发明授权
    Coil component and electronic device 有权
    线圈组件和电子设备

    公开(公告)号：US07312682B2

    公开(公告)日：2007-12-25

    申请号：US11434845

    申请日：2006-05-17

    Applicant: Masatoshi Yasuda ,  Shin Kudo ,  Hiroshi Suzuki ,  Katsumi Kobayashi

    Inventor： Masatoshi Yasuda ,  Shin Kudo ,  Hiroshi Suzuki ,  Katsumi Kobayashi

    IPC: H01F5/00

    CPC classification number: H01F17/045 ,  H01F27/027 ,  H01F27/292 ,  H01F27/38 ,  H01F2017/0093 ,  H05K3/321 ,  H05K2201/10628

    Abstract: A coil component comprises a core element having a mounting portion, a coil conductor placed on the core element, and at least two terminal electrodes which are placed in the mounting portion. The mounting portion has at least two terminal placement areas for placing the terminal electrodes respectively. A hollow portion opening to the mounting side face of the mounting portion is formed in an area between the at least two terminal placement areas in the mounting portion. When mounting the coil component on a circuit board, conductive paste is intervened between an area from the terminal electrodes placed in the mounting portion of the core element to the base exposed area of the mounting portion, and the electrode patterns on the circuit board.

    Abstract translation: 线圈部件包括具有安装部分的芯元件，放置在芯元件上的线圈导体和放置在安装部分中的至少两个端子电极。 安装部分具有用于分别放置端子电极的至少两个端子放置区域。 在安装部分的至少两个端子放置区域之间的区域中形成有通向安装部的安装侧面的中空部。 当将线圈部件安装在电路板上时，导电膏介于放置在芯元件的安装部分的端子电极的区域与安装部分的基底暴露区域之间以及电路板上的电极图案之间。

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