公开(公告)号：US20030213553A1

公开(公告)日：2003-11-20

申请号：US10143389

申请日：2002-05-10

Inventor： Roger F. Bernards ,  Joseph Stanton Bowers JR. ,  Benjamin T. Carroll ,  Alvin A. Kucera

IPC: B32B031/00

CPC classification number: B32B38/00 ,  B32B2038/0052 ,  B32B2311/12 ,  B32B2457/08 ,  C23C22/52 ,  C23F1/18 ,  H05K3/282 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389 ,  H05K2201/0239 ,  H05K2203/0796 ,  H05K2203/121 ,  H05K2203/124

Abstract: The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

公开(公告)号：US06589639B2

公开(公告)日：2003-07-08

申请号：US09863961

申请日：2001-05-23

Applicant: Donald S. Farquhar ,  Konstantinos I. Papathomas

Inventor： Donald S. Farquhar ,  Konstantinos I. Papathomas

IPC: B32B300

CPC classification number: H05K1/056 ,  H05K3/445 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/143 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/3154

Abstract: A composition usable in hole filling of a metal layer and to planarize the metal layer is provided. The metal layer is part of a substrate which can be part of a multilayer printed circuit board or chip carrier. The composition comprises a fluoropolymer dielectric metal, a filler material, and a coupling agent, the filler material having at least a partial coating of the coupling agent thereon.

公开(公告)号：US06583834B1

公开(公告)日：2003-06-24

申请号：US09171926

申请日：1998-10-27

Applicant: Kenji Uchiyama

Inventor： Kenji Uchiyama

IPC: G02F11333

CPC classification number: H01L24/29 ,  G02F1/13452 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  H05K3/389 ,  H05K2201/0239 ,  H05K2203/1189 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: In order to provide an adhesive which can enhance adhesiveness on each of adherends even when it is bonded with two adherends composed of different materials, an insulating adhesive material of an adhesive 1 placed between the two adherends is composed of a two-layer structure of a first insulating adhesive material 4 adhered with one adherend, and a second insulating adhesive material 5 adhered with the other adherend. Each of the adhesives 4 and 5 is caused to have proper adhesive properties suitable for the adherend to be bonded with by, for example, adding different kinds of coupling agents. By this construction, the adhesion forces of the adhesives 4 and 5 on each adherend can respectively be enhanced, and the adhesion forces of the anisotropically electrically conductive adhesive can be improved as compared with adhesive comprising a conventional single insulating adhesive material.

Abstract translation: 为了提供能够增强各被粘物的粘合性的粘合剂，即使在与两种不同材料构成的被粘物结合的情况下，粘合剂1的绝缘性粘合剂材料由两个被粘物的两层结构构成， 粘附有一个被粘物的第一绝缘粘合剂材料4和与另一个被粘物粘附的第二绝缘粘合剂材料5。 通过例如添加不同种类的偶联剂，使粘合剂4和5各自具有适合粘合剂的适当的粘合性。 通过这种结构，粘合剂4和5在每个被粘物上的粘合力可以分别提高，并且与各种传统的单一绝缘粘合剂材料的粘合剂相比，可以提高各向异性导电粘合剂的粘附力。

公开(公告)号：US20020131248A1

公开(公告)日：2002-09-19

申请号：US09986453

申请日：2001-11-08

Inventor： Shinobu Kokufu ,  Takeshi Suzuki ,  Fumio Echigo ,  Daizo Andoh ,  Tatsuo Ogawa ,  Yoshihiro Kawakita ,  Satoru Tomekawa

IPC: H05K001/00

CPC classification number: H05K3/4069 ,  H05K3/282 ,  H05K3/389 ,  H05K3/4614 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49171 ,  Y10T428/24917

Abstract: A protective agent 6 for protecting a wiring 1 is dispersed and placed in mottle-like on an interface between a via 3 and a wiring layer 2. Then, each dimension of interface regions 7 where the protective agent 6 does not exist is set to such a size that a plurality of conductive powders 4 constituting the via 3 can abutted on the wiring layer 2. Therefore, the plurality of conductive powders 4 and the wiring layer 2 are abutted each other in each interface region 7 where the protective agent 6 does not exist to electrically connect, thereby stabilizing the connection resistance for a prolonged period of time.

Abstract translation: 用于保护布线1的保护剂6在通孔3和布线层2之间的界面上分散并放置成斑驳状。然后，将不存在保护剂6的界面区域7的每个尺寸设定为 构成通孔3的多个导电粉末4可以与布线层2抵接的尺寸。因此，在保护剂6不是的各界面区域7中，多个导电粉末4和布线层2彼此抵接 存在电连接，从而稳定连接电阻长时间。

公开(公告)号：US06419981B1

公开(公告)日：2002-07-16

申请号：US09620524

申请日：2000-07-20

Applicant: Bruce E. Novich ,  Kami Lammon-Hilinski ,  Walter J. Robertson ,  Xiang Wu ,  Vedagiri Velpari ,  Ernest L. Lawton ,  William B. Rice

Inventor： Bruce E. Novich ,  Kami Lammon-Hilinski ,  Walter J. Robertson ,  Xiang Wu ,  Vedagiri Velpari ,  Ernest L. Lawton ,  William B. Rice

IPC: B05D302

CPC classification number: B05D3/02 ,  C03C25/00 ,  C03C25/10 ,  C03C25/26 ,  C03C25/28 ,  C03C25/32 ,  C03C25/42 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: Methods for inhibiting abrasive wear of a fiber strand comprising at least one glass fiber by sliding contact with surface asperities of a solid object, comprising (a) applying a composition to at least a portion of a surface of at least one glass fiber of a glass fiber strand; (b) at least partially drying the composition to form a sized glass fiber strand having a residue of the composition upon at least a portion of the surface of the at least one class fiber; and (c) sliding at least a portion of the glass fiber strand to contact surface asperities of a solid object, the surface asperities having a hardness value which is greater than a hardness value of the at least one glass fiber, such that abrasive wear of the at least one glass fiber of the glass fiber strand by contact with the surface asperities of the solid object is inhibited by the inorganic solid lubricant particles.

Abstract translation: 通过与固体物体的表面粗糙度滑动接触来抑制包含至少一种玻璃纤维的纤维束的磨损磨损的方法，包括（a）将组合物施加到玻璃的至少一个玻璃纤维的至少一部分表面上 纤维束; （b）至少部分地干燥所述组合物以在所述至少一种类纤维的表面的至少一部分上形成具有所述组合物残基的尺寸的玻璃纤维线; 和（c）将所述玻璃纤维线的至少一部分滑动以接触固体物体的粗糙度，所述表面粗糙度的硬度值大于所述至少一种玻璃纤维的硬度值，使得所述玻璃纤维线的磨损 通过与固体物体的表面粗糙度接触的玻璃纤维线束的至少一个玻璃纤维被无机固体润滑剂颗粒抑制。

公开(公告)号：US20020084441A1

公开(公告)日：2002-07-04

申请号：US10028955

申请日：2001-12-18

Inventor： Roger Bernards ,  Hector Gonzalez ,  Al Kucera ,  Mike Schanhaar

IPC: C09K013/00

CPC classification number: C23C22/68 ,  C23C22/52 ,  C23C2222/20 ,  C23F1/18 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389 ,  H05K3/4611 ,  H05K2201/0239 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K2203/124

Abstract: The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition consisting essentially of an oxidizer, a pH adjuster, a topography modifier, and a uniformity enhancer. A coating promoter may be used in place of the uniformity enhancer or in addition to the uniformity enhancer. The adhesion promoting composition does not require a surfactant. The process may further comprise the step of contacting the uniform roughened copper surface with a post-dip, wherein the post-dip comprises an azole or silane compound or a combination of said azole and said silane. The post-dip may further comprise, alone or in combination, a titanate, zirconate, and an aluminate. The pH adjuster is preferably sulfuric acid and the oxidizer is preferably hydrogen peroxide. A hydrogen peroxide stabilizer may be used in the adhesion promoting composition.

Abstract translation: 本发明涉及一种用于提供适于随后的多层层压的粗糙化铜表面的方法和组合物。 在有效提供粗糙化铜表面的条件下，光滑的铜表面与增粘组合物接触，该粘附促进组合物基本上由氧化剂，pH调节剂，形貌改性剂和均匀性增强剂组成。 可以使用涂层促进剂来代替均匀性增强剂，或者除了均匀性增强剂之外。 粘合促进组合物不需要表面活性剂。 该方法还可以包括使均匀的粗糙化铜表面与浸渍后接触的步骤，其中后浸渍包括唑或硅烷化合物或所述唑和所述硅烷的组合。 后浸渍可以单独地或组合地包含钛酸盐，锆酸盐和铝酸盐。 pH调节剂优选为硫酸，氧化剂优选为过氧化氢。 在粘合促进组合物中可以使用过氧化氢稳定剂。

公开(公告)号：US06280839B1

公开(公告)日：2001-08-28

申请号：US09316205

申请日：1999-05-21

Applicant: Neil Brown ,  Michael Aggleton

Inventor： Neil Brown ,  Michael Aggleton

IPC: B32B516

CPC classification number: B32B27/18 ,  B32B5/28 ,  C01F7/021 ,  C01P2004/51 ,  C01P2004/61 ,  C01P2006/12 ,  C01P2006/19 ,  C01P2006/32 ,  C09C1/407 ,  C09K21/02 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/2995

Abstract: A nonhygroscopic thermally stable aluminum hydroxide, which is particularly useful for the preparation of thermally stable and fire retardant laminates for printed circuit boards.

Abstract translation: 非吸湿热稳定型氢氧化铝，其特别可用于制备用于印刷电路板的热稳定和阻燃层压材料。

公开(公告)号：US06172139B2

公开(公告)日：2001-01-09

申请号：US08146981

申请日：1993-11-02

Applicant: Gwo S. Swei ,  David J. Arthur

Inventor： Gwo S. Swei ,  David J. Arthur

IPC: C08J305

CPC classification number: C08J9/26 ,  B29C41/28 ,  B29D7/01 ,  B29K2027/18 ,  B29K2105/04 ,  B29K2105/16 ,  B29K2995/0006 ,  C08J3/005 ,  C08J3/215 ,  C08J2327/12 ,  H05K1/034 ,  H05K1/0373 ,  H05K1/056 ,  H05K3/386 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239 ,  Y02P20/582

Abstract: A method for making a particulate filled polymeric matrix composite film includes mixing a polymeric matrix material with a dispersion of particulate filler in a carrier liquid to form a casting composition and adjusting the viscosity of the casting composition to retard separation of the particulate filler from the composition. A layer of the viscosity-adjusted casting composition is cast on a substrate and the layer is consolidated to form the particulate filled polymer matrix composite film. Films made by the method include very thin, e.g less than 1.0 mil, fluoropolymeric matrix films highly filled with very small diameter, preferably spherical, particles for use as, e.g. dielectric substrate materials in laminar electrical circuits.

Abstract translation: 制备颗粒填充的聚合物基质复合膜的方法包括将聚合物基体材料与颗粒填料的分散体混合在载体液体中以形成流延组合物并调节流延组合物的粘度以阻止颗粒填料与组合物的分离 。 将粘度调节的浇铸组合物的一层浇铸在基材上，并将该层固结以形成填充颗粒的聚合物基质复合膜。 通过该方法制备的膜包括非常薄的，例如小于1.0密耳的高度填充有非常小直径，优选球形的颗粒的含氟聚合物基质膜，用于例如， 层状电路中的电介质基片材料。

公开(公告)号：US5629098A

公开(公告)日：1997-05-13

申请号：US549197

申请日：1995-10-27

Applicant: Charles A. Poutasse ,  Katherine V. Sack ,  Andrea M. Kovacs ,  James R. Winchester

Inventor： Charles A. Poutasse ,  Katherine V. Sack ,  Andrea M. Kovacs ,  James R. Winchester

IPC: C08L63/00 ,  C08G59/18 ,  C08G59/20 ,  C09J7/02 ,  C09J163/00 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38 ,  B32B17/06 ,  B32B15/20

CPC classification number: H05K3/384 ,  C08G59/18 ,  C09J163/00 ,  H05K3/386 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0315 ,  H05K2203/0723 ,  H05K3/022 ,  H05K3/385 ,  H05K3/389 ,  Y10T428/12076 ,  Y10T428/12181 ,  Y10T428/12347 ,  Y10T428/12493 ,  Y10T428/12569 ,  Y10T428/12681 ,  Y10T428/12687 ,  Y10T428/12694 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31678

Abstract: This invention relates to an adhesive composition, comprising: (A) at least one multifunctional epoxy; and (B) the composition derived from (B-1) at least one difunctional epoxy resin and (B-2) at least one compound represented by the formulaR--(G).sub.n (1)wherein in Formula (I): R is an aromatic, alicyclic or heterocyclic group; G is a functional group selected from the group consisting of COOH, OH, SH, NH.sub.2, NHR.sup.1, (NHC(.dbd.NH)).sub.m NH.sub.2, R.sup.2 COOH, R.sup.2 OH, R.sup.2 SH, R.sup.2 NH.sub.2 and R.sup.2 NHR.sup.1, wherein R.sup.1 is a hydrocarbon group, R.sup.2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; and n is a number ranging from 3 up to the number of displaceable hydrogens on R; with the proviso that when at least one G is NH.sub.2 or R.sup.2 NH.sub.2, n is a number ranging from 2 up to the number of displaceable hydrogens on R, and when at least one G is (NHC(.dbd.NH)).sub.m NH.sub.2, n is a number ranging from 1 up to the number of displaceable hydrogens on R. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.

Abstract translation: 本发明涉及粘合剂组合物，其包含：（A）至少一种多官能环氧基; 和（B）衍生自（B-1）至少一种双官能环氧树脂的组合物和（B-2）至少一种由式R-（G）n（1）表示的化合物，其中在式（I）中：R 是芳族，脂环族或杂环基; G是选自COOH，OH，SH，NH2，NHR1，（NHC（= NH））mNH2，R2COOH，R2OH，R2SH，R2NH2和R2NHR1的官能团，其中R1是烃基，R2是 亚烷基或亚烷基，m是1至约4的数; 并且n是从3到R上的可置换氢的数目的数字; 条件是当至少一个G是NH 2或R 2 NH 2时，n是在R上的可移动氢数2之间的数目，当至少一个G是（NHC（= NH））m NH 2时，n是 数目范围从1到可位移氢数R上。本发明还涉及具有粘附到其至少一侧的上述粘合剂组合物的铜箔以增强所述箔和电介质基底之间的粘附。 本发明还涉及包含铜箔，电介质基底和包含上述粘合剂组合物的粘合促进层的层压体，所述粘合剂组合物设置在箔和衬底之间并粘附到箔和衬底上。

公开(公告)号：US5591285A

公开(公告)日：1997-01-07

申请号：US475670

申请日：1995-07-24

Applicant: Ali Afzali-Ardakani ,  Juan Ayala-Esquilin ,  Bodil E. Braren ,  Shahrokh Daijavad ,  Elizabeth Foster ,  James L. Hedrick, Jr. ,  Jeffrey C. Hedrick ,  Rodney T. Hodgson ,  Ashit A. Mehta ,  Steven E. Molis ,  Jane M. Shaw ,  Stephen L. Tisdale ,  Alfred Viehbeck

Inventor： Ali Afzali-Ardakani ,  Juan Ayala-Esquilin ,  Bodil E. Braren ,  Shahrokh Daijavad ,  Elizabeth Foster ,  James L. Hedrick, Jr. ,  Jeffrey C. Hedrick ,  Rodney T. Hodgson ,  Ashit A. Mehta ,  Steven E. Molis ,  Jane M. Shaw ,  Stephen L. Tisdale ,  Alfred Viehbeck

IPC: C08J7/00 ,  C08K3/04 ,  C08K9/02 ,  H01B3/30 ,  H01L21/312 ,  H05K1/03 ,  H05K3/10 ,  B32B31/28 ,  B32B27/16

CPC classification number: H05K1/0373 ,  C08K3/04 ,  C08K9/02 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0239 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K3/105 ,  Y10T428/31544

Abstract: Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.The composite can be made conductive by irradiating it with an UV excimer laser.

Abstract translation: 公开了包含分散在聚合物中的氟化颗粒碳的复合物的结构，氟化碳的存在量足以降低组合物的介电常数，该结构还包括电导体图案。 可以通过用UV准分子激光器照射该复合材料来导电。