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公开(公告)号:AU2002305531B2
公开(公告)日:2006-12-07
申请号:AU2002305531
申请日:2002-05-09
Applicant: MICROCOATING TECHNOLOGIES INC
Inventor: HUNT ANDREW TYE , KIESLING DAVID , ALLEN MARK G
IPC: H01G4/005 , H01G4/012 , H01G4/06 , H01G4/228 , H01G4/255 , H01G4/38 , H01G7/06 , H01L21/02 , H01L23/522 , H01L27/08
Abstract: Capacitor material for use in forming capacitors, is disclosed. More specifically, the invention is directed to capacitors formed from this material that have one or more discrete electrodes ( 314 ), each electrode ( 314 ) being exposed to at least two thicknesses of dielectric material ( 300 ). These electrodes ( 314 ) are surrounded by wider insulative material ( 312 ) such that the material can be cut, or patterned into capacitors having specific values. A single electrode can form a small value capacitor while still providing a larger conductive area for attaching the capacitor to associated circuitry. The thin dielectric ( 310 ) can be a tunable material so that the capacitance can be varied with voltage. The tunability can be increased by adding thin electrodes that interact with direct current.
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公开(公告)号:CA2296505C
公开(公告)日:2005-02-22
申请号:CA2296505
申请日:1999-05-13
Applicant: MICROCOATING TECHNOLOGIES INC
Inventor: THOMAS JOSEPH R , SHAO HONG , HENDRICK MICHELLE R , HUNT ANDREW TYE , HWANG TZYY JIUAN
Abstract: A corrosion-resistant coating for a substrate is described. The corrosion- resistant coating comprises a first distinct layer of a first composition disposed over the substrate, wherein the first distinct layer ha s a thickness that is not greater than about 10 microns, and a second distinct layer of a second composition disposed over the first distin ct layer, wherein the second distinct layer has a thickness that is not greater than about 10 microns an d either the first distinct layer or the second distinct layer is corrosion-resistant. Preferably, the thickness of each distinct layer is less than about 1 or 2 microns, more preferably, less than about 0.4 microns. The coating may comprise additional layers. Corrosion-resistant articles, methods of protecting articles, and methods of depositing corrosion-resistant coatings are also described.
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公开(公告)号:IL156217A
公开(公告)日:2004-12-15
申请号:IL15621799
申请日:1999-04-18
Applicant: MORTON INT INC , MICROCOATING TECHNOLOGIES INC
Inventor: HUNT ANDREW T , HWANG TZYY JIUAN , HONG SHAO , THOMAS JOE , LIN WEN-YI , SHOUP SHARA S , LUTEN HENRY A , MCENTYRE JOHN ERIC , CARPENTER RICHARD W , BOTTOMLEY STEPHEN E , HENDRIK MICHELLE
IPC: C23C20060101 , C23C16/40 , H01L1/20
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公开(公告)号:IL129493A
公开(公告)日:2004-12-15
申请号:IL12949399
申请日:1999-04-18
Applicant: MORTON INT INC , MICROCOATING TECHNOLOGIES INC
Inventor: HUNT ANDREW T , HWANG TZYY JIUAN , HONG SHAO , THOMAS JOE , LIN WEN-YI , SHOUP SHARA S , LUTTEN HENRY A , MCENTYRE JOHN ERIC , CARPENTER RICHARD W , BOTTOMLEY STEPHEN E , HENDRICK MICHELLE
IPC: C23C16/40 , C23C16/453 , H01C7/00 , H01C17/20 , H01C17/24 , H01L21/02 , H05K1/16 , H05K3/06 , H01L1/102
Abstract: The invention is directed to thin film resistors which may be embedded in multi-layer printed circuit boards. The invention is also directed to structures for forming such thin film resistors and to methods for forming such structures, including the use of combustion chemical vapor deposition. The invention is also directed to chemical precursor solutions by which resistive materials can be deposited on a substrate by combustion chemical vapor deposition techniques.
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公开(公告)号:AU771864B2
公开(公告)日:2004-04-01
申请号:AU2740201
申请日:2000-12-21
Applicant: MICROCOATING TECHNOLOGIES INC
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公开(公告)号:GB2392781A
公开(公告)日:2004-03-10
申请号:GB0324079
申请日:2002-04-09
Applicant: MICROCOATING TECHNOLOGIES INC
Inventor: HUNT ANDREW TYE , FAGUY PETER W , OLJACA MIODRAG , FLANAGAN SCOTT , DESHPANDE GIRISH , LEE STEIN
Abstract: A method for treating diverse pulp and paper materials, including such products contained in municipal solid waste and biohazardous wastes, to produce a homogenous cellulosic product comprises the steps of feeding diverse pulp and paper materials into a vessel, introducing steam into the vessel while agitating the materials, purging the gases from the vessel while agitating the materials, sealing the vessel so that the vessel is pressure tight, saturating the materials with steam at sufficient temperature and pressure to expand the physical and chemical structure of the materials, while agitating the materials, depressurizing the vessel to further enhance the physical and chemical expansion of the materials, and discharging the processed products. Alternatively, the method can be performed without purging the gases, if the temperature in the range of about 140{C to about 160{C, and the pressure is in the range of about 275 to 450 kPa. During the optional purging step, during the depressurization step, and during the optional evacuation step, volatile organic compounds and other air pollutants can be captured and treated. The temperature, pressure, and process time is more than sufficient to decontaminate and sterilize biohazardous laboratory and medical wastes.
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公开(公告)号:IL156217D0
公开(公告)日:2003-12-23
申请号:IL15621703
申请日:2003-05-29
Applicant: MORTON INT INC , MICROCOATING TECHNOLOGIES INC
IPC: C23C20060101 , C23C16/40 , C23C
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公开(公告)号:AU2002307213A1
公开(公告)日:2003-10-27
申请号:AU2002307213
申请日:2002-04-09
Applicant: MICROCOATING TECHNOLOGIES INC
Inventor: DESHPANDE GIRISH , LEE STEIN , HUNT ANDREW TYE , FAGUY PETER W , OLJACA MIODRAG , FLANAGAN SCOTT
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公开(公告)号:CA2267492C
公开(公告)日:2003-09-23
申请号:CA2267492
申请日:1999-03-29
Applicant: MORTON INT INC , MICROCOATING TECHNOLOGIES INC
Inventor: LIN WEN-YI , SHOUP SHARA S , THOMAS JOE , HENDRICK MICHELLE , HUNT ANDREW T , HWANG TZYY JIUAN , SHAO HONG , LUTEN HENRY A , BOTTOMLEY STEPHEN E , CARPENTER RICHARD W , MCENTYRE JOHN ERIC
IPC: C23C16/40 , C23C16/453 , H01C7/00 , H01C17/20 , H01C17/24 , H01L21/02 , H05K1/16 , H05K3/06 , H01C17/075
Abstract: The invention is directed to thin film resistors which may be embedded in multi-layer printed circuit boards. The invention is also directed to structures for forming such thin film resistors and to methods for forming such structures, including the use of combustion chemical vapor deposition. The invention is also directed to chemical precursor solutions by which resistive materials can be deposited on a substrate by combustion chemical vapor deposition techniques.
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公开(公告)号:CA2269862C
公开(公告)日:2003-09-16
申请号:CA2269862
申请日:1999-04-26
Applicant: MICROCOATING TECHNOLOGIES INC
Inventor: DANIELSON WILLIAM D , LUTEN HENRY A , HUNT ANDREW T , SHANMUGHAM SUBRAMANIAM , DESHPANDE GIRISH , HWANG TZYY JIUAN
IPC: C23C16/44 , B05D1/08 , C23C16/14 , C23C16/18 , C23C16/30 , C23C16/34 , C23C16/36 , C23C16/40 , C23C16/448 , C23C16/453 , C23C16/455 , C23C16/50
Abstract: An improved chemical vapor deposition apparatus and procedure is disclosed. The technique provides improved shielding of the reaction and deposition zones involved in providing CVD coatings, whereby coatings can be produced, at atmospheric pressure, of materials which are sensitive to components in the atmosphere on substrates which are sensitive to high temperatures and which are too large, or inconvenient, to process in vacuum or similar chambers. The improved technique can be used with various energy sources and is particularly compatible with Combustion Chemical Vapor Deposition (CCVD) techniques.
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