Abstract:
A manufacturing method of a nano structure using self-assembled block copolymer is provided to easily form a nano structure on a metal surface. A manufacturing method of a nano structure using self-assembled block copolymer comprises the following steps: a step for forming a metal thin film on a substrate(a); a step for treating a surface of the metal thin film using oxygen plasma(b); a step for neutralizing the surface of the metal thin film(c); a step for coating a block copolymer on the surface(d); and a step for forming a self-assembled nano structure by annealing and exposing the block copolymer(e).
Abstract:
본 발명은 고유전율 박막에 주입되는 질소의 위치와 양을 조절함으로써 고유전율 박막의 재현성과 열화에 대한 저항성을 높인 것으로, 특히 계면을 제외한 부분에 대한 질소처리와 질소처리시의 함량의 조절을 통해 박막의 신뢰성을 최적화시킨 것을 특징으로 한다. 본 발명은 MOSFET, 메모리 소자, TFT, 캐패시터 등에 모두 적용될 수 있으며 박막의 신뢰성과 계면특성을 향상시킬 수 있다. 고유전율 박막, 신뢰성
Abstract:
A high dielectric thin film and a method of forming the same are provided to increase the reliability of a thin film by adjusting the position of dopants. A method of forming a high dielectric thin film on a substrate through a deposition process includes: implanting a metal precursor and material oxidizing metal to form a thin film; implanting the material oxidizing metal to form a thin film including the metal precursor and the dopant. A position or thickness profile of the thin film including dopants are adjusted to change characteristics of a device. Metal included in the metal precursor is at least one selected from the group consisting of hafnium(Hf), zirconium(Zr), aluminum(Al), tantalum(Ta), titanium(Ti), strontium(Sr), lanthanium(La), barium(Ba), lead(Pb), chronium(Cr), molybdenum(Mo), tungsten(W), yttrium(Y), and manganese(Mn).
Abstract:
PURPOSE: A method for forming the contacts of semiconductor devices using a selective deposition method is provided to selectively deposit metal thin films by utilizing an atomic layer deposition method and a self-assembled monomolecular film. CONSTITUTION: The surface of a spacer is modified by applying a self-assembled monomolecular film on a semiconductor device. The self-assembled monomolecular film is based on octadecyltrichlorosilane. A metal thin film is formed around the modified surface of the spacer through an atomic layer deposition method. The metal thin film is thermally treated in order to form silicide. The self-assembled monomolecular film is then eliminated.
Abstract:
PURPOSE: A method of manufacturing a structure for light source and a method of manufacturing a light source using the same are provided to reduce the thickness and power consumption by applying nanostructure of uniform and aligned light emitting material to a light emitting device. CONSTITUTION: A metal layer is formed on the top of a substrate on which an oxide layer is formed(1). A nanotemplate formed with the nano pattern is formed on the metal layer. The nano pattern is transferred to the metal layer by etching the metal layer. The nanotemplate is removed. A nano structure is formed by growing the light emitting material in a space of the oxide layer. The metal layer and the nanostructure are separated from the substrate by eliminating the oxide layer.
Abstract:
PURPOSE: A manufacturing method of a silicon-germanium nanodot and a semiconductor device thereof are provided to manufacture a large area silicon-germanium nanodot by forming a nanowire using a nano template. CONSTITUTION: A nano template forming a nano hole on a silicon substrate is manufactured. A resistant layer is removed by etching the nano template hole floor. A silicon-germanium is selectively epitaxial-grown from the floor of the nano template hole. The nano template is removed. The epitaxial-growth of the silicon-germanium is operated by the chemical vapor deposition method.
Abstract:
PURPOSE: A method for controlling electron carrier concentration in an oxide semiconductor or a conductor by ultraviolet ray treatment are provided to form a plurality of point defects controlling the carrier concentration inside a thin film by projecting an ultraviolet on a thin film or a device having thin film therein. CONSTITUTION: An objects requiring for control an electrical property is installed to a vacuum container(S101). Gases inside the vacuum container are discharged to maintain the vacuum container a predetermined degree of vacuum. The ultraviolet ray is projected on the surface of the object in a predetermined degree of vacuum(S103). The electrical characteristic is estimated to check whether the object has a desired property(S104). If the object does not have a desired resistance and carrier concentration, the steps(S101~S103) is performed again.
Abstract:
본 발명은 나노 막대의 제조방법에 관한 것으로, 특히 촉매를 사용하지 않으며 단순한 공정을 통해 금속 나노 막대를 제조할 수 있는 방법을 제공하는 것을 목적으로 한다. 상기 목적을 달성하기 위해 본 발명은 플라스마 원자층 증착법에 사용되는 반응가스의 조절을 통해 자기 조립 나노 막대를 형성하는 방법을 제공한다. 본 발명의 실시예에서는 코발트 전구체로 CoCp 2 를 사용하고, 퍼징가스로 아르곤 가스, 그리고 반응가스로 암모니아와 모노실란의 혼합가스의 플라스마를 사용하여 직경 약 10 nm 내외, 길이 50 ~ 60 nm의 나노 막대를 형성하였다. 자기 조립 나노 막대, 플라스마 원자층 증착 방법, 반응 가스의 조절, 금속 나노 막대
Abstract:
A manufacturing method of nanostructures using anodized aluminum and atomic layer deposition process is provided to form nanostructures using various materials and to obtain easily the nanostructures of the various shapes and structures. A manufacturing method of nanostructures comprises steps of: (a) injecting a substrate in an acid solution, anodizing aluminium on the substrate and forming an aluminium oxide nano template having a hole of a nano-size in the substrate; (b) filling up the hole formed in the nano template using an atomic layer deposition method; (c) removing a resistant layer formed in the nano template through an etching process; and (d) removing aluminium oxide.