Abstract:
정류다이오드및 그제조방법을제공한다. 이러한정류다이오드는절연체물질을포함하는절연체층및 상기절연체층상에위치하고, n형 ZnO 계열산화물반도체를포함하는반도체층을포함하고, 상기절연체층과상기반도체층사이에서정류특성을갖는것을특징으로한다. 따라서, 향상된전기적특성을갖는정류다이오드를제공할수 있다. 또한, 기존산화물다이오드와비교하였을때 많은제약을받는 P-type 산화물반도체를절연체층으로대체함에따라, 재료선택의폭이보다넓어질수 있다. 따라서, 전기적특성변화의조절범위또한넓힐수 있다.
Abstract:
본 발명은 소스전극 및 드레인전극과; 상기 소스전극 및 드레인전극과 접촉하는 산화물반도체층과; 상기 산화물반도체층 상에 형성된 게이트절연막과; 상기 게이트절연막 상에 형성된 게이트전극과; 상기 드레인전극과 연결되는 포토다이오드를 포함하는 이미지센서를 제공한다.
Abstract:
본 발명은 게이트전극 상에 형성된 산화물반도체층과; 상기 산화물반도체층의 채널영역의 표면에 형성된 산화막과; 상기 산화물반도체층 상에, 상기 채널영역을 사이에 두고 이격된 소스전극 및 드레인전극과; 상기 소스전극 및 드레인전극 상에, 상기 산화막을 덮는 식각방지막과; 상기 드레인전극과 연결되는 포토다이오드를 포함하는 이미지센서를 제공한다.
Abstract:
본 발명은 간단한 공정으로 제작이 가능하면서 멀티 비트가 명확히 구현되는 멀티 비트 비휘발성 메모리 소자에 관한 것이다. 본 발명에 따른 멀티 비트 비휘발성 메모리 소자는 기판 상에 터널링 절연층, 전하 트랩층, 컨트롤 절연층 및 게이트 전극이 적층되어 형성된다. 그리고 터널링 절연층 및 컨트롤 절연층 중 적어도 하나의 절연층은 일부분이 나머지 부분과 서로 다른 두께를 갖도록 형성된다.
Abstract:
PURPOSE: A manufacturing method of a thin film transistor is provided to inexpensively improve the electrical property of a thin film transistor by executing an ultraviolet irradiation process instead of a thermal processing process in an oxide semiconductor active layer. CONSTITUTION: A gate electrode(110) is formed on a substrate(100). A gate insulating layer(120) is formed on the substrate. A semiconductor active layer(130) is formed on the gate insulating layer. An ultraviolet ray is irradiated onto the semiconductor active layer. A source/drain electrode is formed on the semiconductor active layer.
Abstract:
PURPOSE: A method for crystallizing an amorphous thin film and a wiring structure for performing the same is provided to offer an uniform electric current density flowing in all amorphous thin films arranged in the form of the matrix by improving the wiring structure for the crystallization of the FALC(Field Aided Lateral Crystallization) process. CONSTITUTION: A basic unit(600) can extend from a first unit arranged in the matrix type of 2 x 2 to a n-th unit arranged in the matrix type of 2 n(N is the natural number more than 2). A basic unit comprises a cell(610) including the amorphous thin film arranged in the matrix type of 2 x 2. The basic unit comprises a (+) cell electrode(620) connecting one side of the cell arranged in each heat of 2 of 2 and a (-) cell electrode(630) connecting the other side of the cell arranged in each heat of 2 of 2. Also, the basic unit includes a (+) connecting electrode(640) connecting two (+) cell electrodes and a (-) connecting electrode(650) connecting two (-) cell electrodes.
Abstract:
A method for crystallizing channel region for poly-Si TFT array substrate fabrication using FALC process is provided to apply poly-Si TFT-LCD, and OLED by regulating crystallization rate of each TFT element. A plurality of thin film transistor elements in which the channel region is made of the amorphous silicon prepares TFT array substrate which is arranged to row and column. A common source electrode spreading along the arrangement direction of row right and left is formed. A common drain electrode which is spread along the parallel to common source electrode direction by connecting one of drain electrode end which are formed each row. A second voltage applying terminal is formed on the right side terminal between the common drain electrodes.
Abstract:
A method of manufacturing p-type ZnO using pulsed rapid thermal annealing is provided to easily convert an n-type ZnO film into a p-type ZnO film at a low temperature. N-type zinc oxide is deposited on a substrate to form a ZnO film, and then the n-type ZnO film is doped with p-type dopant element. The ZnO film doped with the dopant element is subjected to heat treatment by repeatedly applying heat having a peak temperature between 500 and 1000 deg.C while a base temperature is maintained in a range of 0 to 500 deg.C. The heat treatment is repeatedly performed by applying the base temperature during several seconds to several times and the peak temperature during several seconds to several minutes.
Abstract:
A preparation method of high conductive ZnO by pulsed rapid thermal annealing is provided to prepare ZnO which has high conductivity and can be used on an inexpensive substrate having a low melting point. A preparation method of high conductive ZnO comprises the steps of: forming a ZnO-based thin film on a glass substrate; doping a donor-forming element onto the ZnO-based thin film; and subjecting the ZnO-based thin film to thermal annealing by repeatedly increasing temperature of the substrate to a peak temperature ranging from 500 to 1000 deg.C while maintaining a substrate on which the ZnO-based thin film is formed to a base temperature. The step of forming the ZnO-based thin film and the step of doping the ZnO-based thin film with the donor-forming element are carried out simultaneously. The donor-forming element is a group III element selected from aluminum(Al), gallium(Ga), indium(In) and boron(B) that are group III elements in the periodic table in the elements.