公开(公告)号：DE102006023123B4

公开(公告)日：2011-01-13

申请号：DE102006023123

申请日：2006-05-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  SIMBUERGER WERNER ,  KIENMAYER CHRISTOPH ,  PRESSEL KLAUS

IPC: H01L25/04 ,  B60R16/02 ,  G01S7/03 ,  H01L23/36 ,  H01L23/498 ,  H01L23/66 ,  H01L49/02 ,  H01P3/08 ,  H01P11/00 ,  H01Q1/38

公开(公告)号：DE102009039226A1

公开(公告)日：2010-04-15

申请号：DE102009039226

申请日：2009-08-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PRESSEL KLAUS ,  BEER GOTTFRIED

IPC: H01L21/50 ,  H01L21/78

Abstract: A method of manufacturing a stacked die module includes applying a plurality of stacked die structures to a carrier. Each stacked die structure includes a first semiconductor die applied to the carrier and a second semiconductor die stacked over the first semiconductor die. The second semiconductor die has a larger lateral surface area than the first semiconductor die. A dam is applied around each of the stacked die structures, thereby forming an enclosed cavity for each of the stacked die structures. The enclosed cavity for each stacked die structure surrounds the first semiconductor die of the stacked die structure.

公开(公告)号：DE102006028718B4

公开(公告)日：2008-11-13

申请号：DE102006028718

申请日：2006-06-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PRESSEL KLAUS ,  KOLLER ADOLF ,  THEUSS HORST

IPC: H01L21/301

公开(公告)号：DE10359424B4

公开(公告)日：2007-08-02

申请号：DE10359424

申请日：2003-12-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAIMERL ALFRED ,  BEER GOTTFRIED ,  DANGELMAIER JOCHEN ,  MUELLER KLAUS ,  PRESSEL KLAUS ,  MENGEL MANFRED

IPC: H01L23/50 ,  B82B1/00 ,  H01L21/60 ,  H01L23/498 ,  H01R13/60

Abstract: The present invention describes a rewiring plate for components with connection grids of between approx. 100 nm and 10 mum, which rewiring plate includes a base body and passages with carbon nanotubes, the lower end of the passages opening out into contact connection surfaces, and the carbon nanotubes forming an electrically conductive connection from the contact connection surfaces to the front surface of the base body.

公开(公告)号：DE102004035368A1

公开(公告)日：2006-02-16

申请号：DE102004035368

申请日：2004-07-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAIMERL ALFRED ,  BEER GOTTFRIED ,  DANGELMAIER JOCHEN ,  MUELLER KLAUS ,  PRESSEL KLAUS ,  MENGEL MANFRED

IPC: B82B1/00 ,  B82B3/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01L23/50

Abstract: A substrate including strip conductors with a wiring pattern that connects contact areas to one another. The strip conductors have a small strip conductor width. The contact areas and/or the strip conductors form a narrow connection pitch and include electrically conductive carbon nanotubes.