-
公开(公告)号:DE102004052868A1
公开(公告)日:2006-05-11
申请号:DE102004052868
申请日:2004-11-02
Applicant: INFINEON TECHNOLOGIES AG
Inventor: STREIBL MARTIN , TIEBOUT MARC , KIENMAYER CHRISTOPH , HODEL UWE , BENETIK THOMAS
Abstract: Integrated circuit arrangement having first and second signal input pads, to which a differential input signal is applied, and first and second signal outputs, at which a differential output signal is provided. The first signal output is coupled to the first signal input pad and the second signal output is coupled to the second signal input pad. A first capacitance is between the first and second signal input pads. First and second inductances are connected in series, are between the first and second signal input pads, and are connected in parallel with the first capacitance. A first terminal is at a first supply potential and a second terminal is at a second supply potential. A first electrostatic discharge element is between the first and second terminals. A second electrostatic discharge element is between the first terminal, on the one hand, and the first and second inductances, on the other hand.
-
公开(公告)号:DE102006023123B4
公开(公告)日:2011-01-13
申请号:DE102006023123
申请日:2006-05-16
Applicant: INFINEON TECHNOLOGIES AG
Inventor: BEER GOTTFRIED , SIMBUERGER WERNER , KIENMAYER CHRISTOPH , PRESSEL KLAUS
-
公开(公告)号:DE102004052868B4
公开(公告)日:2007-02-08
申请号:DE102004052868
申请日:2004-11-02
Applicant: INFINEON TECHNOLOGIES AG
Inventor: STREIBL MARTIN , TIEBOUT MARC , KIENMAYER CHRISTOPH , HODEL UWE , BENETIK THOMAS
Abstract: Integrated circuit arrangement having first and second signal input pads, to which a differential input signal is applied, and first and second signal outputs, at which a differential output signal is provided. The first signal output is coupled to the first signal input pad and the second signal output is coupled to the second signal input pad. A first capacitance is between the first and second signal input pads. First and second inductances are connected in series, are between the first and second signal input pads, and are connected in parallel with the first capacitance. A first terminal is at a first supply potential and a second terminal is at a second supply potential. A first electrostatic discharge element is between the first and second terminals. A second electrostatic discharge element is between the first terminal, on the one hand, and the first and second inductances, on the other hand.
-
公开(公告)号:DE10239824A1
公开(公告)日:2004-03-18
申请号:DE10239824
申请日:2002-08-29
Applicant: INFINEON TECHNOLOGIES AG
Inventor: KEHRER DANIEL , WOHLMUTH HANS-DIETER , KIENMAYER CHRISTOPH
IPC: H03K17/691 , H03K17/693 , H03K5/135
Abstract: An integrated circuit (100) with a multiplexer comprises a data circuit with input (101,106) and an output (124) connections, a clock signal circuit with at least one input (136) and a transformer (111) configured to galvanically couple the data and clock circuits. The clock signal controls the data signal circuit.
-
公开(公告)号:DE102004040973A1
公开(公告)日:2006-03-02
申请号:DE102004040973
申请日:2004-08-24
Applicant: INFINEON TECHNOLOGIES AG
Inventor: TIEBOUT MARC , STREIBL MARTIN , KIENMAYER CHRISTOPH
Abstract: One aspect is an integrated circuit arrangement. The arrangement includes a first terminal, which can be brought to a first supply potential, a second terminal, which can be brought to a second supply potential, and a supply potential path formed between the first terminal and the second terminal. There is an electrostatic discharge element at least in the supply potential path. There is a signal input pad, to which an input signal can be applied and a signal output, at an output signal can be provided. A first inductance is arranged between the signal input pad and the signal output, and a second inductance is arranged between the signal output and the first terminal.
-
公开(公告)号:DE102006023123A1
公开(公告)日:2007-01-11
申请号:DE102006023123
申请日:2006-05-16
Applicant: INFINEON TECHNOLOGIES AG
Inventor: BEER GOTTFRIED , SIMBUERGER WERNER , KIENMAYER CHRISTOPH , PRESSEL KLAUS
IPC: H01L25/04 , G01S7/03 , H01L23/36 , H01L23/498 , H01L23/66 , H01L49/02 , H01P3/08 , H01P11/00 , H01Q1/38
Abstract: A semiconductor module with components (6) for high-frequency operation in a plastic housing comprises a main surface (8) on top of a housing mass (10) and at least one active side (11) of a semiconductor chip with a multilayer connection rail structure (13) on the main surface comprising alternating insulation (16,17) and structured metal (14,15) layers. At least one of the insulation and/or housing mass comprises a highest frequency isolation region. Independent claims are also included for the following: (A) A module as above having a cooling body; (B) Production processes for the modules as above; (C) Distance-determining radar for a motor vehicle; (D) Satellite navigation apparatus; (E) A transponder;and (F) A motor vehicle comprising the above.
-
公开(公告)号:DE102004013953A1
公开(公告)日:2005-10-20
申请号:DE102004013953
申请日:2004-03-22
Applicant: INFINEON TECHNOLOGIES AG
Inventor: KIENMAYER CHRISTOPH , TIEBOUT MARC
Abstract: An integrated amplifier has a resonant circuit with a tuneable center frequency, in which the resonant circuit has at least one coil and at least one varactor for varying a resonant frequency of the resonant circuit.
-
-
-
-
-
-