APPARATUS FOR CLEANING SUBSTRATE USING MEGASONIC POWER

    公开(公告)号:IL190454A

    公开(公告)日:2011-12-29

    申请号:IL19045408

    申请日:2008-03-26

    Abstract: A manifold for use in preparing a surface of a substrate, comprising: the manifold defined by a head that includes, a first portion in the manifold having a plurality of conduits to deliver a first fluid onto the surface of the substrate and a plurality of conduits for removing the first fluid from the surface of the substrate to define a first process window in the first portion of the manifold, a first fluid meniscus configured to be maintained in the first process window of the manifold; and a second portion in the manifold having a plurality of conduits to deliver a second fluid onto the surface of the substrate and a plurality of conduits for removing the second fluid from the surface of the substrate to define a second process window in the second portion of the manifold, a second fluid meniscus configured to be maintained in the second process window of the manifold; wherein the head is operable to be placed in proximity to the surface of the substrate so as to orient the first process window and the second process window toward the surface of the substrate.

    SYSTEM AND METHOD FOR MODULATING FLOW THROUGH MULTIPLE PORTS IN A PROXIMITY HEAD

    公开(公告)号:MY139376A

    公开(公告)日:2009-09-30

    申请号:MYPI20054607

    申请日:2005-09-29

    Applicant: LAM RES CORP

    Abstract: 36 SVSTENI AND METHOD FOR MODULATING FLOW THROUGH MULTIPLE PORTS IN A PROXIMITY HEAD ABSL'RAC'L'OI.-'NIE DLSCI,OSURE A METHOD OFF'ORMINT.; A DYLLAILLIC I IQUID MENISCUS INCLUDES FORTILING A MENISCUS AT IT FIRST SIZE, THE MENISCUS BEING FONIWD BETWEEN A PIOXIMITY HEAD AND IT FIRST SURT'ACE AND CHANGING THE MENISCUS TO IT SCCOLLD SIZE BV IIICILILILL11111@ J HOW 1111OLIGH LA ICZISI OLLE ORA SET (IF POLLS OLL THE PROXIMITY HEND. A SYSTEM 1`01 111OLILIII161117 FLOW THROUGH THE 10 PORIS IN IT PROXIMITY LICAD IS OLSO DESCIIBED. A"'340 301 WI /05-

    METHOD AND APPARATUS FOR DRYING SEMICONDUCTOR WAFER SURFACES USING A PLURALITY OF INLETS AND OUTLETS HELD IN CLOSE PROXIMITY TO THE WAFER SURFACES

    公开(公告)号:AU2003277212A1

    公开(公告)日:2004-04-19

    申请号:AU2003277212

    申请日:2003-09-30

    Applicant: LAM RES CORP

    Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.

    30.
    发明专利
    未知

    公开(公告)号:DE60314508T2

    公开(公告)日:2008-02-21

    申请号:DE60314508

    申请日:2003-09-30

    Applicant: LAM RES CORP

    Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.

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