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公开(公告)号:IL209736A
公开(公告)日:2011-12-29
申请号:IL20973610
申请日:2010-12-02
Applicant: LAM RES CORP , LARIOS JOHN M DE , GARCIA JAMES P , WOODS CARL A , RAVKIN MICHAEL , REDEKER FRED C
Inventor: LARIOS JOHN M DE , GARCIA JAMES P , WOODS CARL A , RAVKIN MICHAEL , REDEKER FRED C
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公开(公告)号:IL190454A
公开(公告)日:2011-12-29
申请号:IL19045408
申请日:2008-03-26
Applicant: LAM RES CORP , LARIOS JOHN M DE , GARCIA JAMES P , WOODS CARL A , RAVKIN MICHAEL , REDEKER FRITZ , BOYD JOHN , NICKHOU AFSHIN
Inventor: LARIOS JOHN M DE , GARCIA JAMES P , WOODS CARL A , RAVKIN MICHAEL , REDEKER FRITZ , BOYD JOHN , NICKHOU AFSHIN
Abstract: A manifold for use in preparing a surface of a substrate, comprising: the manifold defined by a head that includes, a first portion in the manifold having a plurality of conduits to deliver a first fluid onto the surface of the substrate and a plurality of conduits for removing the first fluid from the surface of the substrate to define a first process window in the first portion of the manifold, a first fluid meniscus configured to be maintained in the first process window of the manifold; and a second portion in the manifold having a plurality of conduits to deliver a second fluid onto the surface of the substrate and a plurality of conduits for removing the second fluid from the surface of the substrate to define a second process window in the second portion of the manifold, a second fluid meniscus configured to be maintained in the second process window of the manifold; wherein the head is operable to be placed in proximity to the surface of the substrate so as to orient the first process window and the second process window toward the surface of the substrate.
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公开(公告)号:MY139376A
公开(公告)日:2009-09-30
申请号:MYPI20054607
申请日:2005-09-29
Applicant: LAM RES CORP
Inventor: GARCIA JAMES P , REDEKER FRED C , JOHN DE LARIOS
Abstract: 36 SVSTENI AND METHOD FOR MODULATING FLOW THROUGH MULTIPLE PORTS IN A PROXIMITY HEAD ABSL'RAC'L'OI.-'NIE DLSCI,OSURE A METHOD OFF'ORMINT.; A DYLLAILLIC I IQUID MENISCUS INCLUDES FORTILING A MENISCUS AT IT FIRST SIZE, THE MENISCUS BEING FONIWD BETWEEN A PIOXIMITY HEAD AND IT FIRST SURT'ACE AND CHANGING THE MENISCUS TO IT SCCOLLD SIZE BV IIICILILILL11111@ J HOW 1111OLIGH LA ICZISI OLLE ORA SET (IF POLLS OLL THE PROXIMITY HEND. A SYSTEM 1`01 111OLILIII161117 FLOW THROUGH THE 10 PORIS IN IT PROXIMITY LICAD IS OLSO DESCIIBED. A"'340 301 WI /05-
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公开(公告)号:AU2003277212A1
公开(公告)日:2004-04-19
申请号:AU2003277212
申请日:2003-09-30
Applicant: LAM RES CORP
Inventor: WOODS CARL , RAVKIN MIKE , REDEKER FRITZ , BOYD JOHN , NICKHOU AFSHIN , LARIOS JOHN M DE , GARCIA JAMES P
IPC: H01L21/00
Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.
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公开(公告)号:AU2003277185A1
公开(公告)日:2004-04-19
申请号:AU2003277185
申请日:2003-09-30
Applicant: LAM RES CORP
Inventor: RAVKIN MIKE , REDEKER FRED C , WOODS CARL , GARCIA JAMES P , LARIOS JOHN DE
IPC: H01L21/00
Abstract: An apparatus and method for processing a wafer is provided. The system and method are designed to process a surface of a wafer using a meniscus. The meniscus is controlled and is capable of being moved over the surface of the wafer to enable cleaning, rinsing, chemical processing, and drying. The apparatus can be defined using a number of configurations to enable specific processing of the wafer surface using the meniscus, and such configurations can include the use of proximity heads.
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公开(公告)号:IL209737A
公开(公告)日:2011-12-29
申请号:IL20973710
申请日:2010-12-02
Applicant: LAM RES CORP , LARIOS JOHN M DE , GARCIA JAMES P , WOODS CARL A , RAVKIN MICHAEL , REDEKER FRED C
Inventor: LARIOS JOHN M DE , GARCIA JAMES P , WOODS CARL A , RAVKIN MICHAEL , REDEKER FRED C
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27.
公开(公告)号:PL208010B1
公开(公告)日:2011-03-31
申请号:PL37385703
申请日:2003-09-30
Applicant: LAM RES CORP
Inventor: WOODS CARL , GARCIA JAMES P , DE LARIOS JOHN , RAVKIN MIKE , REDEKER FRED C , NICKHOU AFSHIN
IPC: H01L21/00
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公开(公告)号:SG140470A1
公开(公告)日:2008-03-28
申请号:SG2006030670
申请日:2003-09-30
Applicant: LAM RES CORP
Inventor: WOODS CARL , GARCIA JAMES P , DE LARIOS JOHN , RAVKIN MIKE , REDEKER FRED C
Abstract: System for Substrate Processing, with Meniscus, Vacuum, IPA vapor, Drying Manifold An apparatus and method for processing a wafer is provided. The system and method are designed to process a surface of a wafer using a meniscus. The meniscus is controlled and is capable of being moved over the surface of the wafer to enable cleaning, rinsing, chemical processing, and drying. The apparatus can be defined using a number of configurations to enable specific processing of the wafer surface using the meniscus, and such configurations can include the use of proximity heads.
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公开(公告)号:SG140469A1
公开(公告)日:2008-03-28
申请号:SG2006030597
申请日:2003-09-30
Applicant: LAM RES CORP
Inventor: WOODS CARL , GARCIA JAMES P , DE LARIOS JOHN , RAVKIN MIKE , REDEKER FRED C
Abstract: System for Substrate Processing with Meniscus, Vacuum, IPA vapor, Drying Manifold An apparatus and method for processing a wafer is provided. The system and method are designed to process a surface of a wafer using a meniscus. The meniscus is controlled and is capable of being moved over the surface of the wafer to enable cleaning, rinsing, chemical processing, and drying. The apparatus can be defined using a number of configurations to enable specific processing of the wafer surface using the meniscus, and such configurations can include the use of proximity heads.
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公开(公告)号:DE60314508T2
公开(公告)日:2008-02-21
申请号:DE60314508
申请日:2003-09-30
Applicant: LAM RES CORP
Inventor: DE LARIOS JOHN M , GARCIA JAMES P , WOODS CARL , RAVKIN MIKE , REDEKER FRITZ , BOYD JOHN , NICKHOU AFSHIN
IPC: H01L21/00
Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.
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