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公开(公告)号:ITMI20120912A1
公开(公告)日:2013-11-26
申请号:ITMI20120912
申请日:2012-05-25
Applicant: ST MICROELECTRONICS SRL
Inventor: MURARI BRUNO , PAGANI ALBERTO , RICOTTI GIULIO , RONCHI MARCO , ZIGLIOLI FEDERICO GIOVANNI
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公开(公告)号:IT1403612B1
公开(公告)日:2013-10-31
申请号:ITMI20102365
申请日:2010-12-22
Applicant: ST MICROELECTRONICS SRL
Inventor: MURARI BRUNO , PAGANI ALBERTO
IPC: G01N27/20
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公开(公告)号:ITMI20102365A1
公开(公告)日:2012-06-23
申请号:ITMI20102365
申请日:2010-12-22
Applicant: ST MICROELECTRONICS SRL
Inventor: MURARI BRUNO , PAGANI ALBERTO
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公开(公告)号:ITTO20070326A1
公开(公告)日:2008-11-12
申请号:ITTO20070326
申请日:2007-05-11
Applicant: ST MICROELECTRONICS SRL
Inventor: MASTROMATTEO UBALDO , MURARI BRUNO , RICOTTI GIULIO
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公开(公告)号:DE69918551D1
公开(公告)日:2004-08-12
申请号:DE69918551
申请日:1999-09-17
Applicant: ST MICROELECTRONICS SRL
Inventor: MURARI BRUNO , MASTROMATTEO UBALDO , VIGNA BENEDETTO
Abstract: A method for the electrical and/or mechanical interconnection of components of a microelectronic system comprising at least one first component (5a, 5b; 50a-50d, 51a-51d; 70) and one second component (2; 71), provides for the formation of at least one local Joule-effect micro-heater (R) incorporated in one of the first and second components at a respective soldering point between the first component and the second component, and for the supply of electrical energy (V, 13a, 13b) to the micro-heater so as to utilize the heat produced by the micro-heater by the Joule effect to solder the first and second components at the soldering point.
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公开(公告)号:DE69816713D1
公开(公告)日:2003-09-04
申请号:DE69816713
申请日:1998-05-22
Applicant: ST MICROELECTRONICS SRL
Inventor: SAX HERBERT , MURARI BRUNO , VILLA FLAVIO , VIGNA BENEDETTO , FERRARI PAOLO
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公开(公告)号:DE69421923D1
公开(公告)日:2000-01-05
申请号:DE69421923
申请日:1994-09-30
Applicant: ST MICROELECTRONICS SRL
Inventor: DEGLI ANTONI GIOVANNI , BISIANI ROBERTO , MURARI BRUNO
IPC: B60R25/04
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公开(公告)号:ITUB20159380A1
公开(公告)日:2017-06-17
申请号:ITUB20159380
申请日:2015-12-17
Applicant: ST MICROELECTRONICS SRL
Inventor: PAGANI ALBERTO , ZIGLIOLI FEDERICO GIOVANNI , MURARI BRUNO
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公开(公告)号:DE69737262T2
公开(公告)日:2007-11-08
申请号:DE69737262
申请日:1997-11-26
Applicant: ST MICROELECTRONICS SRL
Inventor: MASTROMATTEO UBALDO , MURARI BRUNO
IPC: H01L21/74 , H01L23/52 , H01L21/3205 , H01L21/768 , H01L23/48
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公开(公告)号:DE60217059D1
公开(公告)日:2007-02-08
申请号:DE60217059
申请日:2002-02-18
Applicant: ST MICROELECTRONICS SRL
Inventor: CASATI PAOLO , MAIERNA AMEDEO , MURARI BRUNO
IPC: H01L23/495 , H01L23/433 , H01L23/552
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