25.
    发明专利
    未知

    公开(公告)号:DE69918551D1

    公开(公告)日:2004-08-12

    申请号:DE69918551

    申请日:1999-09-17

    Abstract: A method for the electrical and/or mechanical interconnection of components of a microelectronic system comprising at least one first component (5a, 5b; 50a-50d, 51a-51d; 70) and one second component (2; 71), provides for the formation of at least one local Joule-effect micro-heater (R) incorporated in one of the first and second components at a respective soldering point between the first component and the second component, and for the supply of electrical energy (V, 13a, 13b) to the micro-heater so as to utilize the heat produced by the micro-heater by the Joule effect to solder the first and second components at the soldering point.

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