Abstract:
A MOS technology power device comprises a plurality of elementary functional units, each elementary functional unit comprising a body region (3) of a first conductivity type formed in a semiconductor material layer (2) of a second conductivity type having a first resistivity value. Under each body region (3) a respective lightly doped region (20) of the second conductivity type is provided having a second resistivity value higher than said first resistivity value.
Abstract:
Power electronic MOS device of the type comprising a plurality of elementary power MOS transistors (2) and a gate structure (12) comprising a plurality of conductive strips (8) realised with a first conductive material such as polysilicon, a plurality of gate fingers or metallic tracks (11) connected to a gate pad (30) and at least a connection layer (20) arranged in series to at least one of said conductive strip (8). Such gate structure (12) comprising at least a plurality of independent islands (10) formed on the upper surface (9) of the conductive strips (8) and suitably formed on the connection layers (20). Said islands (10) being realised with at least one second conductive material such as silicide.
Abstract:
A MOS technology power device comprises: a semiconductor material layer (2) of a first conductivity type; a conductive insulated gate layer (7,8,9) covering the semiconductor material layer (2); a plurality of elementary functional units, each elementary functional unit comprising a body region (3) of a second conductivity type formed in the semiconductor material layer (2), the body region (3) having the form of an elongated body stripe, each elementary functional unit further comprising an elongated window (12) in the insulated gate layer (7,8,9) extending above the elongated body stripe (3). Each body stripe (3) includes at least one source portion (60;61;62) doped with dopants of the first conductivity type, intercalated with a body portion (40;41;3') of the body stripe (3) wherein no dopant of the first conductivity type are provided. The conductive insulated gate layer (7,8,9) comprises a first insulating material layer (7) placed above the semiconductor material layer (2), a conductive material layer (8) placed above the first insulating material layer (7), and a second insulating material layer (9) placed above the conductive material layer (8). Insulating material sidewall spacers (13) are provided to seal edges of the elongated window (12) in the insulated gate layer (7,8,9).
Abstract:
A MOS power device having: a body (10); gate regions (34) on top of the body (10) and delimiting therebetween a window (40); a body region (35), extending in the body underneath the window; a source region (36), extending inside the body region (35) throughout the width of the window; body contact regions (43), extending through the source region up to the body region; source contact regions (46), extending inside the source region, at the sides of the body contact regions; a dielectric region (41) on top of the source region; openings (42, 45) traversing the dielectric region on top of the body and source contact regions (43, 46); and a metal region (50) extending above the dielectric region (41) and through the first and second openings (42, 45).
Abstract:
A MOS technology power device comprises a plurality of elementary functional units which contribute for respective fractions to an overall current of the power device and which are formed in a semiconductor material layer (2) of a first conductivity type. Each elementary functional unit comprises a body region (3) of a second conductivity type formed in the semiconductor material layer (2), the body region (3) having the form of a body stripe (3) elongated in a longitudinal direction on a surface of the semiconductor material layer (2). Each body stripe (3) includes at least one source portion (60) doped with dopants of the first conductivity type which is intercalated with a body portion (40) of the body stripe (3) wherein no dopants of the first conductivity type are provided.
Abstract:
An electronic semiconductor device (20) with a control electrode (19) consisting of self-aligned polycrystalline silicon (4) and silicide (12), of the type in which said control electrode (19) is formed above a portion (1) of semiconductor material which accommodates active areas (9) of the device (20) laterally with respect to the electrode, has the active areas (9) at least partially protected by an oxide layer (10) while the silicide layer (12) is obtained by means of direct reaction between a metal film deposited on the polycrystalline silicon (4) and on the oxide layer (10).